Transmeta (Semiconductor) (TMTA)

[weaksidehelp]

Bird, 12in wafers sure increase die count.

Thanks for the info from TSMC:

"We are ramping up out Fab 12 (phase I now. We expect monthly output will be around 13k 12" wafers per month by end of 2002. Besides, you are right the designed ultimate monthly output is around 25k/month. Thanks,"

I got to wondering how many die can be cut from a 12 inch wafer, with die having the dimensions of the TM5800 (55mm2). There is a handy handy utility program to calculate die count from wafers at

http://www.geek.com/procspec/software/wafer/wafer.htm

Inputing 7.42mm as the dimension for a side of the square (7.42mm x 7.42mm = 55mm2), the die count from a 12 inch (300mm) wafer is 1143! TSMC's production of 25,000 wafers per month should keep TMTA going, along with the other TSMC customers for high-end chips. 25,000 x 12 x 1143 = 342M/yr!

regards, wsh