Intel Corp (INTC)

[Ideal_Inv]

3D XPoint can be placed in package or embedded - EE Times

[It would be absolutely phenomenal if Intel can come out with these designs over the next 6-12 months. Would be a death knell for ARM vendors.]


Intel did confirm that 3D XPoint manufacturing is compatible with back-end-of-line (BEOL) processing, which opens up the possibility of deploying 3D Xpoint memory on top of a plane of logic and as an embedded non-volatile memory option. But in email correspondence emphasized that the launch discussion is only about the technology as the basis of a discrete stand-alone memory.

http://www.eetimes.com/document.asp?doc_id=1327289