Advanced Micro Devices Inc (AMD)

[kpf]

doug

Then why did he say that initially, products would be 9 layer, to make for a straightforward transition from 130nm, and then new products, or re-layouts would go to 11?

The "straightforward transition" (read: plain shrink) is needed asap for GDPW-reasons to work the cost per die down which is necessary to penetrate the volume segments.

To maintain (and possibly) extend the performance lead in 2005, they need two more layers.

Reasonable to do it in two steps to get what you need when you need it.

Plus, in approaching an extremely challenging node with small and careful steps reduces complexity and by this means make results more precictable. Which is something what OEMs and tier-one custumers appreciate in these times .

From this viewpoint, I am sure the fact AMD communicates its 90nm manufacturing strategy at this time (which is very, very unusual for any semiconductor manufacturer) is a smart move. ;)

Now, looking at AMDs roadmap, I am not sure if their announced second generation 90nm process in H205 is the 11-layer-process or the 300mm process?

K.