NVIDIA has released the latest GB200 series compute systems, with significantly improved performance. These systems utilize both copper and optical interconnects, leading to much discussion in the market about the evolution of “copper” and “optical” technologies.
Current Situation: The GB200 (including the previous GH200) series is NVIDIA’s “superchip” system. Compared to traditional servers, the system has a larger granularity, with 36 or 72 GPUs connected primarily using electrical signals within the cabinet. Externally, they employ both NVLink and InfiniBand networks.
The choice between copper and optical is essentially a tradeoff between distance and speed.
The market’s understanding of the increase in copper interconnects is due to:
Previously, the H100 series clusters did not have intra-cabinet interconnects, but rather a separate network cabinet, and the chip rate was relatively high, so there was almost no short-distance copper wire.
While for the GB200 series, although there are many copper wires within the cabinet, the demand for optical interconnects in large clusters, such as the NVLink domain and the optical interconnect expansion of IB, is very large, and the future path of silicon photonics and chip-to-chip optical I/O is already very clear.
Q: What is the role of the IP architecture in the GB200 series?
A: For some large customers who need cross-cabinet connections, the IP architecture is used for external connections. However, the difference between GB200 and GB200 lies in the internal connections. GB200 uses m link electrical connections (i.e., copper interconnects between GPU and switch), rather than the backplane connection method of last year. Huang particularly emphasized the advantages of copper interconnects in cost reduction and performance demonstration at the conference. gb200
Q: At the GTC conference, Jensen Huang gave a special explanation of the copper interconnect solution, what are its advantages?
A: This is the first time that the copper interconnect solution has been specifically explained at such an important conference, which is also a point of great concern to everyone. The GPUs are connected through the mlink, confirming the use of copper interconnects, and their product solution may be similar to last year’s backplane connection method. Huang emphasized the advantages of copper interconnects in cost reduction and performance demonstration.
Q: What is the impact of the launch of the GB200 series on the market?
A: As NVIDIA’s new generation of server-level GPU chips, the GB200 series’ performance and efficiency improvements will have a significant impact on the market. Particularly, its adoption of the copper interconnect solution may change the internal connection method of GPU clusters, reducing costs and improving performance. Furthermore, the GB200 may change the design and deployment of data centers, further driving the development of artificial intelligence and cloud computing.
Q: What are the advantages of the GB200 copper interconnect?
A: Highlights of the GB200 launch: The GB200 single chip contains 2 GPUs and 1 CPU, and the main product launched is a single cabinet product composed of 36 GB200 chips. This shows that NVIDIA is focusing on electrical interconnects (mlink) rather than optical interconnect technology. Market promotion and expectations: GB200 will be widely applied, in contrast to the GH200 which has not been widely adopted. According to Huang’s speech at the conference, multiple potential major customers suggest that GB200 has high volume expectations. The market generally believes that the promotion of GB200 may lead to a gradual increase in the ratio of optical modules to GPUs from 1:2.5 to 1:9, and the sales volume of GB200 next year may have great growth potential. GB200 computing cluster network architecture
Q: What are the main differences between GB200 and GH200?
A: The main difference is that the GH series is not a high-volume product, while GB200 has a wide range of potential customers, including Google, Meta, OpenAI, Microsoft, Oracle, and Tesla. This means GB200 will see widespread application and high-volume adoption.
Q: What type of interconnect solution did GB200 adopt?
A: GB200 adopted a copper interconnect solution, which reduces costs. Especially with the high-volume adoption of GB200, this will become an important factor driving the increase in demand for optical modules.
Q: What industry trend did Huang’s presentation at the conference reflect?
A: His presentation at the conference can be seen as a reflection of an industry trend, not just a short-term hot topic. Over time, the industry will observe the performance delivery of the relevant companies. The market previously had debates on copper vs. optical interconnect solutions, but now it has been confirmed that GB200 adopted the copper interconnect solution.
Q: What is the market prospect for the copper interconnect solution?
A: The market’s attitude towards the copper interconnect solution is changing. The fact that GB200 adopted the copper interconnect solution indicates that this solution may see wider application in the future. With the performance delivery of the relevant companies, the market prospect of the copper interconnect solution is worth looking forward to.
Q: What are the main differences between GB200 and GH200?
A: The main difference is that the GH series is not a high-volume product, while GB200 has a wide range of potential customers, including Google, Meta, OpenAI, Microsoft, Oracle, and Tesla. This means GB200 will see widespread application and high-volume adoption.
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