Replies to post #7782 on Integral Technologies Inc. (fka ITKG)

[Steve85]

New US Patent Application: 3D Printing using Electriplast, application from Modumetal Company in Seattle WA

USPTO 20170191177A1 - Methods of Preparing Articles By Electrodeposition and Additive Manufacturing Processes

This is an application for using Electriplast that is new to me, looks like a great application in reducing corrosion and increasing strength and modulus of existing metal alloys. Electriplast mentioned as being used in Paragraph 48.

More proof of concept and adoption of Electriplast. Makes you wonder how many other companies are using EP that we don't even know about yet.