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Wednesday, 09/04/2013 12:52:48 PM

Wednesday, September 04, 2013 12:52:48 PM

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From New SoCs to Optical Fiber, Intel Delivers Cloud-Optimized Innovations
Across Network, Storage, Microservers, and Rack Designs
NEWS HIGHLIGHTS
* The Intel Atom C2000 processor family is the first based on Silvermont
micro-architecture, has 13 customized configurations and is aimed at
microservers, entry-level networking and cold storage.
* New 64-bit, system-on-chip family for the datacenter delivers up to six times1
the energy efficiency and up to seven times2 the performance compared to
previous generation.
* The first live demonstration of a Rack Scale Architecture-based system with
high-speed Intel Silicon Photonics components including a new MXC connector and
ClearCurve* optical fiber developed in collaboration with Corning*, enabling
data transfers speeds up to 1.6 terabits4 per second at distances up to 300
meters5 for greater rack density.
SAN FRANCISCO--(Business Wire)--
Intel Corporation today introduced a portfolio of datacenter products and
technologies for cloud service providers looking to drive greater efficiency and
flexibility into their infrastructure to support a growing demand for new
services and future innovation.
Server, network and storage infrastructure is evolving to better suit an
increasingly diverse set of lightweight workloads, creating the emergence of
microserver, cold storage and entry networking segments. By optimizing
technologies for specific workloads, Intel will help cloud providers
significantly increase utilization, drive down costs and provide compelling and
consistent experiences to consumers and businesses.
The portfolio includes the second generation 64-bit Intel Atom C2000 product
family of system-on-chip (SoC) designs for microservers and cold storage
platforms (code named "Avoton") and for entry networking platforms (code named
"Rangeley"). These new SoCs are the company`s first products based on the
Silvermont micro-architecture, the new design in its leading 22nm Tri-Gate SoC
process delivering significant increases in performance and energy efficiency,
and arrives only nine months after the previous generation.
"As the world becomes more and more mobile, the pressure to support billions of
devices and users is changing the very composition of datacenters," said Diane
Bryant, senior vice president and general manager of the Datacenter and
Connected Systems Group at Intel. "From leadership in silicon and SoC design to
rack architecture and software enabling, Intel is providing the key innovations
that original equipment manufacturers, telecommunications equipment makers and
cloud service providers require to build the datacenters of the future."
Intel also introduced the Intel? Ethernet Switch FM5224 silicon which, when
combined with the WindRiver Open Network Software suite, brings Software Defined
Networking (SDN) solutions to servers for improved density and lower power.
Intel also demonstrated the first operational Intel Rack Scale Architecture
(RSA)-based rack with Intel Silicon Photonics Technology in combination with the
disclosure of a new MXC connector and ClearCurve* optical fiber developed by
Corning* with requirements from Intel. This demonstration highlights the speed
with which Intel and the industry are moving from concept to functionality.
Customized, Optimized Intel Atom SoCs for New and Existing Market Segments
Manufactured using Intel`s leading 22nm process technology, the new Intel Atom
C2000 product family features up to eight cores, a range of 6 to 20Watts TDP,
integrated Ethernet and support for up to 64 gigabytes (GB) of memory, eight
times the previous generation. OVH* and 1&1, leading global web-hosting services
companies, have tested Intel Atom C2000 SoCs and plan to deploy them in its
entry-level dedicated hosting services next quarter. The 22 nanometer process
technology delivers superior performance and performance per watt.
Intel is delivering 13 specific models with customized features and accelerators
that are optimized for particular lightweight workloads such as entry dedicated
hosting, distributed memory caching, static web serving and content delivery to
ensure greater efficiency. The designs allow Intel to expand into new markets
like cold storage and entry-level networking.
For example, the new Intel Atom configurations for entry networking address the
specialized needs for securing and routing Internet traffic more efficiently.
The product features a set of hardware accelerators called Intel QuickAssist
Technology that improves cryptographic performance. They are ideally suited for
routers and security appliances.
By consolidating three communications workloads - application, control and
packet processing - on a common platform, providers now have tremendous
flexibility. They will be able to meet the changing network demands while adding
performance, reducing costs and improving time-to-market.
Ericsson, a world-leading provider of communications technology and services
announced that its blade-based switches used in the Ericsson Cloud System, a
solution which enables service providers to add cloud capabilities to their
existing networks, will soon include the Intel Atom C2000 SoC product family.
Microserver-Optimized Switch for Software Defined Networking
Network solutions that manage data traffic across microservers can significantly
impact the performance and density of the system. The unique combination of the
Intel Ethernet Switch FM5224 silicon and the WindRiver Open Network Software
suite will enable the industry`s first 2.5GbE, high-density, low latency, SDN
Ethernet switch solutions specifically developed for microservers. The solution
enhances system level innovation, and complements the integrated Intel Ethernet
controller within the Intel Atom C2000 processor. Together, they can be used to
create SDN solutions for the datacenter.
Switches using the new Intel Ethernet Switch FM5224 silicon can connect up to 64
microservers, providing up to 30 percent3 higher node density. They are based on
Intel Open Network Platform reference design announced earlier this year.
First Demonstration of Silicon Photonics-Powered Rack
Maximum datacenter efficiency requires innovation at the silicon, system and
rack level. Intel`s RSA design helps industry partners to re-architect
datacenters for modularity of components (storage, CPU, memory, network) at the
rack level. It provides the ability to provision or logically compose resources
based on application specific workload requirements. Intel RSA also will allow
for the easier replacement and configuration of components when deploying cloud
computing, storage and networking resources.
Intel today demonstrated the first operational RSA-based rack equipped with the
newly announced Intel Atom C2000 processors, Intel Xeon processors, a
top-of-rack Intel SDN-enabled switch and Intel Silicon Photonics Technology. As
part of the demonstration, Intel also disclosed the new MXC connector and
ClearCurve* fiber technology developed by Corning* with requirements from Intel.
The fiber connections are specifically designed to work with Intel Silicon
Photonics components.
The collaboration underscores the tremendous need for high-speed bandwidth
within datacenters. By sending photons over a thin optical fiber instead of
electrical signals over a copper cable, the new technologies are capable of
transferring massive amounts of data at unprecedented speeds over greater
distances. The transfers can be as fast as 1.6 terabits per second4 at lengths
up to 300 meters5 throughout the datacenter.
To highlight the growing range of Intel RSA implementations, Microsoft and Intel
announced a collaboration to innovate on Microsoft`s next-generation RSA rack
design. The goal is to bring even better utilization, economics and flexibility
to Microsoft`s datacenters.
The Intel Atom C2000 product family is shipping to customers now with more than
50 designs for microservers, cold storage and networking. The products are
expected to be available in the coming months from vendors including Advantech*,
Dell*, Ericsson*, HP*, NEC*, Newisys*, Penguin Computing*, Portwell*, Quanta*,
Supermicro*, WiWynn*, ZNYX Networks*.
More information on the announcements including Diane Bryant`s presentation,
additional documents and pictures are available at
http://newsroom.intel.com/docs/DOC-4267.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company
designs and builds the essential technologies that serve as the foundation for
the world`s computing devices. Additional information about Intel is available
at newsroom.intel.com and blogs.intel.com.
Intel, Atom, Xeon and the Intel logo are trademarks of Intel Corporation in the
United States and other countries.
* Other names and brands may be claimed as the property of others.
Software and workloads used in performance tests may have been optimized for
performance only on Intel microprocessors. Performance tests, such as SYSmark
and MobileMark, are measured using specific computer systems, components,
software, operations and functions. Any change to any of those factors may cause
the results to vary. You should consult other information and performance tests
to assist you in fully evaluating your contemplated purchases, including the
performance of that product when combined with other products. For more
information go to http://www.intel.com/performance.
1 Performance based on Dynamic Web Benchmark Performance: Atom S1260 (8GB, SSD,
1GbE), Score=1522. Atom C2750(32GB, SSD,10GbE), Score=11351.
2 Performance per Watt based on Dynamic Web Benchmark: Atom S1260 (8GB,SSD,
1GbE), Score=1522, est node power=20W, PPW=76.1 Atom C2730(32GB, SSD,10GbE),
Score=8778, est node power=19W, PPW=462. Source: Intel Internal measurements as
of August 2013. Refer to backup for additional details.
3 Based on 2.5G port count compared to the BCM56540
4 Measured per fiber bandwidth on an Agilent Bit Error Rate Tester (BERT) that
included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32
error detector. MXC connector used had 32 fibers for an actual data rate of .8
tera-bits. Mechanical models and CAD simulations show that the MXC can
accommodate up to 64 fibers for a theoretical total bandwidth of 1.6 Tera-bits
per second.
5 ClearCurve fiber operating at 300 meters was tested using 300 meters of new
ClearCurve fiber connected to an Agilent Bit Error Rate Tester (BERT) that
included a N4960A-CJ1 controller, N4951A-H32 pattern generator and N4952A-E32
error detector.
Results have been estimated based on internal Intel analysis and are provided
for informational purposes only. Any difference in system hardware or software
design or configuration may affect actual performance.
Intel's compilers may or may not optimize to the same degree for non-Intel
microprocessors for optimizations that are not unique to Intel microprocessors.
These optimizations include SSE2, SSE3, and SSE3 instruction sets and other
optimizations. Intel does not guarantee the availability, functionality, or
effectiveness of any optimization on microprocessors not manufactured by Intel.
Microprocessor-dependent optimizations in this product are intended for use with
Intel microprocessors. Certain optimizations not specific to Intel
microarchitecture are reserved for Intel microprocessors. Please refer to the
applicable product User and Reference Guides for more information regarding the
specific instruction sets covered by this notice.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS
AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE
OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the
Intel Product could result, directly or indirectly, in personal injury or death.
SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL
APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES,
SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF
EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE
ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT
LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION
CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN
THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time,
without notice. Designers must not rely on the absence or characteristics of any
features or instructions marked "reserved" or "undefined". Intel reserves these
for future definition and shall have no responsibility whatsoever for conflicts
or incompatibilities arising from future changes to them. The information here
is subject to change without notice. Do not finalize a design with this
information.
The products described in this document may contain design defects or errors
known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
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