Advanced Micro Devices Inc (AMD)

[burn2learn]

"The main defect issue on the back end is actually VIA formation, Trench Formation, and Native Oxide regrowth. Particulate Defects probably come out somewhere in the top 5, but I'm not sure I would say top 3."

I don't understand how you can say this. From a defectivity standpoint flakes, large / small particles, and tearouts (particles) are the largest edi impactors in the BE and FE processes. Are you saying the process itself (forming the vias / trenches) kill more die than defects...things like via voiding excursions? If you remove excursions then I think defectivity is number 1 issues and particle related defects are top impactors.

I'm a FE dude for what it's worth