Wednesday, March 24, 2004 7:07:44 AM
Mike seems to got some Intel response. Thats funny - isn't it?
http://www.theinquirer.net/?article=14923
(also through that way - Mike, "The Inquirer" is really
doing an amazing job - THANKS!)
(PS2: just clicked a few banners ... ) )
These are the same people, which said, that 90nm will be
launched (in mass) in '03, which said that Dothan will also
ship in 2003 ... you know all the given facts (90nm problem)
better than I'm.
My distribution line lists until today only 2,4G and 2,8G E's.
EE at 3,2 and 3,4G are not available and I was wondering why?
Yesterday we got the answer - funny that this wasn't said
"officially".
Why introduce a new 8 layer 0,13m Rev. when 90nm production
goes so smooth? Why increase costs here? What are these
3 new 300mm 90nm Intel MegaFAB's doing, when the hole process
is working so fine? I'm wondering ... is Intel really telling us
the truth? I don't have to answer.
3,6GHz - that was the origin topic. I said that already yester-
day, that in my opinion the 3,6GHz availability at the end of
Q3 seems highly unlikely but that is what I heard. I think
everyone should ask himself, whether the new LGA package could
DECREASE the voltage range which Intel is now using - otherwise
it should be very hard to hold TDP (and Max) at the given level,
when Intel is further increasing the Mhz. Furthermore I'm really
interested in end-user reports using 3,0-3,4G E's with closed
cases under warm summer conditions under a table in a not
climatized room - a infrastructure, which is normal for an end-
user. I'm really really interested in long term realibility
tests. Its not Intel failure, when case fans are not working
properly, when powersupply shut down, because the A demand is
so big or the case is full of dust, because the user is not
cleaning his closed case twice a week ...
(We will see)
BUGGI
BUGGI
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