JK, I share your excitement!
Those who would view this as "simply another patent update" are missing the mark. This is the first time, for example, that I have seen the patents divided into three distinct categories (the following quotes are from today's release):
1) Core Technology: these patents include composition and techniques for manufacturing ElectriPlast moldable capsules (gk's comments: this is the "grand pubah" of patents, since it's upon those compositions and techniques from which everything else flows)
2) Key Applications: these applications include antenna, heating elements, thermal management (cooling) devices, electromagnetic energy shielding and absorption devices, sparking devices, magnetic devices, conductor devices and acoustic devices. Likewise, it is seen as a replacement for metal in automotive components, airplane components and medical devices, just as an example.
3) Related Micron Conductive Fiber Technology: (and this is where it really gets exciting!) In ElectiOnix technology, excellent heating elements are formed by bundling micron conductive fiber strands. As a result, ElectiOnix heating elements exhibit very rapid heating and cooling capabilities.
In ElectriPonix technology, bundles of micron conductive fiber are coated with resin-based material to create an exceptional wiring product. ElectriPonix(TM) wiring may be in a variety of applications including power distribution, signal communication, and heating.
Hmmmmmmmmm......let's think about that for a minute: wiring for power distribution and signal communication. How BIG is that? I'll admit I can think pretty big, but that is HUGE!
While I'll be the first to admit that the company has been way too silent the first half of this year, it should likewise be noted that they are leaving us plenty of clues as to where this is eventually headed. It's not that hard to discern!
regards,
GK
