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Thursday, 09/29/2016 2:53:40 PM

Thursday, September 29, 2016 2:53:40 PM

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Well the America Makes NCDMM/NIST/Layerwise presentation today was fairly informational.

Although it didn't really touch on anything we didn't already know, it solidified the need for SGLB tech in the AM field.

The NCDMM study was dated, it started in 2013, and the main objective was basically proving that they could produce in-process, layer by layer data of a printed part. They discover they could, obviously. Through the years, we've seen Sigma greatly surpass this with their Honeywell collaboration of "Contour" which inspects, follows geometric parameters, and allows for print intervention, along with their complete system which also stores and displays this information. So that part of the conference just proved SGLB is ahead of the game or at least tied for first as there's many companies catching up by now.

The 2nd part was purely about NDE post process. The speaker dragged on and on about how they can find defects post process, which we all knew they could, but he even said there were limitations based on certain materials and the size of the defects, similar to the range SGLB tech can detect DURING the process. So, again, all signs point to Sigma.

The 3rd speaker from Layerwise, their technology can only look at one part on one machine at a time, and creates a 3D model. Not useful for commercial applications. Again, Sigma wins.

All in all, there seems to be some work to be done as far as getting IPQA to be a set standard, but it seems Honeywell (especially with the announcement today), GE, and anyone interested in mass producing parts is pushing for IPQA to be an acceptable quality assurance process for AM.
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