I hate to break it to you, but TSMC wouldn't know if it "worked" or not. Nor would they care. All they would care about is ensuring the finished die meet test parameters set forth in the design. IF the design ever existed in the first place. Which it doesn't.
Your knowledge of semiconductor fabrication is about as poor as "Dr." Chen's. Or was that Chan? Doesn't matter, it's someone else, anyway.
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