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Sunday, October 06, 2019 10:27:17 AM
(lots of "Heads of..." and "Chairman..." "Director of...") I.E., decision/consensus makers
Maybe we will get some info out of one of these sessions.
Block F
15:00
Hardware
Faster, bigger, smarter?
In addition to software and metal powder, hardware is the third core
component for metal-based AM. The various printing techniques and the
interaction of ancillary equipment offer decisive potential for increasing
volumes, part dimensions and quality. The discussion will focus on
a reality check: Where do we stand today in hardware development with
a view to the industrialization of AM?
Speakers:
René Kreissl (Trumpf GmbH&Co. KG, Technical Director R&D AM)
Dr. Hans J. Langer (EOS Group, CEO &Chairman)
Mathias Wolpiansky (DMG Mori AG, Chairman)
Prof. Geoff McFarland (Renishaw plc, Director of Group Technology)
Chris Schuppe (GE Additive, General Manager – Engineering)
Co-Moderation:
Univ.-Prof. Dr.-Ing. Dipl.Wirt.-Ing. Johannes Henrich Schleifenbaum
(Head of Chair for Digital Additive Production DAP)
or...
Block H
16:50
Norms & Standards
Getting a common framework
A young technology like AM needs fixed standards and norms for its
industrialization. What initiatives have been taken recently in this regard?
What has been achieved and which norms and standards are still needed
to fully establish AM in industry? This panel clarifies many of these questions
and gives an overview of the status quo.
Speakers:
Dr.-Ing. Christian Seidel (Fraunhofer Research Institution for Casting,
Composite and Processing Technology IGCV, Head of AM and Director for
Strategy and Institute Development)
Gregor Reischle (TÜV SÜD Product Services GmbH, Head of Additive
Manufacturing)
Gero Corman (Volkswagen Group, Head of 3D-Printing /Additive
Manufacturing)
Moderation: Dr. Melinda Crane
or...
Block D
13:00
Digital Manufacturing
Becoming part of the digital factory
Since Additive Manufacturing is the first manufacturing process fully
based on digitalization, its further development depends to a large extent
on improvements of integrated and seamless software and digital
systems. This panel discusses the current state and next steps in software
and system design, led by three companies that are shaping the future
of the industry – Siemens, HP and BMW – with their unique perspective on
the digital AM factory of the future as well as digital manufacturing.
Speakers:
Dr. Oliver Trinchera (Kinexon, Founder & CEO)
Dr. Karsten Heuser (Siemens Digital Industries, VPAdditive Manufacturing)
Philipp Jung (HP Inc., SVP and Global Head of Customer Success,
3D Printing and Digital Manufacturing)
Dr.-Ing. Dominik Rietzel (BMW Group, Head of Additive Manufacturing –
Non Metal)
Moderation: Dr. Melinda Crane
https://www.munichtechconference.com/dist/media/project/MTC3_Program.pdf
glta
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