Sierra Resource Group Inc. (fka SIRG)

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SEMICONDUCTOR TECHNOLOGY USES COPPER

Combination of packaging technology expertise and manufacturing strength bring performance, reliability and cost advantages over gold wire

DALLAS, May 23, 2012 /PRNewswire/ -- Texas Instruments Incorporated (NASDAQ: TXN) (TI) today announced it has shipped nearly 6.5 billion units of copper wire bonding technology in its analog, embedded processing and wireless products. This milestone underscores TI's confidence in copper as a viable replacement to gold in its semiconductor product roadmaps, and the electronics industry's acceptance of the technology, due to performance, quality and reliability benefits for a range of applications.

"While the rising and fluctuating cost of gold was an original driver for making the switch to copper, the technology's overall advantages today are undeniable," said Devan Iyer, director of Semiconductor Packaging in TI's Technology & Manufacturing Group. "Copper wire bonding is delivering a performance boost to customers, and through TI's flexible internal and external manufacturing, we are able to deliver production at the same or higher levels than gold."