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Post from Edgewater Wireless (@NextGenWiFi)

Edgewater Wireless (@NextGenWiFi) posted at 11:02 AM on Tue, May 14, 2024: Thrilled to see Canada securing a position in the global semiconductor industry — well done @C2MInnovation https://t.co/RBc2xgireR (
Thrilled to see Canada securing a position in the global semiconductor industry — well done @C2MInnovation https://t.co/RBc2xgireR
— Edgewater Wireless (@NextGenWiFi) May 14, 2024
) 



Ottawa, Quebec commit $100M for semiconductor capacity in Bromont

https://www.ept.ca/2024/04/ottawa-quebec-commit-100m-for-semiconductor-capacity-in-bromont/

https://www.reddit.com/r/EdgewaterWireless/s/ZZWtoCzkXz

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IBM is preparing to invest heavily in its 800-acre semiconductor packaging and testing plant

The federal and Quebec governments are spending close to $100 million to boost the country’s manufacturing capacity for semiconductors, which are vital in technologies ranging from artificial intelligence to quantum computing.

Prime Minister Justin Trudeau told reporters today in Bromont, Que., that Ottawa will invest $59.9 million to help fund IBM Canada’s semiconductor packaging facility in the town about 70 kilometres southeast of Montreal. He says the investment will also go toward the Bromont-based MiQro Innovation Collaborative Centre, a research group that tries to speed up the commercialization of components in digital technologies.

Quebec, for its part, is offering IBM Canada $38.9 million in loans to help the company buy equipment, increase capacity at its Bromont plant, and create a new generation of switches. A news release from the federal government says the funding from both levels of government will help create 280 jobs in the region.

IBM Canada says its plant in Bromont is one of the continent’s largest chip assembly and testing facilities and that the money will solidify Canada’s place in the supply chain for advanced packaging of semiconductors.

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Edgewater Wireless Files Worldwide Patent Application for Next-Generation Spectrum Slicing Approach

https://www.businesswire.com/news/home/20240513886584/en/Edgewater-Wireless-Files-Worldwide-Patent-Application-for-Next-Generation-Spectrum-Slicing-Approach


https://www.reddit.com/r/EdgewaterWireless/s/5IGd21WGGK


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is pleased to announce the recently completed patent application “Method and Apparatus for In-Band Multi-Channel Determination and Utilization.”

“As the industry sees an accelerated shift to WiFi7, and WiFi7’s marquee feature of Multi-Link Operation (MLO) gains real-world traction, the need for Spectrum Slicing has never been more essential than it is today,” said Andrew Skafel, President and CEO of Edgewater Wireless Systems Inc. “Our leadership in Spectrum Slicing – backed by over 26 granted patents – is now being extended to include a new generation of application-layer intelligence impacting the $39.4 billion global Wi-Fi market1. Kudos to our Product Factory for driving customer-focused innovation. Their dedication to creating better products is an essential part of our strategy to unlock shareholder value.”

The recently filed patent application pertains to the Method and Apparatus for In-Band Multi-Channel Determination and Utilization. This application has been filed as US Patent Application No. 18/643,333 and International Application No. PCT/CA2024/050533. The US and international patent applications are based on US Provisional Application No. 63/461,709, filed in April of 2023.

This first patent application in a series describes the use of an algorithm stack to ingest available information about the Wi-Fi environment and then determine and configure the optimal number-and-bandwidth of available channels within a spectral band using a Spectrum Slicing enabled radio array. The algorithmic stack detailed in this patent application describes an artificially intelligent (AI) component within the greater invention.

“As we have stated in prior press releases, this invention, and its patentable components, represent the command and control mechanisms necessary to fully realize the power of Spectrum Slicing and wireless quality of service," said Eric Smith, VP of Product for Edgewater Wireless. “The official applications have now been formally filed both in the US and abroad, and once again, Edgewater Wireless has broken new ground in Wi-Fi technology that will ultimately make ‘Wi-Fi better’ for everyone.”

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🤔🤔🤔🤔👀👀👀👀

“As we have stated in prior press releases, this invention, and its patentable components, represent the command and control mechanisms necessary to fully realize the power of Spectrum Slicing and wireless quality of service," said Eric Smith, VP of Product for Edgewater Wireless. “The official applications have now been formally filed both in the US and abroad, and once again, Edgewater Wireless has broken new ground in Wi-Fi technology that will ultimately make ‘Wi-Fi better’ for everyone.”