Qualcomm Inc (QCOM)

[khemara_qc]

ISSCC: Qualcomm chip covers entertainment
David Manners
A versatile, navigating and games playing chip was described by Qualcomm at ISSCC 2004.

Using the stacked die approach of die-to-die bonding, with an analogue die bonded on top of a digital die, Qualcomm has made a 3G CDMA2000 1X baseband processor which supports GSM, AMPS, GPS, Bluetooth, MPEG4 video decoding, and MP3 audio decoding and has a 2D/3D graphics accelerator for games playing.

The stacked die approach gets around the problem that the analogue and digital portions scale differently, said Qualcomm, also it reduces wire lengths, I/O power and footprint.

The chip integrates a 32-bit ARM processor, two DSPs and hardware accelerators.

http://www.electronicsweekly.co.uk/issue/dailynews.asp#A5
The chip is 6.8mmx6.9mm and is made on a 0.13µ CMOS process using 27 million transistors.