Integral Technologies Inc. (fka ITKG)

[gktignol]

sptnws,

I am not the least bit worried that they've made such a "mistake".

For your edification, please consider the following. I'll keep it as brief as possible so as not to bore you, but hopefully still maintain the integrity behind the points to be made, which are two fold:

1) We will always have competitors
2) Cool Poly's filing is for a narrow application (particular to heat sinks / shielding, verses ours, which is much broader)


Theirs:

http://patft.uspto.gov/netacgi/nph-Parser?u=%2Fnetahtml%2Fsrchnum.htm&Sect1=PTO1&Sect2=HITOF....

SUMMARY OF THE INVENTION

The present invention preserves the advantages of prior art thermally conductive plastic compositions. In addition, it provides new advantages not found in currently available compositions and overcomes many disadvantages of such currently available compositions.

The invention is generally directed to the novel and unique thermally conductive plastic composite material with particular application in heat sink applications where heat must be moved from one region to another to avoid device failure. The composite material of the present invention enables a highly thermally conductive composite material to be manufactured at relatively low cost.


Further, from the second paragraph from the bottom:

In view of the foregoing, a superior moldable highly thermally conductive composite material can be realized. The composition of the present invention, greatly improves over prior art attempts to provide such a moldable heat conductive material. In particular, the present invention, provides thermal conductivity that is vastly improved over known compositions to permit complex part geometries to achieve more efficient heat sink devices.


Ours:

http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPT....

SUMMARY OF THE INVENTION

A principle objective of the present invention is to provide an effective moldable capsule useful for molding conductive loaded resin-based articles.

A further object of the present invention is to provide a moldable capsule exhibiting optimal properties for time-releasing conductive material into the resin-based material during melting and mixing and prior to molding.

A further object of the present invention is to provide a moldable capsule wherein a ratio of conductive loaded material and resin-based material for optimal performance of the molded article is pre-formed into the moldable capsule and, particularly, wherein it is not necessary to reduce the concentration of the conductive loaded material by mixing with pure plastic pellets.

A further object of the present invention is to provide a moldable capsule comprising various types of conductive loads and various types of base resin.

A further object of the present invention is to provide a method to form a moldable capsule comprising conductive loaded resin-based material.

A further object of the present invention is to provide a method to form a moldable capsule that is easily and predictably manufactured.

A further object of the present invention is to provide a method to form a moldable capsule that is extendable to inclusion of more than one type of conductive loaded material into the capsule load.


Further, from the third paragraph from the bottom:

The advantages of the present invention may now be summarized. An effective moldable capsule useful for molding conductive loaded resin-based articles is achieved. The moldable capsule exhibits optimal properties for time-releasing conductive material into the resin-based material during melting and mixing and prior to molding. The moldable capsule comprises a ratio of conductive loaded material and resin-based material for optimal performance of the molded article, and this ratio is pre-formed into the moldable capsule. It is not necessary to reduce the concentration of the conductive loaded material by mixing with pure plastic pellets. The moldable capsule may comprise various types of conductive loads and various types of base resin. A method to form a moldable capsule comprising conductive loaded resin-based material is achieved. A method to form a moldable capsule that is easily and predictably manufactured is achieved. A method to form a moldable capsule that is extendable to inclusion of more than one type of conductive loaded material into the capsule load is achieved. Methods to manufacture articles from the moldable capsule comprising a conductive loaded resin-based material are achieved.



Someone commented that this is “just” a patent on how to make the pellets. Well, there’s a very good reason for having a "just" a patent on how to make the pellets (refer to Tom’s comments about salt and pepper mixtures, etc. in his filing). From what I understand, that is where many “wannabe’s” have tried and failed

Tom’s strategy is to secure broad patents using "doped resins" in a myriad of old and new technologies. I’m afraid some have seriously underestimated the impact of such a model, which is really quite valuable. Think about it this way for one particular application: His "strategy" is to have a patent that covers all moldable antennas made with resin doped plastic, meaning that no one can build moldable resin doped plastic antennas without talking to Integral, even if somehow they’ve come up with a new recipe themselves. The potential impact of Integral holding broad patents on components and products using "resin doped" conductive materials in every sector cannot be overestimated.

How huge is that?

We have the patents on over 120 different broad applications, which potentially can produce several thousand different products. Take, for example, Tom's claim that there are easily 1500 different uses for each and every patent (that's at least 180,000 uses over numerous market segments).

We will always have competitors. No one in manufacturing owns the whole pie. Our share of the pie will keep us happy enough.

Just keeping in mind a few things like the NPE invitation extended to Tom; the CES “Best of What’s New” award; and JARCO’s involvement keep me plenty happy while waiting for EP to make its splash in the market.

regards,
GK