GTCH This is last years news many might not be aware of and is very substancuial in the chip world .........
SAN DIEGO, March 30, 2023 (GLOBE NEWSWIRE) — GBT Technologies Inc. ( OTC PINK: GTCH ) (“GBT” or the “Company”), Korean 3D, Multi-Planar IC design and manufacturing technology patent application was granted on March 7, 2023 and was assigned patent #10-2508579.
The semiconductor industry is a critical sector for the global economy as it underpins many modern technologies such as computers, smartphones, and smart appliances. South Korea is a significant player in the semiconductor industry, with its industry being one of the country’s most successful sectors. South Korea is home to some of the world’s largest semiconductor manufacturers, including Samsung Electronics, SK Hynix and LG Electronics.
These companies have leveraged the latest technologies to produce cutting-edge chips for a wide range of applications, from mobile devices to data centers and autonomous vehicles. One of the factors contributing to the success of the Korean semiconductor industry is the country’s investment in research and development. The Korean government has made significant investments in developing its semiconductor industry, creating research institutions and offering incentives for companies to innovate.
In addition, the government has provided support for semiconductor companies to expand globally, giving them access to foreign markets and capital. The Korean semiconductor industry is also known for its high-quality manufacturing processes. Korean companies are known for their strict quality control measures, which have helped them maintain a reputation for reliability and performance.
GBT’s patent for its 3D, MP microchip architecture presents a new way to design and manufacture immense size integrated circuits to fit advanced analog, digital and mixed type integrated circuits (ICs) on a silicon wafer. These methods are expected to enable advanced microchip’s design and manufacturing using significantly less silicon space. The Company’s first 3D microchip patent was filed on March 5, 2019, and granted as of December 1, 2020, by the United States Patent and Trademark Office (“USPTO”); U.S. Patent No. 10,854,763.
The continuation application, assigned number 17102928, was filed on January 14, 2022, which application is targeted to broaden the protection of the main concepts of the intellectual property and was granted on August 9, 2022. GBT also filed a PCT (Patent Cooperation Treaty) application to protect the intellectual property in key countries.
The goal of GBT’s 3D, MP chip architecture is to enable the design of memory chips, CPU, GPU, AI chips on much smaller die, resulting significant cost reduction, lower power consumption and better performance. GBT plans to continue its R&D efforts in this field, with the goal of developing further innovative concepts in the integrated circuits realm during 2023.
