TI Targets Mobile Terminals with Next-Generation Bluetooth Solution
12/11/2003 - Advancing its commitment to deliver cost-effective, power-efficient Bluetooth® technology to wireless device manufacturers, Texas Instruments Incorporated (TI) [NYSE: TXN] announced its second-generation, single-chip Bluetooth solution. The BRF6150 provides full support for Bluetooth Specification Version 1.2 and leverages TI´s power management expertise to deliver the industry´s first Bluetooth solution with direct connection to the battery and power shut-down mode. This minimizes power consumption and simplifies Bluetooth integration into the device. Like the current generation BRF6100, the BRF6150 implements TI´s patented digital RF technology to provide the highest level of RF integration in pure digital CMOS process for reductions in solution size and cost.
"Building on the success of our first-generation Bluetooth solution, the BRF6150 will further enable the acceleration of Bluetooth penetration in cell phones, PDAs and other mobile devices," said Ari Rauch, general manager of TI's Short Distance Wireless Group. "Our solution is ideal for the wireless device market, offering the industry's lowest power consumption and most comprehensive and effective solution for Bluetooth/Wi-Fi interference issues."
The BRF6150 chip delivers the industry's lowest active mode power consumption. With 12mA for voice link, the chip consumes 30 percent less power than TI's closest competitor. The BRF6150's shut-down mode reduces power consumption further by powering down the chip to 6uA when it is not in use. In addition, the chip's direct connection to all available battery types eliminates the need for external voltage regulators, reducing integration requirements for mobile device manufacturers. The solution requires only 11 external components, which significantly eases electronic device design complexity.
TI's BRF6150 is certified by the Bluetooth Special Interest Group (SIG) as Bluetooth v1.2 compliant, which includes support of Adaptive Frequency Hopping (AFH) and Extended Synchronous Connection-Oriented (eSCO), for temperatures ranging from -40 degrees C to +85 degrees C. AFH is one technique used to overcome the interference problems inherent to close range 802.11b and Bluetooth operations resulting from the shared use of the 2.4 GHz band. The eSCO provides the ability to enhance voice quality by providing retransmission mechanisms.
TI's coexistence solution for collocated Bluetooth and Wi-Fi, tailored for mobile terminals, is the only coexistence solution shipping today in commercial products. The BRF6150, which utilizes AFH and eSCO, offers an upgrade to the current coexistence solution. When manufacturers combine the v1.2 compliant BRF6150 with TI's Bluetooth/Wi-Fi coexistence software package for either the TNETW1100B chipset for 802.11b or TNETW1230 solution for 802.11 a/b/g, improved coexistence performance is achieved. This results in better utilization of the 2.4GHz frequency band and solves the most demanding coexistence scenarios for simultaneous Bluetooth voice/data and high speed Wi-Fi data.
The BRF6150 integrates a Bluetooth baseband, digital RF and antenna switch in a 4.5mm x 4.5mm package, offering mobile handset designers the ability to add Bluetooth functionality in a space of 50 square millimeters. Its package also supports stacked Flash prototypes for development, which eliminates the need for external memory, saving board space and making it easier for manufacturers to update the chip´s software during the integration phase. The BRF6150 seamlessly integrates with TI´s families of OMAPTM applications processors, TCS chipsets for GSM/GPRS, WCDMA and UMTS, as well as its cdma2000 1X and CDMA 1xEV-DV solutions. The BRF6150 will also be included in future TI wireless device reference designs, making Bluetooth integration easier for manufacturers.
Texas Instruments is exhibiting at Bluetooth Americas in booth number 340. Bluetooth demos will be available.
Built on TI´s Advanced Digital RF Architecture
The BRF6150 is the second product to integrate TI´s digital radio processor technology into a single, low cost device. The digital RF capability combines TI´s years of signal processing architecture expertise with advanced process technology capability to support both digital and analog functions in high volume, low power CMOS, rather than more expensive Silicon Germanium or Gallium Arsenide processes. By moving to an integrated digital radio architecture, TI will see a smaller, lower cost die area with each process node shift and can take advantage of standard digital design tools. A digital design also enables simple modification of key RF parameters to enhance performance through software rather than system or IC redesign.
Availability
The BRF6150 is sampling to customers today with volume production expected in the second quarter of 2004. For more information on the BRF6150 see www.ti.com/bluetooth.
Texas Instruments - Making Wireless
TI is the leading manufacturer of wireless semiconductors, delivering the heart of today´s wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth and Ultra Wideband. From custom to turn-key solutions, including complete chipsets and reference designs, OMAP application processors, core digital signal processor and analog technologies built on advanced semiconductor processes, TI is making wireless personal, intelligent and seamless. Please visit TI´s wireless pressroom at www.ti.com/wirelesspressroom for additional information.
