DD is just one part of the yield concept nowadays.
Care to explain? Others may not agree with you. DD need not refer strictly to physical defects, but the number used in modeling to predict yield based on data gathered from some high volume process monitor. It should include all failure modes which are screened at sort. Based on that, I have referred to.25d/cm2 as a baseline for world class. I'm not saying Intel or anyone else actually achieves this but if they claim to then this should be the measure. What is your opinion?
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