Advanced Micro Devices Inc (AMD)

[chipguy]

The non-L3 portion of the Madison is about 160 mm2. That is less than the non-L2 portion of the Willamette
P4

LOL. You are comparing .13u itanium core with .18u Willamette core. How about comparing it with .13u cores?

Once again you miss the point. The question was die size, not
feature size. To the extent defectivity is different between
Intel's 180 nm and 130 nm processes, it is probably slightly
lower in the 130 nm process because the overall industry trend
over time.

If Intel can turn out Willamettes in huge quantities for mass
consumer markets then it can certainly manufacture Madison, which
has less die area unprotected by redundancy than Willamette, with
incredible ease. I really don't think these concepts are all that
hard to grasp.