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Wednesday, 04/24/2024 3:34:30 PM

Wednesday, April 24, 2024 3:34:30 PM

Post# of 21807
Things are never easy to understand for your average retail trader. Samsung's 3D NAND memory, which surpasses the 236-layer eighth-generation version by expanding bit density by 50% is a vertical construct not the same, it appears, as the 3D Samsung produces.
"This latest memory product (of Samsung) enhances data input and output speeds by 33% while reducing power consumption by 10%. The rise of generative AI, which demands significant data capacity for machine learning and processing, has fueled the need for greater NAND memory capacity. In response, chipmakers are vying to increase storage capacity by vertically stacking memory storage elements.

Doesn't GTCH's patented process use "surround the chip", 3D... three dimensional, not only vertical?
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