Thursday, December 13, 2018 6:28:57 AM
Wow, that guy can read P/E ratios. What a genius analyst!
When I first heard about the logic stacking, I first thought is was true 3D, like flash, but it just seems to be chip stacking with TSVs (through silicon vias). I wonder how they can call this something new for logic chips, since that technology is a few years old and already in broad use to my knowledge. Still don't understand what the actual twist should be.
Stacking chips is an issue for thermal design, so I would expect that only for low TDP and area constrained designs, not high end ones like desktops and servers. SDRAM stacked on top of the processor will likely make cooling more difficult, so I don't see a benefit performance wise. It may improve area, power and also performance for lower TDP packages though. Memory performance can be increased with shorter connections, wich is also the reason why some LPDDR4 in mobile devices are actually faster than desktop DDR4 DIMMs. For the same reason, GPU memory can be made faster.
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