I assume two lines because of bulk/SOI. The extra cleanroom is needed for 90nm tools. I heard they are even bigger and maybe more of them are needed to keep the number of wafer starts the same.
What AMD normally does different than Intel is they switch the bulk of their manufacturing over to a new process in one or two quarters. Intel takes a year and a half for the same switch. Is this maybe what you meant?
They will phase out the 130nm bulk process (and I think SOI too) very quickly. I assume something like: "Here goes the last 130nm wafer and the next is already 90nm". ;)
The 130nm masking tools still can be used for the not so fine structures in the upper layers.
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