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Wednesday, October 08, 2014 12:54:05 AM
The following paragraphs suggest the difficulty TSMC and Samsung are having with getting decent yield.
Additionally at best TSMC which is ahead of Samsung will only get single digit revenue by 3rd quarter of 2015.
And if Apple is not interested in FinFET for its chips then who is going to foot the bill for such expansion.
Things are getting clear for everyone else to see that Intel lead much more than some of the folks think on this forum.
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Peng said in a July report: "We believe Apple abandoned the latest FinFET technology and maintained the 20nm design for its A9 processor due to concerns about low yield rates." TSMC is the only foundry that can integrate fan-out for application processors and mobile RAM, he said, so Apple's A9 and upcoming high-end application processors will follow this trend over the next two years.
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Carlos Peng, an analyst with Fubon Securities in Taipei, says FinFET chips will account for a "high single-digit percentage" of TSMC's revenue by the third quarter of 2015. Initially, TSMC's main customers for the new process technology will be Apple and HiSilicon, followed by Qualcomm, MediaTek, Xilinx, and Altera later in 2015. Apple may choose TSMC to make the A9 processor with FinFET technology.
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Checks with industry experts suggest Samsung's foundry has experienced a setback with its 14nm FinFET project, while TSMC's 16nm pilot line is gaining incremental confidence among prospective customers, Hosseini said in the report. TSMC and Samsung are in a tight race to provide FinFET products to their biggest customers, Apple and Qualcomm, each of which aims to offer improved performance and lower power consumption in smartphones with the higher-density chips. However, the development of 3D-structured FinFETs has been fraught with difficulty for the two companies.
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