Intel Corp (INTC)

[Elmer Phud]

Spokeshave, it would help if you provided a link.

I realize you misread the date, but this stepping release is normal. For your information, Intel has a number of steppings in the works as we type. I know of 4 in production right now and as many in varying stages of qualification. All address different issues but improved binsplit is usually common to all of them. Some are simply a metal routing change to improve speed. Those don't require notification to customers because there's no logic or specification change. Others may be to accomodate a different package. Some are a full mask layer change to take advantage of process improvements and some may be only to improve ESD protection. Some may fix errata. Still others may be for reasons that might be discussed at a later date.

EP