A sure sign the end is approaching:

Sun Micro to overhaul chip line, aims at schools


http://economictimes.indiatimes.com/cms.dll/html/uncomp/articleshow?artid=38536652

Intel claims Fujitsu choosing IA over Sparc

Feb 24, 2003 (Datamonitor via COMTEX) --

The head of Intel Corp's enterprise chip division called Sun Microsystems' long-standing licensing deal with Fujitsu into question this week when he claimed the Japanese vendor was putting Intel's Itanium processor at the center of its future server strategy.

Fujitsu has been a licensee of Sun's Sparc and Solaris platform since the early 1980s. In January, Intel and Fujitsu forged an alliance under which Fujitsu said it would develop high end systems on Intel's Xeon and Itanium processors. At the time, there were no indications that Fujitsu would be exclusively committing to Intel architectures.

This week Mike Fister, general manager of Intel's enterprise platforms group, told the Intel Developer Forum in San Jose, that Fujitsu was abandoning Sparc as the foundation of its of its future architecture. He said the switch would cover billions of dollars of systems.

Speaking afterwards, Fister said that Fujitsu planned to migrate all its systems to Intel's architecture, and that Sparc would fade from Fujitsu's roadmap after 2005.

However, Fujitsu said this week afternoon that it was not contemplating an Intel-only roadmap. Fujitsu vice president of product marketing Richard McCormack said that the company's Sparc-based PrimePower servers were part of its roadmap for at least the next five years.

He said that current market predictions, while seeing strong growth in Windows and Linux-based systems also forecast continued growth for Unix-based systems as well as machines running traditional mainframe operating systems.

"Our strategy is to accept the fact that customers want to buy a diversified set of products," he said. He said the company had clearly stated its intentions to continue to offer Sparc. "Our customers want us to."

Fister's presentation this week pushed Itanium's claimed performance advantage over Sparc and IBM's Power architecture. Given Intel's economies of scale, it could arguably offer OEMs a compelling argument to switch architectures.

A source at another Intel OEM this week was unsurprised by the idea of Fujitsu moving to Itanium. He said that ultimately Sun's strength lay in its software, rather than its hardware. Moreover, Fujitsu had faced active competition from Sun, the source claimed. Intel, being strictly a supplier of silicon, does not present this problem. Sun was unavailable for comment.

Source: Computerwire

http://www.datamonitor.com Republication or redistribution, including by framing or similar means, is expressly prohibited without prior written consent. Datamonitor shall not be liable for errors or delays in the content, or for any actions taken in reliance thereon

Copyright (C) 2003 Datamonitor. All rights reserved

Hyperthreading benchmarks from IBM

http://www-106.ibm.com/developerworks/linux/library/l-htl/


Conclusion
Intel Xeon Hyper-Threading is definitely having a positive impact on Linux kernel and multithreaded applications. The speed-up from Hyper-Threading could be as high as 30% in stock kernel 2.4.19, to 51% in kernel 2.5.32 due to drastic changes in the scheduler run queue's support and Hyper-Threading awareness.

semi -

[Edit Re: rumors of a new fab in India] How about Assembly/Test/Packaging?

Sure it's possible but there are a number of news stories now reporting the same thing about a fab and Intel's hasn't denied it. Curious!

EP

Kirk -

A State of the Art fab is maybe $2B to $3B so $100M won't buy much.

No it won't buy much but it ays "initial" investment. I'm inclined to think this is announcment is in error.

EP

Not sure I believe this but...

Intel to build Fab Factory in India

http://economictimes.indiatimes.com/cms.dll/html/uncomp/articleshow?artid=38191584

PTI[ FRIDAY, FEBRUARY 21, 2003 09:47:44 PM ]
WASHINGTON: International chip giant manufacturer, Intel has decided to build a new fabricating plant in India making an initial investment to the tune of $100 million in the project, media reports said.

"Intel had already invested in a chip design facility in India to the tune of $100 million and the company is known to have spent much more than that in the world's most populous democracy," according to the 'Inquirer'.

The news will dash any remaining hopes Australia had that it might somehow persuade Intel to build the Fab there, it said.

The combined factors of low labour costs, high skill rates and favourable government will all have played a part, it added.

The choice of India is not too surprising. Several other countries had courted Intel, most noticeably China. India's more open form of government will have weighed heavily against China, the Inquirer said.

"Building a Fab is a hugely expensive venture, the new facility is likely to cost more than 2 billion dollar to put together," it said.

New benchmarks?

This is a German website that shows some benchmarks for Intel's upcoming chipset with DDR400 and 800MHz FSB. At least that's what I think it says.


http://www.computerbase.de/news.php?id=4716

fingolfen -

If memory serves, the Intel 0.18 micron process is a 6-metal layer process, not 5. It is, however, definately aluminum.

I'm going by memory too. I thought .18u was 5 Al metal layers and .13 was 6 Cu.

EP

wbmw -

Thanks for the correction. I don't want to give false information.

The .13u version was supposed to go up to 1.8GHz. I wonder what happened to it.

Gee, where have I heard that before?

EP

wbmw -

I think it's pretty incredible that an Itanium 2 submission for high end OLTP is outperforming the best IBM has to offer for Power4.

It is amazing and this is a .18u Al process Itanium2 compared to a Power4 manufactured on IBM's supposedly state of the art .13u 9 metal layer SOI process. The same one AMD can't seem to get to work. The Itanium2, on what is now an almost 2 generation old, 5 metal layer Al process is setting the performance standard. Like you, I'm eager to see how much more distance Madison can put on the field.

EP

Spokeshave:

Here's what you said

"I cannot for the life of me figure out how you got "benchmarks", plural, out of that article.

The article said "benchmarks". That's where I got it from and you clearly didn't bother reading it before you accused me of making it up or you would have seen that. Try and get your facts straight next time please, especially when we're quoting you. If you didn't act like a weasel we wouldn't treat you like one.

EP

NEC, Intel boast high server speed


By Stephen Shankland
Staff Writer, CNET News.com
February 20, 2003, 10:54 AM PT


An NEC server with 32 Intel Itanium processors and Microsoft's coming Server 2003 operating system has claimed the No. 2 place in the most widely watched server speed test.
The $4.4 million server posted a performance of 433,000 transactions per minute, a result faster than IBM's 32-processor p690, with 428,000 transactions per minute, and Hewlett-Packard's 64-processor Superdome with 423,000. Only Fujitsu's 128-processor Primepower 2000 has a higher result, 456,000.

more...

http://news.com.com/2100-1001-985326.html?tag=cd_mh

Fingolfen

Foundries don't have cutting edge processes like Intel or IBM, and AMD needs a cutting edge process to remain competitive with Intel.

Yes you're right and this was discussed widely here and on SI at the time the first announcement was made. It was obvious to us at the start, so why wasn't it obvious to AMD?

EP

Nitt

So, how do they support this big ramp they are expecting... or maybe it's not going so big. What the heck is Hector doing?

Did you ever watch the 3 Stooges?

wbmw -

Very likely, this problem is one of the reasons why they delayed the launch (among others).

It's only a problem if there's a solution. If there's no solution then it's just a bad situation.

EP

Alan -

The last time I was on that site fab 7 was running 64K EPROMs and fab 9 was a bunch of steel girders...

2764s. I used to test them. That was 20 years ago.

EP

300mm -

Thanks for posting. F11 has huge capacity and while it may rank up there in unit volume, I don't think it's still that high in revenue. Flash and chipsets dominate now with 300mm ramping. With the extension of F11X it may regain that distinction. It'll be interesting to watch the Arizona/New Mexico/Oregon battle for greatest production. Right now my money's on Arizona but that could change.

Don't be a stranger.

EP

Spokeshave -

Seriously, I don't see how you can stand those kind of economic conditions. I have a few rental units too, one of which I picked up for about 20% of the price you mentioned. I guess I am spoiled. I don't think I could tolerate it.

Oh I didn't pay that much for them. I picked up the first one 20 years ago for under $50K, and the subsequent ones for $80K tops. The rents there are outrageous. It's a University town and the locals are very anti growth, so the law of supply and demand works it's wonders. I live in Phoenix but I keep a studio there vacant for my own use. As a property owner I'm sure that you can understand that I have to make numerous trips out there to my beach home to sort of.. check things out... All a business expense of course...

EP

Spokeshave -

I don't live in California, and it is certainly not representative of most municipalities.

But you just had to get in your "you don't know what you're talking about" dig, didn't you... That's alright, I've come to expect it. I'm always right. When are you going to believe me?

I admire your property. For a little perspective, some of my property holdings are lowcost apartments/conds. 576 sq ft, 1-bdrm, walking distance to the beach but truly no frills. One recently sold in our building for $231,000. That's California. Only about 25 miles away is Silicon Valley and it would be worth 2x over there. And yes, many people leave a single wall standing, rather than level the whole building, and build around it. Remodel vrs new structure.

EP

More Athlon64 benchmarks:

http://www.hardwareanalysis.com/content/article/1596/

Naturally we’re intimately familiar with the workings of Unreal Tournament 2003 engine and after a quick look at the display settings, which were set at a 1024x768x32bit resolution with all other features at default, we measured a mere average 42fps and maximum fps around the 55…60fps mark. Considering the fact that this is a 2GHz Athlon-64 processor teamed up with a GeForce Ti 4600 we honestly expected a whole lot better. A 1.6GHz Pentium 4 with that very same GeForce Ti 4600 videocard would have no problems clocking in a similar score while running under Windows XP.

Spokeshave -

Respectfully, you don't know what you are talking about. In most municipalities, a permit is required for both building and major remodeling, and the cost of a permit for either is generally under $100.

Hahahahaha -- You don't know what you're talking about.
You obviously don't live in California where enormous sums are needed to pay for all the illegal aliens, crack babies, aids infested dope addicts, sickos, wackos, and perverts. I have quite a bit of property in the People's Republic of Santa Cruz and I have been a land developer. It costs you $75,000 in permits and fees alone before you can stick a shovel in the ground. Land cost not included. "Remodeling" requires a permit sure but it's much cheaper. You live in a different world. Consider yourself lucky.

EP

b2l

Many times people "remodel" their own homes by tearing down everything but 1 wall. Much cheaper than paying for permits for a new house.

Alan81

Can somebody explain to me why Intel will release a 1M cache Xeon on 0.13u in Q3, when the 1M cache Nocona will be released in Q4? The market is small enough that Intel should be able to replace all the 0.13u prestonia with Nocona in short order. Why the new product in Q3 so close to the 0.09u roll out?

All will become clear in good time.

alan81

So they have aa fab 11 that runs 200mm wafers and a fab 11X that runs 300mm? Wow! That must be confusing. Why did they not just call the new 300mm factory something else?

They did. I've heard it called F21.

Semi -

F11X is actually a merging of the older F5 and F7 on the Rio Rancho Site.

F7 & F9.

F5 was in Oregon.

Intel confirms 1 Meg Xeon

http://www.itworld.com/Comp/2076/030219intel/

wbmw -

I don't remember any specific person who was an expert. Note that this is semi equipment, not semi's themselves. Obviously a number less than 1 is not good.

alan81

I do believe that fab 11 is gone

Not by a long shot. Fab11 is alive and doing very well.

EP

wbmw -

Oregonian that Fab15 will become a wafer sort facility and decommission itself as a fab

I think that was Fab5 not 15.

EP

smoothh20

Things must be looking pretty good at Corporate

I am pretty amazed by Intel's plans. 5 300mm fabs by 2005. With the reported small die size for Prescott, it is likely that Intel could meet the total demand with just 2-3 300mm fabs. Intel is clearly planning on an enormous demand in other areas. The chipset business, that accounts for over 150 millions units per year won't use those fabs for another generation or so. Flash won't be in those fabs so just what is going to use 2-3 additional 300mm fabs? Even still Intel will have a number of other 200mm fabs that are still pretty much state of the art. F10/14 in Ireland, F18 in Israel, F22 in Arizona, F11 in New Mexico, F20 in Oregon, F17 in Hudson, D2 in Santa Clara. Add a Flash fab or 2 and you still have a hell of a lot of capacity without those 5 300mm fabs. Intel has something in mind that isn't clear to the rest of us.

EP

This article is suggesting Intel is planning on a 1Meg Cache version of their DP Xeon. They are also suggesting it will offer a 25% performance improvement.

http://www.crn.com/sections/BreakingNews/dailyarchives.asp?ArticleID=40030

Intel To Speed Up Xeon Performance Gains
Will also reduce Itanium 2 system pricing

By Edward F. Moltzen, CRN
San Jose, Calif.
9:01 PM EST Tues., Feb. 18, 2003
Intel is speeding up its server processor road map and plans to ship the next version of its 32-bit Xeon processor for dual-processor systems, code-named Nocona, by the fourth quarter, company executives said.

Nocona will be the first server processor shipped by Intel that is built on the new, smaller, 90-nanometer process. In addition, Intel will increase the cache of its dual-processor Xeons from to 1 Mbyte from 512 Kbytes and make those processors available in the third quarter of this year, ahead of schedule.

The cache improvement "increases performance by about 25 percent," said Lisa Graff, director of enterprise processor marketing at Intel. "If you think about a typical performance jump [with a new processor], that's maybe a 5 percent increase in performance."

Intel also said its next-generation, multiprocessor Xeon chip, code-named Potomac, will ship in the second half of 2004 and will be built on the 90-nm process.

On the 64-bit front, Graff said Intel's aggressive moves, expected later this year, to build its Itanium 2 systems on a 0.13-micron process will help reduce power consumption on the platform and enable Intel to produce pricing of about $5,000 to $7,000 per system. That will provide the chip company with a 64-bit product that should penetrate the midsize market much more easily than current versions of the processor have, Graff said.

Code-named Deerfield, the processors is slated to initially ship later this year at 1GHz and have 1.5 Mbytes of Level 3 cache, consuming 62 watts of power. Deerfield processors will be refreshed in 2004, Intel said.

"I think you'll see some movement [to the mid-size business segment]," Graff said. "Deerfield, as a product, is targeted especially where Sun [Microsystems] plays in the RISC space,$3,000 to $5,000 RISC systems.

"Our customers have asked us for Deerfield exactly for that reason," Graff said.

Graff spoke as Intel opened its twice-annual Intel Developer Forum at the San Jose Convention Center.

By Michael Kanellos
Staff Writer, CNET News.com
February 18, 2003, 1:42 PM PT


Intel this year will focus on what it does best: Crank out chips and expand factory capacity.
The Santa Clara, Calif.-based chipmaker will produce new families of chips for desktops, notebooks and cell phones this year, CEO Craig Barrett said in a speech at this week's Intel Developer Forum in San Jose.

Additionally, the company will continue to invest in fabrication plants, the billion-dollar factories that pump out millions of chips. On Tuesday, Intel announced it will convert Fab 12 in Chandler, Ariz., from processing wafers with 200-millimeter diameters to a facility that can process 300-millimeter wafers.



The conversion--which will give Intel five 300mm fabs when completed in 2005--will cost about $2 billion but will pay dividends in higher productivity. Chips produced on these larger wafers cost about 30 percent less to make and more than twice as many can be produced at once.

“Our future is built around new technology and having the (manufacturing) volume in place to serve the growth that the industry will demand,” Barrett said at a press conference before his speech. “We always try to position ourselves with capacity to grow faster than the industry.”

Barrett also indicated that business conditions appear to be picking up slightly, at least for Intel’s computing divisions. Some research firms are anticipating that IT spending may grow 5 percent to 7 percent this year, in part because many of the PCs bought during the 1998-99 sales bulge will need updating. Intel itself will buy 35,000 new desktops while Lucent, the troubled developer of telecommunications gear, has said it will refresh its corporate desktops.

“We are seeing a variety of companies choosing to upgrade,” Barrett said. Sales of communications chips, however, will likely remain lackluster.

“The over-buildout, the over-investment in wireless is still working itself out. We hope the second half of 2003 (for communications) will be better than the first half,” he said. “Computing will probably recover faster than communications.”

Consumer demand for wireless and broadband products could compensate for weak corporate sales. DSL (digital subscriber line) and home fiber optics are on the rise in Japan, Barrett said. In a recent business trip to Tokyo, he noted how Yahoo representatives were giving away DSL modems to shoppers along the street to encourage them to sign up for service. Yahoo now has 2 million DSL customers in the country, he said.

Barrett added that Intel’s product lines will undergo changes. Chips for desktops, such as Intel’s Prescott, and notebooks, such as Banias, will continue to diverge in their capabilities because of the different demands of their buyers.

”Mobile (chips) will increasingly have more wireless and power-saving technology. (A) desktop will have more power built into it,” he said. “You will see them probably distance themselves a bit more.”

Chips that integrate several functions--such as the Manitoba chip that contains a processor, a digital signal processor and flash memory--will become more prevalent. An integrated chip for handhelds, code-named Bulverde, is expected next year, sources said. Integration makes the manufacturing process more efficient.

As an example, Barrett said, “We’re seeing…optical technology get coupled with silicon technology.” Optical chips pass data at faster rates than silicon chips and use less energy, but are more costly to build.

wbmw -

The HP mx2 dual processor module is designed to combine two future Itanium 2 processors and a 32-MB L4 cache onto a single daughter card module that is pin-compatible with existing Madison Itanium 2 processor sockets.

First time I've ever heard of an L4 cache. I' also going to need someone to explain to me how this works in a system where 2 processors on the module plug into a single socket on the MB. How does the system recognize/handle this?

EP

Arizona's Fab 12 will undergo conversion
Facility will be Intel's fifth 300-mm plant
Posted February 18, 2003; WW08
From Intel Press Relations
Intel today announced its plans to convert Fab 12, a 200-mm wafer fabrication facility in Chandler, Ariz. to a 300-mm wafer fab.

The conversion project, estimated to cost $2 billion, will begin in the first half of 2004 with production scheduled to begin in late 2005. The converted fab will start up production on 65-nanometer process technology.

“This investment is consistent with our belief that Moore’s Law is alive and well,” said Bob Baker, senior vice president, general manger, Intel Technology and Manufacturing Group. “Three-hundred mm production, combined with leading edge manufacturing, gives us the ability to deliver our customers greater computing power and functionality at lower costs.

“This technology greatly improves our capital efficiency by giving us more than twice the capacity at significantly lower costs. Additionally, by reusing an existing 200-mm factory we save additional capital and take advantage of the highly skilled workforce we already have in place.”

When completed, the converted Fab 12 will become Intel’s fifth 300-mm wafer facility. Five 300-mm fabs provide the equivalent manufacturing capacity of about 10 200-mm factories. Intel currently has two 300-mm fabs in operation; one in Hillsboro, Ore., the second in Rio Rancho, N.M. Two other 300-mm facilities are under construction. One in Oregon will begin operations later this year, and a facility currently under construction in Ireland is scheduled to begin operations in the first half of 2004.

Manufacturing with 300-mm wafers (about 12 inches in diameter) dramatically increases the ability to produce semiconductors at a lower cost compared with the current standard 200-mm (eight-inch) wafers.

The total silicon surface area of a 300-mm wafer is 225 percent (or more than twice) that of a 200-mm wafer, and the number of printed die (individual computer chips) is increased to 240 percent. The bigger wafers lower the production cost per chip while diminishing overall use of resources. Three-hundred-mm wafer manufacturing will use 40 percent less energy and water per chip than a 200-mm wafer factory.

Separately, the company disclosed plans to sell 524 acres of land in Forth Worth, Texas. The land was purchased in 1997 as part of a planned manufacturing facility. However, changes in manufacturing technology and current construction projects at existing Intel sites mean the property is no longer part of the company’s future plans.

spokeshave -

But you friggin people don't want civil, reasonable discussion.

You misunderstood an article, gleefully posted a driveby bash and then cry boohoo, everybody's picking on me... sniff sniff..

Civil, reasonable discussion is fine, in fact encouraged. Driveby bashing from a weenie isn't.

EP

Intel plans $2 billion renovation of Arizona wafer plant
Associated Press

PHOENIX - Intel Corp. on Tuesday announced it will upgrade its wafer manufacturing plant in Chandler to a more advanced and efficient manufacturing method at a cost of $2 billion.

The conversion of Fab 12 to a 300 mm process from its current 200 mm process will double manufacturing capacity while lowering costs, the Santa Clara, Calif.-based chip giant said.

Intel saves construction money and keeps an existing highly skilled work force by converting the existing plant instead of a building a new one, said Robert J. Baker, senior vice president and general manager of Intel's Technology Manufacturing Group.

The project was announced at a news conference during which Gov. Janet Napolitano called Intel's decision a commitment "showing the world that Arizona is an excellent place to do business."

Intel said the project will create hundreds of temporary construction jobs, but not increase the plant's permanent workforce. The work, scheduled to begin in 2004 and be done in late 2005, involves remodeling the plant's interior and purchasing new wafer fabrication tools.

"This investment is consistent with our belief that Moore's Law is alive and well," Baker said, referring to Intel co-founder Gordon E. Moore's theory that the number of transistors on a computer chip would double every year or two.

Semi -

Intel's original press release announcing F22 said it would be a 300mm fab. If F12 is to be upgraded, what is it being upgraded to? Simply going from .18u to .13u is hardly earthshaking. Could it be intended for 90nm or will all 90nm be 300mm wafers?

EP

HP promises ProLiant performance boost
By John Leyden
Posted: 17/02/2003 at 12:55 GMT


HP today introduced two eight-way ProLiant servers that mark the debut of HP/Intel's F8 chipset in the manufacturer's hardware.

The servers, the new HP ProLiant DL740 and the second-generation HP ProLiant DL760, also feature hot-plug RAID memory capabilities and improvements to HP ProLiant Essentials management software.

Designed for applications such as high-performance databases and IT consolidation projects in mind, HP says the servers offer great strides in both availability and performance over previous models. Each is built to run either Linux or various flavours of Windows Server.

HP's partners, such as VMware, provide technology that allows customers to run multiple, and even disparate, operating systems and applications on the same ProLiant server.

And what server launch would be complete without benchmarks? In this case HP highlights how the ProLiant DL760 server achieved 115,025 transactions per minute (tpmC) with a price/performance of $7.69/tpmC in the relevant TPC benchmarks. [Edit:my bold]

HP gives credit for this performance to use of the F8 chipset, a follow-on to the Profusion chipset that HP jointly developed with Intel. The F8 chipset has been designed for higher performance and bandwidth by combining PCI-X input/output technology, Gigabit Ethernet, Ultra3 SCSI and Intel Xeon processor MP technology.

Last July we reported that HP was quietly "killing off" the F8 chipset. Now it seems reports of its mothballing in some (HP cupboard somewhere, perhaps) were greatly exaggerated.

Also announced today are two new additions to the HP ProLiant Essentials management software product line: HP Insight Manager 7 SP2 and the HP ProLiant Essentials Performance Management Pack. HP Insight Manager 7 has an enhanced user interface that provides an integrated console for the Performance Management Pack.

The Performance Management Pack features the ProLiant Performance Analyser, which identifies and explains hardware bottlenecks on ProLiant servers, so helping users get the most out of the hardware.

Available today, the HP ProLiant DL740 server starts at $24,999. Each
ProLiant DL760 server costs $27,999 or above.

Licenses for the HP ProLiant Essentials Workload Management Pack are $499 per server. Estimated US licenses for HP ProLiant Essentials Performance Management Pack are $99 per monitored server. The two management packs are currently available only for Windows environments but the lesser HP Insight Manager 7 SP2 ships free with ProLiant servers.

HP Stays Itanium Course Ahead of Intel


By JAIKUMAR VIJAYAN
FEBRUARY 17, 2003

Content Type: Story
Source: Computerworld

Hewlett-Packard Co. this week will introduce an Itanium 2 chip set in a move that takes it another step closer to delivering its first high-end servers based on Intel Corp.'s 64-bit processor architecture.

The company will also detail plans to deliver the HP mx2 "daughter-card" technology that will allow it to combine two Itanium 2 processors and a large memory cache into a one-chip module.

The mx2 technology, code-named Hondo, will allow HP to double the number of processors it can pack into an Itanium server and will deliver better performance for applications that require CPU scalability, said Brian Cox, an HP product manager.

HP's new sx1000 chip set will allow the company to build systems much larger than current Intel chip-set technology permits, Cox said. With it, HP is on track to deliver the first Itanium 2-based 64-processor Superdome server in mid-2003, he added.

Because the sx1000 chip set is compatible with HP's PA-8800 RISC architecture, users will be able to upgrade from RISC to Itanium processors within the same unit. HP's Itanium Superdome systems will be able to run HP-UX, Windows and Linux in the same machine. Next year, the company will add support for the OpenVMS operating system on Itanium servers.

HP's mx2 daughter-card technology, meanwhile, will become available sometime early next year, well in advance of Intel's planned launch of a dual-core Itanium processor in 2005, Cox said.

HP is the only major systems vendor that's likely to ship high-end Itanium servers by year's end, analysts said. "But as co-developer of Itanium, that is only something to be expected from HP," said Terry Shannon, editor of the "Shannon Knows HPC" newsletter in Albuquerque, N.M.

wbmw -

it still gets some of the highest SPECfp_rate scores ever recorded.

Yes it does. It should be noted that Unisys has posted CFP2000 Rate scores for a 16-way Itanium2 also. That was in Q4'02. They are the same as the NEC scores.

EP