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Sunday, February 05, 2006 1:45:22 PM
http://www.eetimes.com/news/design/products/showArticle.jhtml?articleID=178601138
"SAN FRANCISCO — Semiconductor equipment giant KLA-Tencor Corp. Thursday (Feb. 2) rolled out the eS32, an extension of its e-beam inspection platform targeted for the 65- and 45-nanometer nodes, calling it a "cornerstone" of the company's suite of next-generation inspection solutions.
According to KLA-Tencor (San Jose, Calif.), the eS32 enables the industry's widest capture of subtle electrical and small physical defects, which are arising as chip makers integrate new materials and device architectures in production. The eS32 sets new performance standards with advanced features and capabilities that accelerate the detection and resolution of systematic, yield-limiting defects in both front- and back-end-of-line applications, the company said.
With the fast feedback provided by e-beam inspection, KLA-Tencor said, logic manufacturers can identify and overcome front-end-of-line issues in integrating nickel silicide and strained silicon into their devices. The eS32 is architected to meet the yield challenges that chip makers are likely to encounter as they innovate to address device speed and power consumption concerns, the company said...
...KLA-Tencor said volume shipments of the eS32 are already underway. Pricing information was not disclosed."
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