Intel Corp (INTC)

[borusa]

>makes me wonder how AMD can reuse those 7nm dies for other designs, though. I expect those 7nm chiplets to always need an interconnect die of some sort, which likely leaves 7nm to the highest end many core designs. Maybe some more lower bin EPYCs and Threadrippers, but no Ryzen 3/5/7, I would expect.

Humm, makes sense, hope you are wrong though .. I think those chiplets with defects/binning problems will find their way around (avoid) the dumpster. They may have to accumulate for a good while. That 14nm is from GF makes for a willing source for tailored control hub, though packaging may add cost.

As I read, the hub is fleshed out with L4 caches. Lisa doesn't like to waste Si.