Staktek Holdings Inc. (STAK)

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Staktek Announces Next-Generation, Multi-Die Packaging Technology

DSD-Pak™ Technology Delivers Superior Testability and Electrical Performance for Multi-Die Packages

Staktek Holdings, Inc. [NASDAQ: STAK], a market-leading provider of intellectual property and services for next-generation module technologies, today announced a new multi-die packaging technology platform that delivers improved testability and electrical performance compared to conventional die stacking. Applications for DSD-Pak are ranging from DDR3 multi-die DRAM to high- density Flash and heterogeneous packages including processor plus memories, controller plus memories and various combinations of logic devices.

A package constructed with DSD-Pak technology consists of one or multiple Die-Substrate-Die (DSD) sub-assemblies that are created by attaching a die to each side of a thin substrate. DSD-Pak is compatible with various established die attach technologies, including wire bonding, flip-chip and thermo-compression (TC) / thermo-sonic (TS) bonding. In addition, these sub-assemblies have vertical interconnect features that allow them to be stacked on top of each other to achieve the desired chip content for the final package. DSD-Pak can be adopted with minimal changes to the existing assembly and test infrastructure.

“System OEMs are demanding more highly integrated and thinner multi-chip packages to continue to drive form-factor and overall product innovation,” said Jan Vardaman, President and Founder TechSearch International, Inc. “Technologies like DSD-Pak are delivering significant improvements in testability and electrical performance – attributes that are getting more and more consideration when new multi-chip packaging technologies are selected by the device makers.”

“DSD-Pak is the natural extension of Staktek’s IP and know-how in high-density solutions into the area of multi-die packaging technology,” said Lee Szewerenko, Vice President of Research and Development for Staktek. “DSD-Pak delivers superior testability compared to conventional die stacking as the individual sub-assemblies can be fully tested in existing high-volume test infrastructure before being committed to the final package. In addition, DSD-Pak delivers excellent electrical performance – similar to a through-silicon via (TSV) interconnect, but with today’s devices not specifically designed for TSV.”

Staktek has demonstrated the DSD-Pak technology platform with a Flash packaging solution that accommodates eight Flash devices thinned to 70 micrometers into a single, less than 1.2mm thick package while enabling full testability for each two-die sub-assembly.

Companies interested in learning more about this technology can contact Staktek at [e-mail] or at the Memcon Conference in San Jose from July 17 through July 19, 2007.

About Staktek:

Staktek is a market-leading provider of intellectual property and services for next-generation module technologies for high-speed, high-capacity systems. Staktek's TSOP and BGA memory stacking solutions increase operational performance by doubling, tripling or quadrupling the amount of memory in the same physical footprint as required by standard packaging technologies. Staktek's ArctiCore™ is a module technology using a double-sided, multi-layer flexible circuit folded around an aluminum core and is designed for superior thermal, mechanical and electrical performance. With an IP portfolio of more than 200 patents and patent applications pending, the company offers flexibility for customers, including outsourced manufacturing, technology licensing and custom engineering. Headquartered in Austin, Texas, Staktek operates an ISO-certified manufacturing facility in Reynosa, Mexico. For more information, go to http://www.staktek.com.

Staktek is a trademark of Staktek Group LP.

Staktek Holdings, Inc.
Ulrich Hansen, 512-454-9531
Sr. Director of Business Development
[e-mail]
or
Investors:
Shelton - Investor Relations
For Staktek Holdings
Beverly Twing, 972-385-0286
[e-mail]
or
Media:
Shelton - Public Relations
For Staktek Holdings
Katie Oliver, 972-239-5119, x128
[e-mail]

Source: Business Wire (July 9, 2007 - 8:02 AM EDT)

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