InvestorsHub Logo
Post# of 486
Next 10
Followers 51
Posts 5419
Boards Moderated 0
Alias Born 03/26/2009

Re: None

Thursday, 12/21/2017 2:34:10 PM

Thursday, December 21, 2017 2:34:10 PM

Post# of 486
I received a reply back from an email I sent this morning to EPGL IR below is my email and their reply....

Hello:

I see that on Dec 12, 2017 Google (Verily Scienses) was issued a Patent # 9,841,614 for a Flexible Conductor for use within a Contact Lens? I assume one of the differences is that this IP is layered? My question is... Is a Conductor the same as a Circuit? How does this IP compare to EPGL's Flexible Circuit?

In a Tweet on Dec 11th it was said that " $InWith Corp. is Now in Final Negotiation with Top Venture Capitals." and then nothing is said in the update about InWith. I think most of us were expexting to hear some details concerning the Capital Raise. Is Inwith having trouble raising the funds to do the BuyOut? Is InWith still going to make a buyout offer for EPGL? And is InWith's per share offer anywhere near the true value that Mr Hayes is expecting?

Have there been other offers made for EPGL other then that from InWith? IMO the tweets suggest there have been other offers. If not please stop teasing and misleading us shareholders on. Very frustrating.

As for EPGL's Tweet on Sep 21st saying that "EPGL shareholders may be cheerful going into Fall & New Year." So far IMO where EPGL's share price is concerned EPGL's shareholders have no reason to be Jolly.

Sincerely, Judy
.................................................
EPGL IR reply

No InWith has great interest. Just being careful who it decides to go with as interest has picked up quite a bit.

Regarding VERILY, if it isn't for mass manufacturing molded for stretchable circuitry, it isn't what EPGL has. Layering is not the holy grail.

Join the InvestorsHub Community

Register for free to join our community of investors and share your ideas. You will also get access to streaming quotes, interactive charts, trades, portfolio, live options flow and more tools.