Intel Corp (INTC)

[SemiconEng]

Indeed, when I was at Intel the WW marking was applied at the assembly plant, naturally enough. Now that assembly and test are usually in the same place, with finished units drop-shipped directly to box makers, why would anyone find it surprising that a WW39-marked part could be at a box maker by WW40?
--Tim May

Depends, WW39 is 7 days long. Where these parts made at the beginning of WW39, the middle, or the end? I can't tell, can you? It also depends on where the Boxmaker is. Most parts that I know of are not "Drop Shipped", to arrive at a boxmaker less than 1 week later, as that is the most expensive way. Unless of course you're desperate.

Question, Where do you get the information that "assembly and test are usually in the same place"? Maybe it is, maybe it isn't. Is that the way AMD does it? Certainly Wafer Sort is now attached to the Fab, so that Poor Bin information can be quickly fed back to the Fab, but most Assembly that I know of, is done in Malaysia or the Philippines. I haven't heard of too many Wafer Fabs in those locations. Do you have contrary information? I guess what you're saying is possible (shrug), but it's not how I've seen it done....... Recently.

Semi