Intel Corp (INTC)

[chipguy]

No products on the market yet that I'm aware of. This can't be going as planned...

I wouldn't rush to that conclusion.

3DXP represents a new class of beast that is neither fish nor fowl.

If you use it like flash then you are throwing away all its speed.
If you use it like DRAM then you can easily wear holes in it within
seconds.

This means to properly use it you need 3DXP aware chipsets and
OSes to be in place that work well together. Once this is in place
then flagship applications like DBMS likely need new configuration
models and tuning to really take advantage of this new class of thing
that is half way between memory and storage.

This all takes time (especially the software side which will be done
mostly outside of Intel).