Pretty interesting Patent here, looks like ASTI is still very active in the R&D field. Having a quick look at the patent, looks like this relates to a multilayer approach that allows for a stress-balanced back formed using a dielectric film on the back side of the polymer substrate. So two or more different metals in the back contact used to replace the prior Mo film deposited onto both sides of the high-temperature polymeric substrate. Stress balancing is achieved ==> flat material better suited for mass production processes. What this all means is greater current allowed and 5% boost in power output (resulting in 1% point gain in efficiency overall). Lower Mo use also allows for reduced back contact cost or to put it in another way more efficient panels w/ higher outputs at lower costs. Pretty neat I would say (though won't help shareholder's pain in the short term).
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