Intel Corp (INTC)

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Elmer, Re: "The resulting defect densities for a large die (Pentium 4 size of 146mm2 is assumed) are approximately 0.2 to 0.3 for the IDMs and 1 to 2 for the foundries."

That's insane. Using the die calculator from the same website, I see that a 146mm^2 die would get more than 4x as many good die per wafer from Intel than from a foundry process. That may be the case using their generalized process, as also described in that link, but I thought that AMD was working with UMC to create a more specialized process just for the Athlon core. If that is true, then AMD may not suffer such a huge yield penalty. We'll have to see how it turns out, but I had no idea that a foundry's generalized process was so low in performance.

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