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kpf

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kpf

Re: jhalada post# 6155

Friday, 01/19/2007 12:05:42 PM

Friday, January 19, 2007 12:05:42 PM

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joe

rather than just integrating existing design on the same die.

You theoretically could do this on-die, but it would not make much sense imo. While it could possibly make sense as an MCM, with some glue (piece of silicon). (That's why i mentioned MCP as a possible intermediate step of integration). Not sure it offers a value proposition worth doing it, though. I'd expect to see MCP-approaches rather from Intel than from AMD.

K.

Facts are irrelevant to the emotional brain

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