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Re: mas post# 144244

Wednesday, 03/16/2016 7:33:29 PM

Wednesday, March 16, 2016 7:33:29 PM

Post# of 151656
mas, apparently some engineer at an OEM got ahold of a Zen ES:

It seems that unlike with Bulldozer, AMD has created separate dies for server and consumer parts. The server version of the die has twice the cores, L3 cache and additional I/O controllers per die. I haven´t been able to disassemble one yet, however judging from the package size it is a MCM part. 14nm LPP process.

The relative power consumption is roughly the same as on Intel 14nm parts with similar configuration, but the clocks are quite low :/



http://semiaccurate.com/forums/showpost.php?p=257682&postcount=2112

and...

For a long time I actually like what I see. I´d say as long as the consumer Zen parts can reach high enough clocks (min. 3.5GHz), everything will be pretty good



http://semiaccurate.com/forums/showpost.php?p=257718&postcount=2120

The threat to INTC that you pointed out may indeed materialize with Zen.

Looks like the rumor of a 32C/64T chip was true. We know the consumer part goes up to 8C/16T, which means that the dies on the Zen server chip are 16C/32T. Two of them stuck on a package means 32C/64T per chip.

SKL-EP/EX will top out at 28 cores/56 threads, though that will be a single monolithic die rather than an MCM.
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