Microsoft, TI Combine on Wireless {samsung using}
By allNetDevices Staff
November 08, 2000
Two large companies fighting to make a mark in next-generation wireless technology, Texas Instruments (NYSE: TXN) and Microsoft (Nasdaq: MSFT), have joined forces.
The two companies said they are combining their technology in an attempt to lure wireless phone vendors to their wares. Specifically, the two companies have combined Microsoft's so-called Stinger platform, which combines telephony and handheld functionality, with TI's digital signal processor (DSP)-based GSM chipset technology.
The companies said that TI's 2.5G smart phone technology will be upgradable in the future to faster third-generation (3G) technology using the company's Open Multimedia Applications Platform (OMAP) technology.
The TI integrated chipset is sampling today, with volume production expected in the second half of next year. The Stinger has been adopted, so far, by Samsung. Separately, Microsoft and Samsung announced that wireless operator VoiceStream will make the Stinger-based phone available to future GPRS customers in the U.S.
Stinger competes with other platforms such as Symbian's Quartz platform, which also provides both handheld and wireless voice capabilities.
