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$GTCH "We believe our approach may alleviates the disadvantages of current ICs by providing new multi-dimensional IC architecture and design. The 3D microchip patent introduces a multi-dimensional, multi-planar IC structure that may potentially be used in IC fabrication. As microchip’s are constantly getting more complex there is a need for a breakthrough technology to enable much larger silicon utilization with higher performance and lower cost. We believe that the technology contemplated by the patent continuation application can be an efficient solution, breaking new grounds in the integrated circuits field, and introducing the next generation of design and manufacturing standards,” said Danny Rittman, the Company’s CTO.