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Wednesday, 12/12/2018 12:12:49 PM

Wednesday, December 12, 2018 12:12:49 PM

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Intel Demonstrates 10nm-based PCs, Data Center and Networking Systems, Next-Gen ‘Sunny Cove’ Architecture with AI and Crypto Acceleration, and Industry’s First 3D Logic Chip Packaging Technology

SANTA CLARA, Calif. --(BUSINESS WIRE)-- At Intel “Architecture Day,” top executives, architects and fellows revealed next-generation technologies and discussed progress on a strategy to power an expanding universe of data-intensive workloads for PCs and other smart consumer devices, high-speed networks, ubiquitous artificial intelligence (AI), specialized cloud data centers and autonomous vehicles.
This press release features multimedia. View the full release here:
https://www.businesswire.com/news/home/20181212005197/en/
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