Register for free to join our community of investors and share your ideas. You will also get access to streaming quotes, interactive charts, trades, portfolio, live options flow and more tools.
OT: Sheer determination. I used to think it was a matter of physics like the Pythagorean theorem in an anti gravitational trajectory resulting from his incredible sprinting speed and phenomenal leaping ability coupled with a fine touch and concentration that allowed his very fingertips to control the ball in a perfectly timed and executed feat unparalleled in all of the time continuum. ... Yeah, I see what your saying.
Hey, have you watched that MJ slam......really close? I mean real, real close? Look at the middle of the leap. Kinda has a burst of speed that took him to where he needed to be in the air to make it possible. From the looks of it, he did not have enough lift on take-off to do it.....something inside of Jordan seemed to push him higher than his legs alone. See what I'm saying?
Well, since it is a church, then my answer has to be ..... No Doubt.
Say hey CB. Is there a pot of gold in that steeple? EOM
Just stopping in to say "Hi".
You look like you really have a nice stock on your hands. I've got it on my watch list, and will be checking in from time to time.
See ya at the NC Fight Club.
Thanks for stopping by Big. I still can't get over the find of the companies they are working with and who they hope to secure as initial customers, Excerpt from Form 8K "Surfect’s miscellaneous revenue to date has been comprised of development agreements with Intel and HP as well as its first electroless development tool sold to Uyemura in Japan. Currently revenue activities are focused on securing orders from Texas Instruments, Freescale, ASE, and SPIL. These first two prospects represent leading US Independent Device Manufacturers (IDM) and the last two prospects represent the large Merchant outsourcing providers supporting key foundries such as TSMC and all other IDMs and OEMs. Bumped wafers demonstrating process capability have been provided to these initial prospects and beta orders are anticipated in 4 th quarter 2006." Full Filing (Excellent read)
http://yahoo.brand.edgar-online.com/fetchFilingFrameset.aspx?FilingID=4682856&Type=HTML
How's it going? Thanks, incite, for bringing this one the Nano Cap Fight Club. It's on the radar now.
Nano Cap Fight Club
http://www.investorshub.com/boards/board.asp?board_id=7229
Record fab spending in '06, analyst says
Asia Pac companies to account for nearly half of capital spending
Dylan McGrath
EE Times
(11/03/2006 7:39 PM EST)
SAN FRANCISCO — The value of new fab construction will hit an all-time in 2006, resulting in a record value for new fabs beginning volume production in 2007, according to a new report by market analyst Strategic Marketing Associates (SMA).
SMA's latest report on new fab activity projects that the semiconductor industry will start work on 36 new fabs before the end of the year, the firm said Friday (Nov. 3). The total value of the 36 new fabs when fully equipped is estimated at $59 billion, according to George Burns, SMA president. Twenty-five of the 36 projects are 300-mm fabs, Burns said.
"Growth in new fab activity—fabs starting construction, equipping empty shells or converting 200-mm fabs to 300-mm fabs—is breaking all records," said George Burns, SMA president, in a statement.
SMA's Quarterly Fab Report also lists 36 fabs that will begin volume production in the next four quarters, according to the firm. Twenty of these new fabs will be 300-mm, the firm said.
Of the $59 billion in new fabs starting construction this year, $44 billion will be in Japan, Taiwan or China, according to SMA (Santa Cruz, Calif.). Flash memory and DRAM fabs will account for 64 percent of the value of all new fabs starting construction this year, the firm said.
The value of new foundry fabs starting construction this year also increased significantly, from $3.8 billion in 2005 to $11 billion this year as Taiwan Semiconductor Manufacturing Corp., Semiconductor Manufacturing International Corp. and Hua Hong Electronics began work on new 300-mm fabs, according to SMA. This construction will lead to a growth of 12 percent in new foundry wafer capacity coming online in 2007, the firm said.
Flash memory and DRAM capacity will grow by 40 percent and 53 percent, respectively, in 2007, SMA predicted. By the end of 2007, DRAM manufacturers will have added more than 2 million equivalent 20-0mm wafers in monthly capacity since 2001, according to the firm.
Based on these record levels of projected fab activity, SMA forecasts that capital spending will grow by 15 percent in 2006 to more than $54 billion. Forty-eight percent of all capital spending will be by companies headquartered in Asia Pacific, according to the report.
"Within 5 years, Asia Pacific companies will be spending more than the G8 chip manufacturers," Burns said. "It's inevitable that they will be the top spenders."
http://www.eetimes.com/news/semi/rss/showArticle.jhtml?articleID=193501776&cid=RSSfeed_eetimes_.....
Surfect Holdings, Inc. Announces Participation in the International Wafer-Level Packaging Conference
Tuesday October 31, 8:00 am ET
Conference Gives Surfect Technologies Forum to Introduce Revolutionary New Tools and Process
ALBUQUERQUE, N.M., Oct. 31 /PRNewswire-FirstCall/ -- Surfect Holdings, Inc. (OTC Bulletin Board: SUFH - News), announced today that its subsidiary, Surfect Technologies, Inc., a design and manufacturing company offering an innovative single cell electroplating tool and process for the semiconductor industry will present at this years International Wafer-Level Packaging Conference in San Jose, CA on November 2, 2006. The objective of this conference is to bring new scientific and technical developments to light in semiconductor wafer-level packaging. Surfect Technologies, Inc. is taking an aggressive position in the marketplace with the introduction of their new product offerings.
Surfect Technologies' innovative single-cell electro-deposition process and tool capabilities enable low cost manufacturing of bumps on wafers (200mm or 300mm) at high speeds. The Surfect machine Models; Ascent 200mm, and Leapfrog 300mm, provide customers with the high utilization rates needed to meet the demanding production needs of wafer bumping and through-hole via plating. Commenting on the IWLPC Conference, Mr. Steve Anderson (CEO) stated "We are very excited to have this opportunity to present at this year's event in San Jose, CA. We believe that our new tool and process technology will add significant value to the conference's discussion covering wafer-level bumping and wafer scale packaging developments. The IWLPC conference is a perfect forum for Surfect Technologies and other companies to present the latest developments critical for the advancement of wafer level interconnect", said Mr. Anderson. "We believe that packaging interconnect development at the wafer level is a key enabler for continued miniaturization and innovation required for the growth of consumer electronics. This IWLPC conference is focused on wafer level interconnect as well as advanced 3D packaging and we look forward to supporting these technologies. We feel it is important to support industry events such as the IWLPC conference and look forward to future forums with industry experts."
About Surfect Holdings, Inc.
Surfect Holdings, through its operating subsidiary Surfect Technologies, Inc., is a design and manufacturing company offering an innovative single cell electroplating tool and process that utilizes the industry first, programmable Plating Computer(TM) to fabricate high performance, low-cost interconnects, providing immediate solutions to the back-end of the semiconductor manufacturing process. Additional information is available on the Surfect Technologies website at www.surfect.com
Safe Harbor
Certain statements contained in this press release are "forward-looking statements" within the meaning of applicable federal securities laws, including, without limitation, anything relating or referring to future financial results and plans for future business development activities, and are thus prospective. Forward-looking statements are inherently subject to risks and uncertainties some of which cannot be predicted or quantified based on current expectations. Such risks and uncertainties include, without limitation, the risks and uncertainties set forth from time to time in reports filed by the company with the Securities and Exchange Commission. Although the company believes that the expectations reflected in such forward-looking statements are reasonable, it can give no assurance that such expectations will prove to have been correct. Consequently, future events and actual results could differ materially from those set forth in, contemplated by, or underlying the forward the forward-looking statements contained herein. The company undertakes no obligation to publicly release statements made to reflect events or circumstances after the date hereof.
--------------------------------------------------------------------------------
Source: Surfect Holdings, Inc. http://biz.yahoo.com/prnews/061031/latu044.html?.v=74
What is a Flip Chip?
A flip chip" is a type of integrated circuit which has the leads and connections on the surface of the chip. Traditionally the connecting leads or bond wire protrude on the sides of the device, outside of the body of the chip itself. Flip chip connections are shorter, and may be made anywhere on the surface of the chip.
One surface of the flip chip has metallic connectors, usually solder bumps, and it is turned over and attached face down on a substrate. The substrate usually has a corresponding pattern of small bumps of solder or "flip chip bumps" on it, although attachment technology is evolving. The flip chips are bonded to substrate by running an epoxy encapsulant between the flip chip and the substrate with wafer bumps.
A flip chip possesses a shorter interconnect distance with the solder bumps as compared to the wire bonds or leads around the side of a traditional integrated circuit. Under the basic laws of electricity these shorter leads then can deliver lower inductance, resistance, and capacitance - and consume less power - yet are capable of delivering the signal integrity necessary for high performance systems.
Due to this design the input/output (I/O) from the flip chip device is not limited by the leads along the perimeter of a traditionally configured integrated circuit, allowing higher l/O density- i.e., more signal, power, less distortion, in less space. Flip chips can be 95% smaller than a traditional chip - a real important item for designers of future microprocessors and Application Specific Integrated Circuits (ASIC's).
In a nutshell, flip chips allow designers of electronic equipment to deliver more: (1) performance, (2) reliability, and (3) durability, yet in less space.
Flip Chip Advantages
The advantages in using flip chips versus other types of integrated circuits are summarized at the FCT Website :
-A smaller I/C footprint: flip chips allow tighter spacing, as devices are smaller and pick-and-place manufacturing equipment requires smaller keep-out areas;
-Reduced size and weight: flip chips are 95% smaller than an ordinary quad flat pack, giving designers many more design options;
-Increased functionality: flip chips have increased input/output, useful for microprocessors, telecommunications, and automotive electronics;
-Improved reliability: Epoxy underfill in large flip chips results in up to 10 times the reliability of a packaged device, and may also reduce the connections;
-Improved yields: Assembly yields for flip chips have lower deflect ranges per input/output than typical integrated circuits;
-Improved performance: Flip chips interconnects deliver superior electrical properties;
-Improved thermal capabilities: Since flip chips are not encapsulated, the system manufacturer can take full advantage of the silicon's thermal properties;
-Reduced capital investment: Flip chip technology eliminates intermediate interconnect processes and device encapsulation processes.
by Douglas V. Fant
This past year saw unprecedented growth in shipments of flip chips. With stronger-than-expected sales of PCs, shipments of CPUs and chipsets with flip chip increased dramatically. The long-awaited shift of graphics chips from wire bond to flip chip began in the last two quarters of 2005. A larger number of ASIC designs moved to flip chip. All in all, the growth rate for solder-bumped flip-chip devices reached an unprecedented 48% in 2005 http://circuitsassembly.com/cms/content/view/3293/95/
Deep in Industry Experience, Team Readies to Enter Markets
Surfect Technologies, Inc. Announces New Management Team
Wednesday October 25, 8:00 am ET
ALBUQUERQUE, N.M., Oct. 25 /PRNewswire-FirstCall/ -- Surfect Holdings, Inc. (OTC Bulletin Board: SUFH - News), announced today that its subsidiary, Surfect Technologies, Inc., a design and manufacturing company offering an innovative single cell electroplating tool and process for the semiconductor industry has announced the addition of three senior managers to its team. "We searched throughout our industry to find individuals with broad experience and a history of success in the semiconductor space," said Steve Anderson, CEO of Surfect Holdings, Inc. "With the addition of these three industry veterans, I am confident that we have a team that is going to lead this exciting new wave of flip chip and wafer scale packaging technology," Anderson went on to say.
ADVERTISEMENT
James Turk
Chief Financial Officer
James brings over 15 years in corporate finances for a variety of public and private manufacturing, real estate development, and technology companies. Prior to his employment with Surfect, Mr. Turk held the C.F.O. roles with Safe Car, Inc., Roses Southwest Papers, Inc., and Westland Development Co., Inc. as well as with Jamikal Data Technologies, Inc., an information systems and communications consulting firm that has advised and performed a variety of services for state and national clients. He is a graduate of Adams State College with a Bachelor of Science degree in accounting.
Miles Prim
V.P. Product Development
Miles brings more than 29 years as a semiconductor industry executive with significant global experience. He was most recently founding CEO/President of ITest, Ltd., a Private Equity/JV start up, in Seoul Korea, Vice President & General Manager Philippine Factory 3 and VP Corporate Worldwide Test for Amkor Technology, VP/GM Wafer Test Group for Kulicke and Soffa, and Director, Worldwide Manufacturing for Western Digital Corporation. Miles has significant international experience, with over 8 years living abroad as an Expatriate in Asia. In addition to this, he has managed operations both in Europe and USA, related to semiconductor package assembly and test development, as well as wafer probe manufacturing.
Mark W. Eichhorn
Corporate V.P. Sales & Marketing
Mark brings 29 years of experience in the semiconductor assembly industry. Prior to his current position at Surfect Technologies he was Vice President of Test Customer Operations with Kulicke & Soffa Industries, Inc. During his tenure at Kulicke & Soffa he held various sales management positions that included extended expatriate positions in Hong Kong and Japan. He brings leading experience to drive successful sales growth for interconnect equipment and global market development. He is a graduate of SUNY (Empire State College) with a Bachelor of Science degree in business and economics.
About Surfect Holdings, Inc.
Surfect Holdings, through its operating subsidiary Surfect Technologies, Inc., is a design and manufacturing company offering an innovative single cell electroplating tool and process that utilizes the industry's first, programmable Plating Computer(TM) to fabricate high performance, low-cost interconnects, providing immediate solutions to the back-end of the semiconductor manufacturing process. Additional information is available on the Surfect Technologies website at www.surfect.com
Safe Harbor
Certain statements contained in this press release are "forward-looking statements" within the meaning of applicable federal securities laws, including, without limitation, anything relating or referring to future financial results and plans for future business development activities, and are thus prospective. Forward-looking statements are inherently subject to risks and uncertainties some of which cannot be predicted or quantified based on current expectations. Such risks and uncertainties include, without limitation, the risks and uncertainties set forth from time to time in reports filed by the company with the Securities and Exchange Commission. Although the company believes that the expectations reflected in such forward-looking statements are reasonable, it can give no assurance that such expectations will prove to have been correct. Consequently, future events and actual results could differ materially from those set forth in, contemplated by, or underlying the forward the forward-looking statements contained herein. The company undertakes no obligation to publicly release statements made to reflect events or circumstances after the date hereof.
--------------------------------------------------------------------------------
Source: Surfect Holdings, Inc.http://biz.yahoo.com/prnews/061025/law032.html?.v=77
Thanks David.
As thinly as this is traded, (gaps hard up and down) I'm gonna need it. By the way, that mouse avatar is hilarious.
More on ITU: IMO: As far as I can tell, Surfect is the first company ITU has incubated, that has gone public on it's own. With the exception of Surfect, all the companies in the ITU Portfolio are or were private.
ITU Portfolio Companies
Catalytic
http://www.catalytic-inc.com/news.html
.
Coatue
.
[aquired by Advanced Micro Devices Inc. (NYSE:AMD)]
and then folded into FASL LLC [AKA SPANSION INC. (NasdaqGS:SPSN) after IPO] http://www.spansion.com/, a joint venture between AMD and Fujitsu Ltd.
Story: http://www.eetimes.com/news/latest/showArticle.jhtml?articleID=13000187
Comet
http://www.cometsolutions.com/
CyberDefender
http://www.cyber-defender.com/AS/landing/14/?affl=webmetro_yahoo2for&campaign_code=007993&in....
Eizel
aquired by NOKIA CP ADS (NYSE:NOK)
http://www.nokia.com/
Story: http://www.econtentmag.com/Articles/ArticleReader.aspx?ArticleID=4305
GigascaleIC
.
http://www.gigascaleic.com/
Hier Design
aquired by XILINX INC (NasdaqGS:XLNX) http://www.xilinx.com/
Story: http://www.xilinx.com/prs_rls/xil_corp/0468_hierdesign.htm]
Luxtera
http://www.luxtera.com/
OEwaves
http://www.oewaves.com/
OnWafer
http://www.onwafer.com/
OrganicID
http://www.organicid.com/index3.html
aquired by WEYERHAEUSER CO (NYSE:WY)
Story:Oct 5, 2006 http://biz.yahoo.com/iw/061005/0169971.html
Panthera
http://www.penthera.com/
Pivotal
PowerSiCel
aquired by Advanced Power Technology Inc. http://www.advancedpower.com/).
Story: http://rfdesign.com/news/APT-acquires-PowerSicel/ .
RFxCel
]http://www.rfxcel.com/index.htm .
Quellan
http://www.quellan.com/
Silicon Navigator
.
http://www.siliconnavigator.com/index.html
Surfect
http://www.surfect.com/
Surfect Holdings, Inc. Begins Trading As a Public Company Under Synbol SUFH.OB
Story: October 10, 2006 http://biz.yahoo.com/prnews/061010/latu100.html?.v=66
Wavestream.
http://www.wavestream.com/index.php
XAware
http://www.xaware.com/
Good luck, I'll keep visiting....:)
David
ITU is focused on providing seed/early-stage capital to university-founded companies, including those with intellectual property contributed by the inventor/university. In addition to seed capital, ITU provides strategic guidance and business development relationships with a level of speed and approachability that is unparalleled by traditional venture capital firms.
Among the most notable schools, ITU has a presence at the University of Colorado, Colorado State University, Colorado School of Mines, Caltech, Carnegie Mellon University, Georgia Tech, MIT, Purdue University, Stanford, University of California at Berkeley, UCLA, University of Michigan, and the University of Washington.
ITU Gets High Marks
Jan 1, 2003 Venture Capital Journal http://www.ventureeconomics.com/vcj/protected/1031551048846.html More on ITU later
Followers
|
3
|
Posters
|
|
Posts (Today)
|
0
|
Posts (Total)
|
67
|
Created
|
10/24/06
|
Type
|
Free
|
Moderators |
Volume | |
Day Range: | |
Bid Price | |
Ask Price | |
Last Trade Time: |