(Today) TI and Industry Leaders Strategize Future of Mobile
Internet at OMAP[tm] Technology Summit in Taipei
TI Chief Operating Officer, Rich Templeton, Addresses
Taiwan's Senior Electronics Executives
TAIWAN (August 28, 2001) -- Top executives from Texas Instruments
(NYSE:TXN) (TI) and leading Taiwanese electronics companies gathered together
today to strategize the future of the mobile Internet at the TI OMAP(tm) Technology
Summit in Taipei. Leading wireless device and equipment manufacturers, third
parties and applications developers participated in a summit on TI's OMAP platform
and gave their support for it as the optimal solution for driving real-time
communications and system performance for their upcoming handsets and Internet
appliances.
Rich Templeton, TI's chief operating officer (COO) and executive vice president
delivered the keynote at today's event, praising Taiwan manufacturers' effort in
moving beyond concepts to actual design and development of new wireless
handheld information appliances.
"In the past 10 years, we've seen beyond doubt that the Internet is the future of
information technology, and looking forward, mobility is the future of the Internet,"
said Rich Templeton, TI COO. "Wireless phones outsold PCs for the first time last
year, and virtually all analysts agree that within the next few years, portable Internet
appliances will become the preferred tools for Internet access on a global basis.
Leading companies in Taiwan and worldwide have recognized TI's power to enable
their next-generation wireless devices."
During today's event, TI disclosed its OMAP platform of advanced silicon and
software has won more than 10 new designs in Asia, further reinforcing the OMAP
platform position as the de facto standard for 2.5 and 3G. These companies join
other manufacturers such as Nokia, Ericsson, Sendo, Sony and several other
industry leaders worldwide, who have already chosen to integrate TI's OMAP
technology in their 2.5 and 3G designs.
Among the Asian companies who have selected TI's OMAP platform for their
mobile Internet devices include industry leaders such as Acer Communications &
Multimedia Inc., ASUSTek Computer Inc., Chi Mei Communication Systems, Inc.,
Compal Communications Inc., Compal Electronics Inc., GVC Corporation, High
Tech Computer Corporation, Quanta Computer, LG and ZTE, just to name a few.
With today's announcement, TI continues its leadership with design wins and
endorsements from Taiwanese manufacturers.
In a concurrent technical symposium, more than 500 Taiwan-based design
engineers, software developers and electronics company managers met with TI to
discuss the requirements of next-generation handheld devices and the OMAP
platform's ability to meet those demands. Microsoft Embedded Systems Group vice
president, Phillip Swan, addressed a roundtable of senior executives, sharing his
views of the mobile Internet.
"The next generation of wireless communications will bring a variety of new and
exciting services, enabling an enhanced mobile experience for both corporate
customers and consumers," said Phillip Swan, vice president Embedded Systems
Group at Microsoft. "TI's proven OMAP architecture combined with products like
Microsoft's smart phone software platform, codename "Stinger," will drive
innovation in next generation wireless communications ultimately enabling
customers to truly access their critical information anytime, anywhere."
The OMAP platform is a scalable, open architecture that supports real-time
communications and multimedia processing in handheld devices. The open platform
supports all major wireless operating systems, including Windows® CE, Symbian,
Palm and Sun's Java[tm]. It also supports the primary multimedia enablers such as
Windows Media, Java, PacketVideo and Real Networks. TI's platform is a family of
processors that are optimized to provide high-performance real-time signal
processing as well as extended battery life, both of which are essential for new
wireless communications devices.
OMAP development tools make it easy for applications developers to take advantage
of the real-time processing power of TI's DSPs. Once developed, these applications
can be ported to any device that contains an OMAP processor, including smart
phones, PDA/communicators and wireless devices yet to be developed.
"TI's OMAP processors are available today, which has allowed Taiwan's
electronics industry to quickly jump into the new world of wireless
communications," said Dr. Yuan-Shian Shu, director-general of Taiwan's
Industrial Development Bureau (IDB). "Taiwan companies establishing their own
design and development capabilities for the mobile Internet era is very important as
we transition from the PC era to a communications-centric world."
Top executives from a wide variety of major Taiwanese equipment manufacturers,
third parties and applications developers endorsed the OMAP platform during the
summit. In addition the many companies across Asia supporting OMAP, the
Taiwan-based companies include:
Device and equipment manufacturers: Acer Communications
& Multimedia Inc., Arima Communication Corp., ASUSTeK
Computer Inc., Compal Communications Inc., DBTel Incorporated,
GVC Corporation, High Tech Computer, Corp., Quanta Computer
Inc., Inventec Corp., Tecom Co., Ltd., Chi Mei Communication
Systems, Inc., Ares Communications Tech. Inc., Inventec
Multimedia & Telecom Corporation, Inventec Appliances Corp.,
TelePaq Technology Inc., Inventec Besta Co., Ltd., FIC Inc.,
Mitac-Synnex Grou,p, and Universal Scientific Industrial Co.,
Ltd., Application and middleware developers: AM ROAD
Electronics Co., Ltd., Ultima Electronics Corp., ProSense
Technology Corp. and Chanceux Co.; Research Institute:
Embedded System Lab, Institute for Information Industry
TI introduced OMAP technology to Taiwan manufacturers last August when the
company signed a Memorandum of Understanding (MOU) with the IDB to
collaborate in promoting the effective usage of TI's DSP technology in Taiwan. In
March this year, TI opened an Information Appliance (IA) Design Center in Taiwan
to strengthen applications engineering support for local original equipment
manufacturers (OEMs).
For manufacturers and developers creating wireless communications solutions, only
TI's advanced silicon and software platforms deliver the optimal performance, lower
power consumption and system level integration required to rapidly deploy
differentiated next-generation wireless devices and software applications.
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