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I wonder why MMCAP filed this again? Term sheet still not approved and S7 needs MMCAPs agreement. They hold $8.9M of the $12M of debentures, so it would be interesting to see how negotiations are progressing. If S7 can get cash from an asset sale or ABL, it reduces the power/influence of the debenture as they can be paid off...which is why i think they are trying to adjust the terms of the debentures. Power sits with MMCAP and S7s Mgmt and Board being able to negotiate an approval.
Any idea if James knows when Q3 financials are expected to be released?
You have to post the page for the FAQ in the web cache checker.
https://www.spectra7.com/investor-faqs
Using Webnots google cache checker, the S7 FAQ page was updated Oct 12th. That was Monday, before the volume spike of 41M shares and release of Alibaba news on Tuesday, Oct 13th.
This is the primary reason i think the NRs and volume was manufactured to help get the CD holder to dump. Raouf would've worked some type of deal with them. Now the balance sheet should be clean, and more attractive for an ABL.
https://www.webnots.com/seo-tools/google-cache-checker
Keeping my eye on any Sony PS5 teardowns. If the HDMI cable includes the S7 HT8481 chipset; then Raouf actually was right about S7 going into production with a game console for Q4 2020.
Looking at the warrants from June 30/19 statements; there are ~80M $0.05 warrants...which i believe are automatically exercisable if share price stays above $0.08 for 10 trading days. This is good for S7 as it puts money in the bank if that happens, but it does increase dilution...and creates "overhang". Difficult for the stock to breakout above $0.08...really depends on who is holding those warrants and if they flip those newly converted shares. Price will have a lot to chew through before moving higher.
Q3 will be interesting too, as there should be more warrants on there as well. I am guessing $0.05 broker warrants may have been converted and flipped, but we will see with the Q3 financials.
Share structure is important, so looking at it, especially with microcaps is good, as it can provide you with exit and entry points, and what amount to hold. The CD due in Jan 2021 would have bankrupted the company, so the CD holder probably knew this and wanted out. Unfortunately, i have a lot of losses on this stock being a long-term holder and was pumped about the tech and the prospects. Luckily, i was able to flip some buys from 2 - 2.5 cents at 5.5 and 7 cents, guessing 8 cents was going to be the resistance. I still hold a lot more shares that are underwater, but feeling a bit better.
Long story short, it's good to be looking at the share structure!
On another note, these news releases, although have been great, the challenge has been that the market cannot put a firm number on what to expect for revenues. It's all speculation. With any luck, S7 is supplying the HDMI chipset for the cable in the PS5. If that comes out, that is different news. There is a fairly firm number of PS5 being produced per year (~11M). Revenues can be estimated and firmer market cap can be established, which is an easier revenue number to figure out for the broader market then guessing at the number of cables Alibaba and Tencent data centres will use.
Good luck to us!
Alternate exchanges in Canada (i.e. Alpha, Omega, TriAct, etc...)
https://www.stockwatch.com/Quote/Detail?C:SEV
The tunable functionality is the S7 product. There was a few documents from years ago, that mentioned the S7 chipset was "programmed" to learn the unique characteristics of each copper cable and adjust the signal to minimize loss.
https://www.connectorsupplier.com/designcon-2018-review/" rel="nofollow" target="_blank" >https://www.connectorsupplier.com/designcon-2018-review/[taghttps://www.connectorsupplier.com/designcon-2018-review/[/tag]
"their unique signal conditioning chipset"
Tencent Active Cable (TAC). Hope this product gets well used in Tencent data centre's, and their model is copied by others.
Still no idea how much this IP is worth for S7. Market is heavily discounting it. This stock has so much potential to rip (just on hype alone)....but nothing yet. Been a multi-year slide. Need some pro-traders to like the story and get this stock rippin'! 5-10 bagger potential just on hype.
Use Google Translate if needed.
https://cloud.tencent.com/developer/article/1710787
Ocean Tomo this past week had to have themselves recapitalized. Hope that wasn't a distraction for their normal business deals (i.e. S7 ABL).
https://www.globenewswire.com/news-release/2020/04/16/2017404/0/en/Bow-River-Capital-Partners-With-Ocean-Tomo-to-Expand-the-Size-and-Scope-of-the-Intellectual-Capital-Merchant-Banc-Firm.html
S7's latest sales brochure. Slick looking; but still no clue if anyone is buying!
https://ethernetalliance.org/wp-content/uploads/2020/03/Spectra7_Brochure_GC2502_Combined.pdf
3 years ago when GC2502 documentation was first put on the Spectra7, it had a watermark with Jess-Link Products, was marked confidential.
JPC had it on their website as ACC was "coming soon" years ago, then took it down. Looks like they are moving forward with this product has has put it back on.
Good to see.
Not really. If you are an employee, you have taxes withheld and deducted from your salary that the company then remits to the government each pay period.
Stock compensation is a form of salary. You pay ordinary income tax up front, then capital gains when you sell the stock itself. To pay the ordinary income tax, a company could withhold their tax from their regular salary to remit to the government, but that would reduce the employee's take home pay during that pay period. An alternative is to grant the stock, sell a fraction of it for the ordinary tax.
Selling a fraction of the stock to pay the tax for the stock compensation has zero impact on an employees take home pay (this is a good company policy especially if an employee's stock compensation is significantly large and would reduce their take home pay to the point where they may not meet bill payments for the pay period) . The remaining shares are the employee's to sell when they want, and they will be taxed on the capital gain during the year in which they dispose of the shares.
https://www.schwab.com/public/eac/resources/articles/your_stock_awards.html
excerpt from link:
Restricted stock units, unlike restricted stock awards, aren't eligible for an 83(b) election because no stock is actually issued to you when the units are granted (and you can't pay tax on a thing you don't own yet). What you're getting is essentially a promise that on a date in the future, you'll be issued the stock if you've met all the vesting requirements. On that date, you will pay ordinary income tax on the value of the stock. After you've been issued the stock and you sell your shares, you'll either incur a capital gain or a capital loss (cost basis equal to the value of the shares at vesting), which will be treated like any other stock sale.
Tax withholding from the share issuance filed on Feb 21. The company has to withhold the tax portion of the share compensation, and to do this, they dispose of a small portion of what was issued.
Tax man collects up front rather than wait until the calendar year-end.
MM Asset triggered the AMR. They took ~$9M of the convertible debt and at the time, if they converted to shares, it represented 19.19% of the outstanding shares of S7.
Document can be found on www.sedar.com and filed Feb 12, 2018 under Spectra7.
FORM 62-103F3
REPORT UNDER PART 4 OF NATIONAL INSTRUMENT 62-103
Item 1 – Security and Reporting Issuer
1.1 State the designation of securities to which this report relates and the name and address of the head office of the issuer of the securities.
This report relates to the common shares (“Shares”) in the capital of Spectra7 Microsystems Inc. (the “Issuer”).
110 Cochrane Drive Suite 202 Markham, Ontario L3R 9S1
1.2 State the name of the market in which the transaction or other occurrence that triggered the requirement to file this report took place.
Not applicable.
Item 2 – Identity of the Eligible Institutional Investor
2.1 State the name and address of the eligible institutional investor.
MM Asset Management Inc. (“MM Asset”) 66 Wellington Street West
Suite 2707
Toronto, Ontario
M5K 1H6
MMCAP International Inc. SPC (“MMCAP”) is an investment fund advised by MM Asset.
2.2 State the date of the transaction or other occurrence that triggered the requirement to file this report and briefly describe the transaction or other occurrence.
The requirement to file this report was triggered on January 9, 2018 when MM Asset, on behalf of MMCAP, participated in a private placement of convertible debenture units (“Units”) of the Issuer and acquired control and direction over 9,480 Units. Each Unit comprised of $1,000 principal amount of 7% senior unsecured convertible debentures (the “January Debentures”) maturing on January 9, 2021 (the “Maturity Date”) and 1,425 common share purchase warrants (each, a “January Warrant”) of the Issuer. The January Debentures are convertible at the option of the holder into Shares prior to the Maturity Date at a
conversion price of $0.35 per Share. Each January Warrant is exercisable for one Share at a price of $0.50 prior to January 9, 2021.
2.3 State the name of any joint actors. Not applicable.
2.4 State that the eligible institutional investor is eligible to file reports under Part 4 in respect of the reporting issuer.
MM Asset is eligible to file reports under Part 4 of National Instrument 62-103 (“NI 62-103”) in respect of the Issuer.
Item 3 – Interest in Securities of the Reporting Issuer
3.1 State the designation and the net increase or decrease in the number or principal amount of securities, and in the eligible institutional investor’s securityholding percentage in the class of securities, since the last report filed by the eligible institutional investor under Part 4 or the early warning requirements.
Not applicable. This is an initial report filed by MM Asset under Part 4 of NI 62-103 in respect of securities of the Issuer.
3.2 State the designation and number or principal amount of securities and the eligible institutional investor’s securityholding percentage in the class of securities at the end of the month for which the report is made.
At the end of January 2018, MM Asset, on behalf of MMCAP, exercised control and direction over:
(a) 19,971 Shares
(b) January Debentures in the aggregate principal amount of $8,980,000; and
(c) 13,509,000 January Warrants;
representing approximately 19.19% of the Issuer’s 165,058,531 outstanding Shares as reported by the Issuer in its final short form prospectus dated December 28, 2017, calculated on a partially diluted basis.
2
3.3 If the transaction involved a securities lending arrangement, state that fact. Not applicable.
3.4 State the designation and number or principal amount of securities and the percentage of outstanding securities of the class of securities to which this report relates and over which
(a) the eligible institutional investor, either alone or together with any joint actors, has ownership and control,
Not applicable.
(b) the eligible institutional investor, either alone or together with any joint actors, has ownership but control is held by persons or companies other than the eligible institutional investor or any joint actor, and
Not applicable.
(c) the eligible institutional investor, either alone or together with any joint actors, has exclusive or shared control but does not have ownership.
MM Asset exercises control or direction, but not ownership, over all of the securities referred to in item 3.2 above on behalf of MMCAP over which it has discretionary trading authority. MM Asset specifically disclaims any beneficial ownership of the securities referred to herein.
3.5 If the eligible institutional investor or any of its joint actors has an interest in, or right or obligation associated with, a related financial instrument involving a security of the class of securities in respect of which disclosure is required under this item, describe the material terms of the related financial instrument and its impact on the eligible institutional investor’s securityholdings.
Not applicable.
3.6 If the eligible institutional investor or any of its joint actors is a party to a securities lending arrangement involving a security of the class of securities in respect of which disclosure is required under this item, describe the material terms of the arrangement including the duration of the arrangement, the number or principal amount of securities involved and any right to recall the securities or identical securities that have been transferred or lent under the arrangement. State if the securities lending arrangement is subject to the exception provided in section 5.7 of NI 62-104.
Not applicable.
3
3.7 If the eligible institutional investor or any of its joint actors is a party to an agreement, arrangement or understanding that has the effect of altering, directly or indirectly, the eligible institutional investor’s economic exposure to the security of the class of securities to which this report relates, describe the material terms of the agreement, arrangement or understanding.
Not applicable.
Item 4 – Purpose of the Transaction
State the purpose or purposes of the eligible institutional investor and any joint actors for the acquisition or disposition of securities of the reporting issuer. Describe any plans or future intentions which the eligible institutional investor and any joint actors may have which relate to or would result in any of the following:
The securities were acquired in the ordinary course of business, for investment purposes only and not for the purpose of exercising control or direction over the Issuer.
(a) the acquisition of additional securities of the reporting issuer, or the disposition of securities of the issuer;
Depending on market conditions and other factors, MM Asset, on behalf of MMCAP, may in the future increase or decrease its ownership, control or direction over securities of the Issuer through open market transactions, private agreements or otherwise.
(b) a sale or transfer of a material amount of the assets of the reporting issuer or any of its subsidiaries;
Not applicable.
(c) a change in the board of directors or management of the reporting issuer, including any plans or intentions to change the number or term of directors or to fill any existing vacancy on the board;
Not applicable.
(d) a material change in the present capitalization or dividend policy of the reporting issuer;
Not applicable.
(e) a material change in the reporting issuer’s business or corporate structure;
Not applicable.
4
(f) a change in the reporting issuer’s charter, bylaws or similar instruments or another action which might impede the acquisition of control of the reporting issuer by any person;
Not applicable.
(g) a class of securities of the reporting issuer being delisted from, or ceasing to be authorized to be quoted on, a marketplace;
Not applicable.
(h) the issuer ceasing to be a reporting issuer in any jurisdiction of Canada;
Not applicable.
(i) a solicitation of proxies from securityholders;
Not applicable.
(j) an action similar to any of those enumerated above.
Not applicable.
Item 5 – Agreements, Arrangements, Commitments or Understandings With Respect to Securities of the Reporting Issuer
Describe the material terms of any agreements, arrangements, commitments or understandings between the eligible institutional investor and a joint actor and among those persons and any person with respect to securities of the class of securities to which this report relates, including but not limited to the transfer or the voting of any of the securities, finder’s fees, joint ventures, loan or option arrangements, puts or calls, guarantees of profits, division of profits or loss, or the giving or withholding of proxies. Include such information for any of the securities that are pledged or otherwise subject to a contingency, the occurrence of which would give another person voting power or investment power over such securities except that disclosure of standard default and similar provisions contained in loan agreements need not be included
Not applicable.
Item 6 – Change in Material Fact
If applicable, describe any change in a material fact set out in a previous report filed by the eligible institutional investor under the early warning requirements or Part 4 in respect of the reporting issuer’s securities.
Not applicable.
5
Item 7 – Certification
Certificate
The undersigned, as the eligible institutional investor, certifies, or the undersigned, as the agent filing the report on behalf of the eligible institutional investor, certifies to the best of its knowledge, information and belief, that the statements made in this report are true and complete in every respect.
DATED this 12th day of February, 2018.
MM ASSET MANAGEMENT INC.
By: “Hillel Meltz”
Hillel Meltz, President
Yes, they are moving from the TSX to the TSXV (Venture). This kicked off during their last private placement because the raise at the PPS would create >25% of the outstanding float, plus they didn't want to go to shareholders to ask if that was OK (they did that on the prior PP)...so they went to the TSX and said they needed to do it because of Financial Hardship, which triggered their listing review.
They failed to meet the listing review of the TSX, and then made an application (past December) to go to the TSXV. Right now, i don't think they've been delisted or accepted onto the TSXV yet...might be waiting for Annual Audited Financials (they have 90-120 days (i can't remember which) from their fiscal year-end to produce audited financials), and financing.
S7 got onto the equity financing drug (its a helluva drug), up here in Canada. Very greasy relationship once you start, and if you piss off the brokers...well you see the result. From what i see, Tony Stelliga understood the Canadian market a bit better and the importance of that relationship. Raouf, i don't think understood how much influence the brokers have up here on share price, especially if you don't play nicely with them (not going to them with full equity listing, trying to issue equity on your own, only giving them the "public investor" outlook (i.e. all is good, volume production 2019 H2, etc...)).
The debt is from the convertible debentures...issued in Jan 2018. Some was initially converted to shares and it seems that holder started the slide in share price. I think one of the holders of about $7-8M of that debt is MMCAP International (there was a Monthly report posted on www.sedi.com of one of the funds that held S7 convertible debentures...long time ago, Jan, Feb, or Mar 2018).. They are hedge fund managers, and did very well during the Cannabis run. I believe the head guy is from Isreal and does a bit of technology sector investing over there. They are an interesting little outfit. One of the main partners, Matthew MacIsaac, i think, got into a bit of trouble. I'm not sure who holds the current convertible debt, but i suspect it is MMCAP, or MM Asset Management.
https://www.theglobeandmail.com/report-on-business/hedge-fund-manager-faces-cocaine-charge/article1351787/
Long story short: Unless you have good revenues and don't need financing, the Canadian market if very greasy. Raouf didn't understand that, and with break-even potential so far out in the future at the time...this stock got hammered. Nobody loves secrecy, especially the Canadian brokerages who are supporting your equity financing.
Just my perspective from years of following and investing in this company. Better days ahead, but like everything with investing....timing is everything! Good Luck!
The review was triggered when they did the last round of financing. I am not sure on the specific requirements they need to come into compliance with, but i suspect capitalization of the company is one. Here is a decent PDF on it:
http://www.goodmans.ca/files/file/docs/04.29.2009%20Corp%20Sec%20Update.pdf
This is all new to me. I suspect that if they are delisted from the TSX, they can be listed on the TSXV (Venture). I don't believe that impacts the OTC grey market.
This delisting review may help accelerate a move to the NASDAQ, if they can find some big money investors to support them in the US. Will be interesting to see what happens next week.
CES starts on Tuesday. S7 has attended in the past (private meetings); so will be interesting to see if they have any presence this year. Also keeping an eye on Foxconn, Luxshare, Amphenol, Molex, and others to see if they are there doing private meetings.
I am interested in Sony and if they will be making any teaser announcements about PS5 or the PSVR2.
S7 has a booth for DesignCon at the end of the month. This will be an interesting conference, as i am personally hoping they reveal information on any new sectors they may be entering (i.e. automotive infotainment), or development of the next generation cables (i.e. 800G).
Excited and also nervous about this upcoming week (i.e. delisting review). GLTA
I wonder if this patent was necessary for AR (specifically the Nreal glasses...and potentially Apple)
Method And System For Mitigating The Effects Of A Transmitted Blocker And Distortions Therefrom In A Radio Receiver
Apple plans iPhone-tethered AR glasses for 2020
Back in 2017, a concrete report suggested that Apple was working on augmented reality glasses with a target release date of 2020. As the date draws near, a research note suggests that the accessory is still coming next year — albeit with a new wrinkle. Respected analyst Ming-Chi Kuo (via Economic Daily News) now says that the AR glasses will depend heavily upon a tethered iPhone and will serve largely as a display.
Kuo’s report appears to differ from those filed previously by Bloomberg’s Mark Gurman, who said in November 2017 that prototypes of Apple’s AR device were running on a custom version of iOS internally dubbed “rOS,” short for “reality operating system.” The report suggested that the AR device would differ from VR headsets that used smartphones as their processing engines and screens.
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According to Kuo, however, the iPhone will handle everything from computing and networking to indoor and outdoor positioning for the AR solution — a significant offloading of processing akin to last year’s Magic Leap One and more recently shown Nreal AR glasses, which require users to wear or carry small, physically tethered computing devices as they walk.
Using an iPhone for processing would be a practical compromise for Apple and follow a recently announced Qualcomm initiative to use Snapdragon 855-powered 5G smartphones as “XR Viewers.” Apple’s past key modem supplier is now helping Android device makers develop lightweight AR/VR glasses that tether to phones for everything from processing to networking, location services, and local storage. Prices for the headsets have not yet been announced but would certainly be much lower than the $2,300 to $3,500 asking prices of Magic Leap One and Microsoft’s HoloLens 2, which include their own computers.
Apple has made no secret of its intentions in the AR space. CEO Tim Cook has openly spoken of his belief that AR will be a critically important future technology and has multiple times hinted at Apple’s work on initiatives past its ARKit software for iPhones. The company also acquired AR lens company Akonia Holographics and reportedly twice made efforts to buy Leap Motion, a maker of novel hand tracking solutions for extended reality devices. Most recently, it appointed a dedicated marketing chief for AR, a necessary step in the lead-up to a hardware release.
As is always the case with upcoming Apple products, however, it’s advisable to take each report’s details with a grain or two of salt. Beyond Kuo’s and Gurman’s reports, Cnet claimed last April that Apple was developing an ultra-high-spec AR device with dual 8K displays, 5-nanometer chips, and 802.11ay Wi-Fi to wirelessly connect to a dedicated Mac-like processing unit. Even by Apple rumor standards, the story was hard to take seriously because most of the named technologies weren’t expected to be ready for a commercial product by the claimed 2020 release date.
By contrast, an iPhone-tethered AR headset would be entirely achievable over the next year. Kuo expects that it will be mass-produced sometime between the fourth quarter of 2019 and the second quarter of 2020, making a 2020 release date entirely possible.
https://venturebeat.com/2019/03/10/ar-is-going-to-kill-the-maps-blue-dot/
Given that S7 seems to have the right chipset for tethered VR and even AR headsets (i.e. NReal), and have an established relationship with 2 of Apple's hardware suppliers (Foxconn and Luxshare-iCT)...i think there could be a good chance S7 is used in Apple's tethered AR glasses.
Crossing fingers and hoping!
Luxshare-ICT and Innovium Announce Interoperability of DAC, Active Copper Cable and Active Optical Cable with TERALYNX(TM) Switch
Email Print Friendly Share
March 01, 2019 19:58 ET | Source: Luxshare-ICT
MILPITAS, Calif., March 01, 2019 (GLOBE NEWSWIRE) -- Luxshare-ICT, low power connectivity solutions for 100G, 200G, and 400G port enabled networks and Innovium, Inc., a leading provider of networking switch solutions for data centers, today announced the successful interoperability of Direct Attached Cables (DAC), Active Copper Cables (ACC), and Active Optic Cables (AOC) connectivity solution with Innovium’s industry-leading 12.8Tbps TERALYNX™ switch silicon. The companies will demonstrate their products live at Optical Fiber Communications Conference and Exhibition (OFC), to be held March 5-7, 2019 at the San Diego, CA Convention Center.
“As customers migrate from today’s installed base of 3.2T switches to Innovium’s 12.8T switches with industry’s highest radix and performance, customers are looking for cost-effective connectivity across 3-5 adjacent racks. Direct attach cables (DAC), Active copper cables (ACC) and Active optical cables (AOC) enable data center customers to deploy these switches for maximum flexibility and bandwidth, while controlling connectivity cost ”, said Amit Sanyal, VP of Product Management and Marketing at Innovium. “Innovium, the only provider of a low-latency, programmable 12.8Tbps switch silicon in the market, is excited to partner with Luxshare-ICT to announce the successful 100-400GbE interoperability with Luxshare's portfolio of DAC, ACC and AOCs.”
“We are excited to partner with Innovium to demonstrate the performance of our unique interconnect technologies designed with advanced features to achieve the speed, signal integrity, EMI containment and thermal efficiencies needed to ramp up to next-generation equipment and networking platforms, This collaboration highlights our vision to build relationships that benefit our customers and partners, and provide flexible solutions to their toughest challenges,” said Henning Hansen, Luxshare-ICT, VP Global sales & advanced technologies.
“Spectra7 is integral in helping to drive the future of the data center interconnects industry, and we are proud to be collaborating with them to demonstrate next-generation high-speed Active Copper Cable solutions,” said Jinhua Chen, Data Center GM at Luxshare-ICT.
TERALYNX offers the world’s fastest 12.8 Terabits/sec throughput while delivering line-rate programmability, large on-chip buffers, breakthrough telemetry, and low-latency. TERALYNX supports 10GbE to 400GbE Ethernet and delivers 128 ports of 100GbE, 64 ports of 200GbE or 32 ports of 400GbE in a single device. Innovium’s patented ground-up design in TERALYNX provides customers clear advantages in programmability, robust tunneling, low latency, power efficiency, and advanced analytics/telemetry that are essential for scale data-centers.
About Luxshare-ICT
With a global manufacturing foot print and R&D offices in California, Taiwan, and Qingxi, Dongguan, Luxshare-ICT delivers breakthrough interconnect solutions that scale bandwidth and deliver end-to-end signal integrity in next-generation platforms requiring single-lane rate 25G, 50G, and 100G connectivity. Since its inception, Luxshare has consistently delivered breakthroughs in interconnect technology including the delivery of the industry’s first 3 meter passive QSFP-DD 400G, as well as the delivery of the industry’s first 400G PAM4 AOC. Luxshare's unique, patented Optamax twinax cables as well as highly automated manufacturing process is the foundation for its high performance and low power at these accelerated bandwidth rates.
About Spectra7 Microsystems Inc.
Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with design centers in Cork, Ireland, and Little Rock, Arkansas. For more information, please visit www.spectra7.com.
About Innovium
Innovium is a leading provider of high performance, innovative switching silicon solutions for data centers. Innovium TERALYNX™ family delivers software compatible products ranging from 3.2Tbps to 12.8Tbps with unmatched power efficiency, radix, programmability, buffers and low latency. Innovium team members have a highly successful track record in delivering several generations of widely deployed data center products. The company is headquartered in Silicon Valley, California and is backed by leading venture capital firms including Greylock Partners, Walden Riverwood, Capricorn Investment Group, Qualcomm Ventures, S-Cubed Capital and Redline Capital. For more information, please visit: www.innovium.com.
Media Contact: Mike Kao, mike.gao@luxshare-ict.com
http://www.globenewswire.com/news-release/2019/03/02/1745602/0/en/Luxshare-ICT-and-Innovium-Announce-Interoperability-of-DAC-Active-Copper-Cable-and-Active-Optical-Cable-with-TERALYNX-TM-Switch.html?culture=en-us
Thanks for recording and posting the presentation!
From what i heard, i believe the VR headset they are now in is for a gaming console...and it will be incorporated in the "refresh" of the headset. The only headset for a gaming console that i am aware of is Sony's PSVR.
I know they were working with Sony in the past, so maybe it has finally come to fruition. Raouf did mention that the new headsets typically come out for Christmas. Since there hasn't been any mention about a new PSVR headset this year, i suspect this may be for Christmas 2019 (just a guess).
Found this cruising the internet...
I think this was to be released on Monday, Nov 12th, probably to coincide with a Q3 release.
http://www.10gtek.com/news1302.html
News Center
10Gtek Launchs 200G&400G SR8 and ACC with Spectra7 Technology at SC18
Leading Data Center Interconnect Manufacturer and Online Retailer (10Gtek)
Introduces Active Copper Cables at SC18
Dallas, TX – November 12th, 2018 – 10Gtek, as a leading data center interconnect supplier and online retailer, shows at SC18 launching more new technologies. Besides the most accepted 10G/25G/40G/100G transceivers, optical and copper cables, 10Gtek brings samples of 200G&400G QSFP-DD, like SR8 module, QSFP-DD loopback, QSFP-DD DAC cable etc. Also, high density panel application for data center MPO Cassette has displayed, which employs the patented adapters with auto anti-dust design. Check all details, welcome booth #4419.
And, Spectra7 Microsystems Inc. (TSX:SEV) (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, today announced that 10Gtek has begun offering active copper cables (ACCs) using Spectra7’s revolutionary GaugeChangerTM technology. Additionally, 10Gtek ACC cables with Spectra7 technology will be showcased at the SuperComputer 2018 (SC18) show at the Kay Bailey Hutchison Convention Center in Dallas, TX from November 12-15.
GaugeChangerTM is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25Gbps NRZ and 50Gbps PAM4 enabling new connector standards of 100/200/400 Gbps.
10Gtek is a top-10 manufacturer of passive direct attached cables (DACs) used in data center applications. 10Gtek's DAC offerings include: SFP28, QSFP28 and soon QSFP-DD. Bringing together this technology and know-how with Spectra7’s GaugeChangerTM embedded ICs offers up to 12 times less power and significant cost savings over optical solutions for data center customers.
"Spectra 7 has created a revolutionary solution to address the dramatically increasing power and cost of data center interconnects " said Alan Wong, General Manager at 10Gtek. “We are pleased to be moving forward on several new designs with Spectra7 based on our technology assessment and customer interest.”
"10Gtek is a leading supplier and online retailer in the data center interconnect market," said Spectra7 CEO Raouf Halim. "The adoption of our GaugeChangerTM technology by 10Gtek will offer us a strong sales channel into the enterprise and HPC data center markets."
10GTek will be showcasing products with Spectra7’s GaugeChangerTM technology at Booth #4419.
About 10Gtek
10Gtek Transceivers Co., Ltd is a leading high speed cable and transceiver supplier in China, who designs, manufactures and sells direct attach copper cables and optical transceivers (10G/40G/100G). We focus on the development of high reliability and cost efficient interconnect solution, providing the best-of-breed copper or optical modules for customers in areas such as cloud computing, data centers, data communication, long-distance transmission, wireless access, etc. Our valued proposition is our leading-edge optical component and packaging technology, high speed cable design know-how and unique low-cost testing capability. For more information, please visit www.10gtek.com
About SC18
SC18 is the world’s largest marketplace for HPC and networking professionals, attracting scientists, engineers, software developers, policy makers, corporate managers, CIOs, and IT administrators from universities, industry, and government agencies worldwide. For exhibitors, no other event provides such extensive opportunities for exposure and in-depth interaction with key audiences as more than 12,000 attendees from around the world convene in Dallas to discover the latest innovations in HPC, networking, storage, and analysis. For more information, please visit sc18.supercomputing.org
About Spectra7 Microsystems Inc.
Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with design centers in Markham, Ontario, Cork, Ireland, and Little Rock, Arkansas. For more information, please visit www.spectra7.com.
Spectra7 Partners with Molex on Active Copper Data Center Interconnects
https://www.businesswire.com/news/home/20181108005176/en/Spectra7-Partners-Molex-Active-Copper-Data-Center
Luxshare-ICT is starting to promote their new ACC! I am guessing S7 has passed all of their tests and is ready for mass production.
Look at the slides and you will notice the "advantages" and the power consumption graph are the same key talking points in S7's corporate presentation.
https://www.linkedin.com/in/jiao-xu-06349a69/detail/recent-activity/
Things are looking up!
That is pretty amazing! I would be shocked if the hyperscalers are not looking at S7's ACC DACs. OPEX savings alone would drive huge bottom line gains per data center.
Just reading Amazon is looking at producing white-box switches in the next 18 months. All the DC hardware companies share price took a hit yesterday (i.e. Cisco, Juniper, etc...).
If the lower cost (over optical), lower power consumption, and thinner cable; are significant advantages, no reason why Amazon wouldn't want to also extend their reach into DC cables with S7 enabled cables. Zhejiang Zhaolong Interconnect would be perfect to be the supplier.
My comments sound a bit pumperish, but not intending....i haven't found anything that provides a direct link of Spectra7 to Amazon.
Spectra7/Amphenol demo at DesignCon 2018
3 Board members and 1 Management team member were the insiders on the PP.
Good to see the VP of DC (Ebrahim Abunasrah) invest $65K. Says a lot about his confidence in the success of S7 within the DC market (especially at these levels).
Source: www.sedi.ca
Not all of management was able to partake (initially indicated in earlier NR that management was to take over $700K of PP); so i assume there may be another PP in a few months...as current cash flows and PP is not going to sustain S7 past September, unless they sell the IP they were talking about last year or start getting some major sales.
I think good things are on the horizon with DC cables.
This company is using and has started selling Spectra7 chips within it's data center cables. They call the analog chip "SEMI-ACC" instead of "Guagechanger". They just recently revamped their website last month and seem to have "elevated" their online presence.
http://web.zhaolong.com.cn:8080/zhaolong/wbx
Download a few of the data center publications and you will see all of the different cables and the ones that are using the "SEMI-ACC" analog chip. The thinness of this cable is 38AWG, or 3.8mm in diameter same as indicated on S7's website.
The real clue that it is Spectra7 chips is this (found under the "Innovation" section):
Based on SEMI-ACC technology and TWINAX technology (the world's smallest QSFP was released at Designcon in the US in January 2016, the OD is only 3.8 mm. The data center construction can achieve higher wiring density while lowering costs, and has better performance in use. Performance, high reliability, and better latency, QSFP PAM4 200G solution, QSFP28 100G solution, SFP28 25G solution, QSFP+40G solution, SFP+10G solution
Spectra7 first brought the GuageChanger chips to DesignCon in 2016.
I think Spectra7 is doing everything they need to to get the GuageChanger tech launched. The last NR indicated demand was ramping up, and the presentation updated to remove revenue from DC products expected in 2H to in 2018. Maybe that was an indication that revenues from non-prototype DC cables will begin here in Q2?
Let's hope this will be the start of the climb back up!
I think they know who is unloading, and they are not going to provide them with good news until they are done unloading. Usually we have prelim quarterly revenues 1-2 weeks after quarter close (Dec 31). So far nothing...i think it was deliberate as it's a giant "don't let the door hit you on the way out" goodbye; and a big "WELCOME" to the new holder(s). Plus, the seller would've been a massive resistance on any good news...as we saw with the Amphenol/Foxconn/Luxshare-ICT releases.
On the Canadian www.sedar.com site; a big player named MMCAP took a significant position in January.
I think this is a "changing of the guards" moment before the DC products fly.
I use "I think" a lot...so all of the above is a big ol' guess! lol
On the TSX, S7 does over 6M shares in volume with a spike to $0.44CDN on news that a TSX Venture (Global Blockchain Technologies) company invests $2M into S7. Drifts back down to low $0.30'sCDN within a few days. Now news that S7 is partnering with Amphenol, Foxconn, and Luxshare, and those companies are demonstrating S7 tech in their cables...and stock continues to tank.
Something is not right. Fundamentally they are ready to go...cashed up, partnered up, and ready to go! Potential for S7 has never been higher.
I wonder if this is a few whales accumulating (not retail, as it looks like trading programs are working on the TSX)? Killing sentiment. Only a guess.
So far, 3 of the top 10 connector manufacturers using Spectra7's GuageChanger technology.
From Connector Supplier.
http://www.connectorsupplier.com/2017-top-10-connector-manufacturers-2016-sales/
Spectra7 and Amphenol ICC Showcase 100/200/400 Gbps Data Center Interconnects at DesignCon
World's Second Largest Connector and Cable Manufacturer adopts GaugeChanger™ Active Copper Solutions
SAN JOSE, CALIFORNIA--(Marketwired - Jan. 30, 2018) - (TSX:SEV) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and Amphenol ICC ("Amphenol") a major producer of electronic and fiber optic connectors, cable and interconnect systems will be demonstrating their latest data center cable products using Spectra7's GaugeChanger™ active copper technology at the DesignCon 2018 expo on January 31 through February 1 in Santa Clara, California.
"Spectra7 has developed unique technology that not only helps extend data center copper based cable solutions but also minimizes cable bulk which aids in cable routing and maximizes system air flow," said Brian Kirk, director of engineering for HSIO products at Amphenol ICC. "The demonstrations at DesignCon will highlight the key advantages of Spectra7's technology in our interconnect products."
"Amphenol is a leader in the data center interconnect solutions market," said Spectra7 CEO Raouf Halim. "These joint demonstrations at 100/200/400 Gbps showing both NRZ and PAM4, are another major milestone in the validation of our data center technology."
Amphenol will be showcasing products with Spectra7's GaugeChanger™ technology at Booth #833.
Spectra7 will be showcasing its GaugeChanger™ technology at Booth #851.
ABOUT AMPHENOL
Amphenol ICC, a division of Amphenol, is a world leader providing interconnect solutions for the Information, Communications and Commercial electronics markets. Amphenol designs and manufactures a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, networking, industrial, business equipment and automotive. With a global presence in R&D, manufacturing and sales, Amphenol is well positioned to support its customers wherever they operate. For more information, please visit www.amphenol-icc.com.
ABOUT DESIGNCON
Now in its 22nd year, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities. Taking place annually in Silicon Valley, DesignCon was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more. For more information, visit www.designcon.com.
ABOUT GAUGECHANGER™
GaugeChanger™ is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25Gbps NRZ and 50Gbps PAM4 enabling new connector standards of 100/200/400 Gbps.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with design centers in Markham, Ontario, Cork, Ireland, and Little Rock, Arkansas. For more information, please visit www.spectra7.com.
CAUTIONARY NOTES
Certain statements contained in this press release constitute "forward-looking statements". All statements other than statements of historical fact contained in this press release, including, without limitation, those regarding the Company's future financial position and results of operations, strategy, proposed acquisitions, plans, objectives, goals and targets, and any statements preceded by, followed by or that include the words "believe", "expect", "aim", "intend", "plan", "continue", "will", "may", "would", "anticipate", "estimate", "forecast", "predict", "project", "seek", "should" or similar expressions or the negative thereof, are forward-looking statements. These statements are not historical facts but instead represent only the Company's expectations, estimates and projections regarding future events. These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict. Therefore, actual results may differ materially from what is expressed, implied or forecasted in such forward-looking statements. Additional factors that could cause actual results, performance or achievements to differ materially include, but are not limited to the risk factors discussed in the Company's annual MD&A for the year ended December 31, 2016. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and cautions investors not to place undue reliance on forward-looking information. Consequently, all of the forward-looking statements made in this press release are qualified by these cautionary statements and other cautionary statements or factors contained herein, and there can be no assurance that the actual results or developments will be realized or, even if substantially realized, that they will have the expected consequences to, or effects on, the Company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except as required by law.
References
1. "2017 Top 10 Connector Manufacturers by 2016 Sales" (2017 Edition), Bishop Connector Report (online).
Spectra7 and Foxconn, the World's Largest Contract Electronics Manufacturer, Showcase Data Center Interconnects at DesignCon
Foxconn Demonstrates GaugeChanger(TM) Active Copper Solutions in its Latest Offerings
SAN JOSE, CALIFORNIA--(Marketwired - Jan. 29, 2018) - (TSX:SEV) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and Foxconn Interconnect Technology Ltd. ("FIT"), a leading supplier of interconnect solutions, will be demonstrating their latest data center cable products using Spectra7's GaugeChanger™ active copper technology at the DesignCon 2018 expo on January 31 through February 1 in Santa Clara, California.
"Spectra7 is a key technology partner for our high speed and high-density interconnect solutions," said Yan Margulis, VP Sales and Marketing at FIT. "We believe that the demonstrations at DesignCon will be well received by our customers."
"Foxconn is a leader in the data center interconnect market," said Spectra7 CEO Raouf Halim. "These joint demonstrations at 100/200/400 Gbps showing both NRZ and PAM4, are another major milestone in the validation of our data center technology."
VISIT SPECTRA7 AND FOXCONN AT DESIGNCON
Foxconn Interconnect Technology will be showcasing products with Spectra7's GaugeChanger™ technology at Booth #306.
Spectra7 will be showcasing its GaugeChanger™ technology at Booth #851.
ABOUT FOXCONN INTERCONNECT TECHNOLOGY LIMITED
Foxconn Interconnect Technology Ltd. focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT's website: fit-foxconn.com/.
ABOUT DESIGNCON
Now in its 22nd year, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities. Taking place annually in Silicon Valley, DesignCon was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more. For more information, visit www.designcon.com.
ABOUT GAUGECHANGER™
GaugeChanger™ is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25Gbps NRZ and 50Gbps PAM4 enabling new connector standards of 100/200/400 Gbps.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with design centers in Markham, Ontario, Cork, Ireland, and Little Rock, Arkansas. For more information, please visit www.spectra7.com.
CAUTIONARY NOTES
Certain statements contained in this press release constitute "forward-looking statements". All statements other than statements of historical fact contained in this press release, including, without limitation, those regarding the Company's future financial position and results of operations, strategy, proposed acquisitions, plans, objectives, goals and targets, and any statements preceded by, followed by or that include the words "believe", "expect", "aim", "intend", "plan", "continue", "will", "may", "would", "anticipate", "estimate", "forecast", "predict", "project", "seek", "should" or similar expressions or the negative thereof, are forward-looking statements. These statements are not historical facts but instead represent only the Company's expectations, estimates and projections regarding future events. These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict. Therefore, actual results may differ materially from what is expressed, implied or forecasted in such forward-looking statements. Additional factors that could cause actual results, performance or achievements to differ materially include, but are not limited to the risk factors discussed in the Company's annual MD&A for the year ended December 31, 2016. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and cautions investors not to place undue reliance on forward-looking information. Consequently, all of the forward-looking statements made in this press release are qualified by these cautionary statements and other cautionary statements or factors contained herein, and there can be no assurance that the actual results or developments will be realized or, even if substantially realized, that they will have the expected consequences to, or effects on, the Company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except as required by law.
References
1. "The MMI Top 50 for 2017" (2017) Manufacturing Market Insider (online).
Spectra7 Microsystems Inc.
Sean Peasgood
Investor Relations
416-565-2805
ir@spectra7.com
Spectra7 Microsystems Inc.
Darren Ma
Chief Financial Officer
669-284-3170
pr@spectra7.com
News Provided by Marketwired via QuoteMedia
Spectra7 Partners with Luxshare-ICT, China's Largest Connector and Cable Manufacturer, at DesignCon
Luxshare Adopts GaugeChanger(TM) Active Copper Solutions
SAN JOSE, CALIFORNIA--(Marketwired - Jan. 29, 2018) - (TSX:SEV) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and Luxshare-ICT Inc. ("Luxshare"), a global designer and manufacturer of cable assembly and connector products, will be demonstrating their latest data center cable products using Spectra7's GaugeChanger™ active copper technology at the DesignCon 2018 expo on January 31 through February 1 in Santa Clara, California.
"Spectra7 is integral in helping to drive the future of the data center interconnects industry, and we are proud to be collaborating with them to demonstrate next-generation high-speed solutions," said Steve Burke, VP, Sales and Marketing at Luxshare-ICT. "This collaboration highlights our vision to build relationships that benefit our customers and partners, and provide flexible solutions to their toughest challenges."
"Luxshare's data center cable design team is world class, and we are extremely proud to be working with them," said Spectra7 CEO Raouf Halim. "The joint collaboration on 100/200/400 Gbps NRZ and PAM4 solutions is another major milestone in the validation of our data center technology."
VISIT SPECTRA7 AND LUXSHARE-ICT AT DESIGNCON
Luxshare-ICT will be showcasing products with Spectra7's GaugeChanger™ technology at Booth #717.
Spectra7 will be showcasing its GaugeChanger™ technology at Booth #851
ABOUT LUXSHARE-ICT
Luxshare-ICT (Shenzhen Stock Code:002475) is a global designer and manufacturer of cable assembly and connector system solutions for consumer, automotive, cloud, and enterprise applications. Dedicated to flexible design, agile manufacturing, and collaborative partnerships, Luxshare-ICT works with technology leaders to create innovative solutions that transform our industries. For more information, please visit http://en.luxshare-ict.com.
ABOUT DESIGNCON
Now in its 22nd year, DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities. Taking place annually in Silicon Valley, DesignCon was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more. For more information, visit www.designcon.com.
ABOUT GAUGECHANGER™
GaugeChanger™ is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25Gbps NRZ and 50Gbps PAM4 enabling new connector standards of 100/200/400 Gbps.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with design centers in Markham, Ontario, Cork, Ireland, and Little Rock, Arkansas. For more information, please visit www.spectra7.com.
CAUTIONARY NOTES
Certain statements contained in this press release constitute "forward-looking statements". All statements other than statements of historical fact contained in this press release, including, without limitation, those regarding the Company's future financial position and results of operations, strategy, proposed acquisitions, plans, objectives, goals and targets, and any statements preceded by, followed by or that include the words "believe", "expect", "aim", "intend", "plan", "continue", "will", "may", "would", "anticipate", "estimate", "forecast", "predict", "project", "seek", "should" or similar expressions or the negative thereof, are forward-looking statements. These statements are not historical facts but instead represent only the Company's expectations, estimates and projections regarding future events. These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict. Therefore, actual results may differ materially from what is expressed, implied or forecasted in such forward-looking statements. Additional factors that could cause actual results, performance or achievements to differ materially include, but are not limited to the risk factors discussed in the Company's annual MD&A for the year ended December 31, 2016. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and cautions investors not to place undue reliance on forward-looking information. Consequently, all of the forward-looking statements made in this press release are qualified by these cautionary statements and other cautionary statements or factors contained herein, and there can be no assurance that the actual results or developments will be realized or, even if substantially realized, that they will have the expected consequences to, or effects on, the Company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except as required by law.
References
1. "2017 Top 10 Connector Manufacturers by 2016 Sales" (2017 Edition), Bishop Connector Report (online).
Spectra7 Microsystems Inc.
Sean Peasgood
Investor Relations
416-565-2805
ir@spectra7.com
Spectra7 Microsystems Inc.
Darren Ma
Chief Financial Officer
669-284-3170
pr@spectra7.com
News Provided by Marketwired via QuoteMedia
Luxshare-ICT collaboration with Spectra7
$11B+ USD Market Cap
50,000+ employees
Ranked 1st in China (not sure in what though lol ).
AWESOME!
https://www.prnewswire.com/news-releases/luxshare-ict-to-demonstrate-latest-high-speed-data-center-solutions-in-collaboration-with-spectra7-at-designcon-2018-300588452.html
New product line!
November 16, 2017 08:30 ET
Spectra7 Increases Efficiency of Blockchain Processing with new BCI-2500 Product Line
Innovative Active Copper Interconnects Dramatically Reduce Power Requirements in Blockchain Data Centers
SAN JOSE, CALIFORNIA--(Marketwired - Nov. 16, 2017) - Spectra7 Microsystems Inc. (TSX:SEV) ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, today announced a new product line optimized for blockchain processing data centers. BCI-2500 is a high-performance, scalable, low-power, and cost-effective product supporting interconnects from 25 to 400Gbps.
"We're extremely excited to bring our technology to this high-value market," said Spectra7 CEO Raouf Halim. "The blockchain processing market is forecasted to grow at a 61.5% CAGR to $2.3 billion by 2021(1). This is a huge opportunity for us to leverage our existing data center active copper cable silicon technology and quickly expand into this strategic market with products set to go into production in 2018."
Data centers focused on blockchain processing are extremely dedicated to network and computational efficiency. Spectra7's BCI-2500 products enable copper cables up to three times the reach of passive copper cables at dramatically lower power levels than alternative solutions.
Spectra7's BCI-2500 product line is the market's first to address the specific needs of data centers running blockchain applications including Bitcoin mining. Bringing its unique signal processing technology to the critical interconnect layer of the data center, Spectra7 offers the following benefits to
Blockchain systems:
Breakthrough Low Power - Up to 80% less power consumption than competing solutions.
High Performance - Scalable server and switch line rates from 25Gbps to 400Gbps.
Low Cost - Typically 50% the cost of competing solutions.
Spectra7 Blockchain and Data Center Market Highlights:
Several blockchain leaders in North America and Asia are currently evaluating Spectra7's BCI-2500 and GaugeChanger Plus™ products for their new data centers.
The Company received its first prototype orders for GaugeChanger Plus™ in Q3 2017.
The Company continues to expect data center revenue to ramp up in 2018.
(1) Reference Markets and Markets, Global Forecast to 2021
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with design centers in Markham, Ontario, Cork, Ireland, and Little Rock, Arkansas. For more information, please visit www.spectra7.com.
Q3 THUD!
Spectra7 Announces Preliminary Third Quarter 2017 Results
Delayed Shipments Expected to Impact Q3 Results; Industry Veteran Joins as Vice President of Operations
SAN JOSE, CALIFORNIA--(Marketwired - Oct. 10, 2017) - Spectra7 Microsystems Inc. (TSX:SEV) ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, today announced preliminary selected unaudited financial results for the three month period ended September 30, 2017. Unless otherwise indicated, all dollar amounts in this press release are expressed in US dollars.
Preliminary Q3 2017 Results
The Company expects to report revenues for the quarter ended September 30, 2017 of approximately $2.0 million1 as compared to $1.0 million in the same period in the prior year, representing a 100% year-over-year increase in revenue, but a 35% decline from the quarter ended June 30, 2017. The Company encountered manufacturing delays and supply-side push outs late in the quarter, affecting its ability to meet demand and consequently impacting third quarter revenue. These supply chain issues are now being resolved. Demand remains robust, however, and the Company expects to return to a normal shipping schedule in the fourth quarter of 2017. Gross margin2 as a percentage of revenues is projected to fall within the range of 55-58%, reflecting new product ramp-up costs. Operating expenditures for the Company, excluding non-cash items, are expected to increase by $0.3 million from the prior quarter, stemming from one-time prototype build costs.
1 All information herein is subject to change based on the reported unaudited Q3 results, expected in November 2017.
2 Additional GAAP Measure - Gross margin is presented in this press release consistent with
information presented in the Company's financial statements. Gross margin has been calculated by deducting manufacturing cost of sales, and provision for inventory write-downs from revenue. Management of the Company believes that providing this information allows investors to better understand the Company's historical and future financial performance.
CEO Commentary
"Production ramp issues and supply constraints left unfilled orders on the books as the quarter ended", said Spectra7 CEO Raouf Halim. "We want to emphasize that this was a supply-driven issue during the quarter, and that our customers remain committed. We are working diligently to complete and ship these unfilled orders early in the fourth quarter".
Semiconductor Veteran Joins as Vice President of Operations
Spectra7 is pleased to announce that Antony Ng Yukshing is joining the Company as Vice President of Operations. Mr. Ng Yukshing joins Spectra7 from Marvell Technology Group, a company focused on network infrastructure, storage, and wireless solutions, where his most recent role was Senior Director of the Operations Group. Mr. Ng Yukshing joined Marvell in 2005, and previously spent over 10 years as a semiconductor designer at Cypress Semiconductor. He is experienced in scaling semiconductor and system level product lines, such as Wi-Fi modules and enterprise storage solutions, into multi-hundred-million-dollar businesses. Mr. Ng Yukshing has a BEng (Hons) in Electronic and Electrical Engineering from King's College London (UK) and a MSc in Microelectronics from Brunel University London (UK).
"I'm excited to be joining Spectra7 Microsystems, given its large market opportunities in the high-performance analog semiconductor market," said Mr. Ng Yukshing. "Over my career, I've been selective with the companies that I've worked with and I have focused on businesses like Spectra7 that have large scale potential."
"We are pleased that a respected industry veteran like Antony is joining Spectra7 as VP of Operations," said Mr. Halim. "Antony brings decades of semiconductor industry experience that will be critical to Spectra7 manufacturing operations going forward."
Good chance S7 is now counting the PSVR as one of it's headsets.
https://www.vrfocus.com/2017/10/new-playstation-vr-headset-design-revealed/
The clue that the PSVR has an embedded chipset for the cable is in this comment:
Spectra7 Leads Industry in HDMI 2.0 Chip Sales with Over One Million HT8181 Devices Shipped
Retailers Report 2017 as Strong Year for 4K Displays
SAN JOSE, CA--(Marketwired - September 19, 2017) - Spectra7 Microsystems Inc. (TSX: SEV) ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, today announced that it expects to ship its 1,000,000th HT8181 based device this month. Spectra7's HT8181 IC is the industry's most popular solution for extending the length and reducing the cable gauge for interconnects ranging from HDMI Cables to AR/VR/MR tethered solutions.
"We expect the announcement of Apple's 4K TV last week to further drive demand for our HDMI 2.0 products," said Spectra7 CEO Raouf Halim. "Spectra7's HT8181 has proven to be the industry's highest performance, lowest power, smallest footprint solution and is being adopted broadly."
According to leading industry analyst Futuresource in their latest Worldwide TV Market Report, 4K Ultra-high Definition (UHD) sales will account for one third of all TV sales by the end of 2017. Furthermore, UHD Blu-ray sales are expected to grow by 148% this year.
Spectra7's HT8181 is a cable embedded chip capable of reducing cable diameter, weight, and gauge while delivering the high resolution, high frame rate and high dynamic range video called for in the latest HDMI 2.0 specification. Spectra7 is a leader in active copper cable (ACC) technology with a strong patent portfolio covering core technology necessary for delivering active cables.
http://www.marketwired.com/press-release/spectra7-leads-industry-hdmi-20-chip-sales-with-over-one-million-ht8181-devices-shipped-tsx-sev-2234191.htm
Another poster on a different website identified that the Xbox One X will support MR headsets in 2018. That's huge when Spectra7 is used in every Windows MR headset (as per latest NR).
http://www.techradar.com/news/xbox-one-x-everything-we-know-about-project-scorpios-final-form
Microsoft's estimate of there being 80million MR headsets by 2020....may not be such a stretch after all!