Propalms, Inc. and Hong Kong Distributor to Sponsor and Exhibit At 5th Annual Banking and Finance Technology Forum Asia 2009
MALTON, England, March 3, 2009 (GLOBE NEWSWIRE) -- Propalms, Inc. (OTCBB:PRPM) is pleased to announce that the Company and its Hong Kong distributor Jump-In (HK) Ltd. are going to sponsor and exhibit at the 5th Annual Banking and Finance Technology Forum Asia 2009 being held at the Hong Kong Convention and Exhibit Center on March 17, 2009. Propalms and Jump-In will be sponsoring the event along with Microsoft, Hewlett Packard, Bell Integrator, amongst others. Propalms will have the opportunity to market its product line to key banking executives from around the world who are attending the forum looking to achieve better stability for their financial institutions through innovative technology and risk management strategies.
With more than 250 delegates and ten exhibitors at the one day event, The Banking and Finance Technology Forum Asia brings together financial technology executives from across the region to actively participate in discussions shaping the mobile banking industry, as well as effective risk management strategies in the face of the recent economic downturn. Coming into its fifth year, the annual Banking and Finance Technology Forum continues to be Asia's premier banking and finance technology event that delivers an informative and actionable overview of issues behind new technologies in the banking and finance industries. Some of the banks and financial institutions being represented at the forum are ABN Amro NV, AIG, Allianz Global Investors, Bank of America, Bank of China, Barclays, and BNP Paribas Bank, amongst others.
"We are excited to be one of the sponsors and exhibitors at the 5th Annual Banking and Finance Technology Forum Asia. Propalms and our Hong Kong based distributor Jump-In have a unique opportunity to showcase how our products can assist the banking and financial community's operations in a more efficient and effective manner," stated Owen Dukes, CEO of Propalms, Inc.
To find out more information on the Banking and Technology Forum Asia, please visit www.bftfasia.com.
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