Tuesday, September 07, 2021 9:02:01 AM
Posted byu/ARizzo1Yankee from reddit
13 hours ago
Jason Sheasby Interrogatories 1 and 2 that were posted by HAP from the Court Document dated 6/10/21
For very type of Memory Module that Google has purchased, made, used, installed, operated, sold or offered to sell in the United States for the period of November 17, 2008 through February 7, 2021, provide information to fully describe:
-The category of the Memory Module (e.g. FB DIMM) and the category of the DRAM on the module (e.g. DDR2, DDR3, DDR4, DDR5).
-The design and operation of all memory and/or storage devices and circuit and/or logic elements on the Memory Modules.
-The begin and end dates for the Memory Module.
-The extent the design has changed, how it has changed and when the change was made.
-The date of the first commercial use of the Memory Module.
-To the extent any portion of the Memory module complies with a JEDEC Standard identify the relevant portion of the Standard.
-The date (s) of purchase, manufacture, and/or sale of the Memory Module and
-The supplier of each of the components in the Memory Module and the assembler of the Memory Module.
2) For every type of Memory Module that Google has purchased, made, used, installed, operated sold or offered to sell in the United States as of February 8, 2021 and through the present provide information sufficient to fully describe:
-The category of the Memory Module (e.g. FB DIMM) and the category of DRASM on the module (e.g. DDR2, DDR3, DDR4, DDR5).
-The design and operation of all memory and/or storage devices and circuit and/or logic elements on the Memory Modules.
-The begin and end date for the Memory Module.
-The extent the design has changed how it has changed, and when such change was made.
-The date of the first commercial use of the Memory Module.
-To the extent a Memory Module complies with a JEDEC Standard identify the relevant portion of the Standard.
-The date (s) of purchase ,manufacture, installment,and/or sale of the Memory Module and
-The suppliers of each of the components in the Memory Module and the assembler of the Memory Module.
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