Advanced Micro Devices Inc (AMD)

[kpf]

paul

Why would they want the extra packaging costs and the problems with interdie signals, when they can do it all on one die with lithography?

Because lithography is only a small fraction of the costs associated with a new process.

MCM is clearly an option if AMD will be forced to offer it before its second generation 90nm node (05/06), when dual-core dies will be creating enough volume to rectify a process. (Iaw, in case Intel would have a dual core Dothan-based Xeon offering ready next year, I expect to see that.)
I do not see a dual-core Prescott to be possible thermally, so I guess 05 will be the earliest date for dual-core CPUs. Rather based on Dothan-successor than on Tejas. And more likely on 90nm design rules than on 65nm.

K.