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Post# of 14878
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Friday, 05/20/2022 7:35:58 AM

Friday, May 20, 2022 7:35:58 AM

Post# of 14878
$GTCH It is thought that the invention can be a game changer particularly for integrated circuits that require vast amount of silicon space like memories, CPU, GPU and AI. The Company’s 3D microchip patent was filed on March 5, 2019, and was granted as of December 1, 2020 by the USPTO; U.S. Patent No. 10,854,763. The continuation application, assigned number 17102928, was filed on November 24, 2020. The Company’s intent in filing the continuation is to broaden the protection of its main IP concepts. It is GBT’s goal to further develop advancements in this domain through the use of the 3D, multidimensional design, utilizing more space on the silicon wafer, enabling manufacturing of larger ICs, with higher performance, lower power consumption and cheaper. This technology can be particularly advantageous for fabless design houses to design advanced microchips with much lower cost.

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