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rsi wants out, look to history!!
http://stockcharts.com/h-sc/ui?s=IFX&p=D&yr=0&mn=11&dy=0&id=p60040799902
we got our first support point, just nice
They got an upgrade from Sell to Hold today.
http://finance.yahoo.com/q/ud?s=IFX
Hopefully, IFX can hold .....
Shares of Infineon Technologies AG (IFX) rose 13% to 99 cents following news that Qimonda AG (QI), the memory-chip maker in which Infineon has a major stake, will receive an emergency $456 million loan. Qimonda gained 72% to 52 cents.
Yoh, i got me some shares so whats up with this stock? Anything good?
Lsi - Ifx combined could hit 10$+ again
also could be in line to be gobbled up by a bigger player
E.E. Times reports that the pending merger with Philips Semiconductor is iminent and that this would make IFX the fourth largest semiconductor company in the world.
Has anyone heard a timeframe on the merger?
Here is IFX seen through the eyes of a technician. This info updates constantly during market hours.
Analysis:
http://www.trade-ideas.com/StockInfo/IFX/INFINEON_TECHNOLOGIES_AG.html
Recent alerts:
http://www.trade-ideas.com/SingleSymbol.php?symbol=IFX&more=1
In real time:
http://www.trade-ideas.com/LiveDemoContainer.html
Summary: Broadening top, ST move DWN
Technical Chart Read for Infineon
Daily Chart
http://stockcharts.com/def/servlet/SC.web?c=IFX,uu[l,a]dacayiay[pc20!d20,2][vc60][iLi14,3!Lp14,3,3]&...
Weekly Chart
http://stockcharts.com/def/servlet/SC.web?c=IFX,uu[l,a]wacayiay[df][pc20!d20,2][vc60][iLi14,3!Lp14,3...
Additonal Key Facts / Infineon
3rd Quarter Fiscal Year 2003 (from thread on last post)
Highlights:
Best industry cost position in the DRAM market
Strengthened world leadership for 300mm production
Strengthened market leadership in automotive electronics as No 1 in Europe with more than 15% market share and No 2 worldwide with more than 8% market share
Successful manufacturing cooperations with Taiwan-based Nanya and Winbond and Semiconductor Manufacturing International Corporation (SMIC) in China
Strategic partnerships:
Acquisition of the core business of Ericsson Microelectronics: important entrance into the mobile phone infrastructure market and positioning as a strategic supplier for Ericsson
Joint Venture StarCore LLC with Agere and Motorola to jointly develop and license digital signal processor technology for mobile communications and consumer electronics
Advanced Mask Center built together with AMD and DuPont Photomasks in Dresden for the development of complex mask technologies for next generation chip designs
Research & Development:
Strong technology portfolio with more than 30.300 patents and applications
27 major R&D locations worldwide
R&D expenditures fiscal year 2002: Euro 1,06 billion
Approximately 5,700 R&D staff
Production:
Most advanced fab cluster with world class manufacturing on three continents
9 wafer manufacturing sites
14 backend assembly and testing sites
Total investments FY 2002: Euro 1.06 billion
Ah.. Infineon Major Strategic Partnerships
http://www.infineon.com/cgi/ecrm.dll/jsp/showfrontend.do?lang=EN&channel_oid=-9814&BV_Sessio...
Major Strategic Partnerships:
IBM - development of DRAM technologies and MRAM
Toshiba - development of FeRAM
Winbond; Nanya; SMIC - manufacturing of DRAM, licensing technology
IBM/UMC - development & manufacturing of logic technologies and products
Nokia - radio frequency solutions
Ericsson - radio frequency solutions
Cisco Systems - optical networking
Alcatel - optical networking
Mecel - Bluetooth solutions for Telematics applications
New Logic - Wireless LAN
Sony - contactless security applications
Infineon: 39 Ventures-Biotech to Nanotech
http://www.infineon.com/cgi/ecrm.dll/jsp/showfrontend.do?lang=EN&channel_oid=-10434
Would be nice to find the Joint Ventures in one place.
Announces Shipment/ World's Smallest 512 Megabit DDR2 Memory Components to Intel
Tuesday September 16, 11:00 am ET
Infineon's DDR2 memory technology successfully boots with Intel Corporation's next generation 'Lindenhurst' dual processor server chipset
http://biz.yahoo.com/bw/030916/165599_1.html
SAN JOSE, Calif.--(BUSINESS WIRE)--Sept. 16, 2003-- Infineon Technologies (FSE:IFX)(NYSE:IFX - News) today announced that its 512 Megabit (Mb) DDR2 (second-generation Double-Data-Rate) SDRAM is successfully booting and is under evaluation with Intel's next generation dual processor server chipset code name 'Lindenhurst.' Infineon's 512 Megabit x8 DDR2 SDRAM devices are under evaluation by Intel and compliant with JEDEC's DDR2 specification.
Infineon's DDR components are designed for next generation, high-performance main memory in Server, PC and Workstation applications. The new 512 Mb DDR2 components are fabricated using Infineon's advanced 110 nanometer (nm) CMOS process technology; which results in lowest power consumption and the smallest chip size in the industry for this density.
The initial Infineon DDR2 components operate at per pin data rates of 400 Mbps (megabits per second) and 533 Mbps. Components and memory modules operating at higher speeds are already in preparation for systems using DDR2 main memory beginning in 2004. Infineon's roadmap for DDR2 also includes 256 Mb and 1 Gigabit components in 2004.
"Infineon's DDR2 memory technology will enable Intel's desktop, server and mobile platforms to achieve higher performance, lower power and increased capacity in 2004," said Pete MacWilliams, Senior Fellow, Intel Corporation. "I expect DDR2 technology to be the key memory architecture for several years."
"Memory modules based on DDR2-533 will achieve data rates of 4.3 GigaBytes per second, providing systems with truly remarkable performance using a mainstream, industry standard memory architecture," said, Bernd Lienhard, Vice President, Memory Products at Infineon Technologies North America Corp. "As the memory supplier leading the industry's transition to cost-effective, high-volume production on 300 mm wafers, we are proud to join Intel in offering computer users leading edge technology for the next level of systems design."
Infineon's JEDEC compliant, 512Mb DDR2 chips are configured as quad-bank DRAMs, will be available in x4, x8 and x16 organizations, and are offered in FinePitch Ball Grid Array (FBGA) packages. Additional features of the new memory include a pre-fetch size of 4 bits, differential strobe and variable data-output impedance adjustment.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2002 (ending September), the company achieved sales of Euro 5.21 billion with about 30,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.
This news release is available online at http://www.infineon.com/news/
--------------------------------------------------------------------------------
Contact:
Infineon Technologies
Karin Braeckle, +49 89 234 28011 (Worldwide Headquarters)
karin.braeckle@infineon.com
Matt Schmidt, 408-501-6390 (U.S.A.)
matt.schmidt@infineon.com
Kaye Lim, +65 6840 0689 (Asia)
kaye.lim@infineon.com
Hirotaka Shiroguchi, +81 3 5449 6795 (Japan)
hirotaka.shiroguchi@infineon.com
Investor Relations:
EU/APAC, +49 89 234 26655
USA/CAN, 408-501-6800
investor.relations@infineon.com
--------------------------------------------------------------------------------
Source: Infineon Technologies
IFX&Huawei to Offer Competitive WCDMA Mobile Phone Platform
Joint News Release by Infineon Technologies and Huawei Technologies
Tuesday September 16, 5:30 am ET
http://biz.yahoo.com/bw/030916/165447_1.html
MUNICH, Germany & BEIJING--(BUSINESS WIRE)--Sept. 16, 2003--Infineon Technologies (NYSE:IFX - News; FWB:IFX), the world's sixth largest semiconductor manufacturer, and Huawei Technologies, a leading global supplier of network equipment, today announced at a signing ceremony in Beijing that they will join forces to offer a competitive WCDMA mobile phone platform. Through this partnership the two companies are creating a new business model to meet the specific customer needs in China. Both companies strongly believe this will support the large-scale introduction of WCDMA in China.
ADVERTISEMENT
Infineon Technologies, a leading provider of 2G to 3G chipsets and complete solutions, will contribute the reference design and protocol stack software for the development of WCDMA mobile phone platform. Huawei will complement this co-operation with leading-edge technologies and strong WCDMA network expertise. Additionally, Huawei provides terminal testing and broad technical experience in IOT (Inter-Operability Testing) between mobile terminals and mobile systems. By joining forces for this end-to-end solution, both companies will facilitate the integration of WCDMA mobile phone platforms, through the development of application software, the integration of the protocol stack software, and high-performance WCDMA RTT algorithms.
Generally, WCDMA mobile phone manufacturers specialize in supporting multimedia communications and high data-rate for high-end users. The Infineon-Huawei partnership will bring about a competitive voice-centric WCDMA mobile phone platform for the mass market.
"The winning combination of Huawei's and Infineon's complementary know-how enables the two companies to offer highly competitive WCDMA handsets that satisfy the specific needs of China, the world's largest mobile phone market," said Dr. Ulrich Schumacher, President and CEO of Infineon Technologies.
Infineon has lately taken a series of measures including various investments in China, establishing joint ventures, and forming new partnerships. The co-operation with Huawei is part of Infineon's commitment to China.
According to Ms. Sun Yafang, Chairman of Huawei, "Huawei has invested heavily in WCDMA, the mainstream 3G standard. We have mastered the complete set of technologies from core system technology to chip design, and become one of the few in the world that can provide comprehensive commercial systems. The partnership with Infineon will enhance Huawei's capabilities in end-to-end WCDMA solutions, better serve the needs of operators and end users for low-cost WCDMA mobile phones (by offering voice and SMS services) and promote 3G development in China. We also believe that the platform cost could be narrowed to the level of GSM."
"In the area of mobile terminals, Huawei is committed to developing low-cost 3G handsets and bringing the benefits of 3G to the general population," she added. "Huawei will endeavour to provide end-to-end solutions and quality services to operators and end users by combining the unique features of different mobile phones with Huawei's competence in the wireless business."
About Huawei
Established in 1988, Huawei Technologies is a high-tech enterprise which specializes in research and development (R&D), production and marketing of communications equipment, providing customized network solutions for telecom carriers in optical, fixed, mobile and data communications networks. Huawei's customers include China Telecom, China Mobile, China Unicom, China Netcom as well as Thai AIS, South Korea Telecom, SingTel, Hutchison Global Crossing, PCCW, Telemar (Brazil), etc. Further information is available at www.huawei.com
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2002 (ending September), the company achieved sales of Euro 5.21 billion with about 30,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at http://www.infineon.com
This news release is available at http://www.infineon.com/news
IFX Double-Digit Million Euro Gain In ProMOS Sale
Wednesday September 3, 6:50 am ET
http://biz.yahoo.com/djus/030903/0650000682_1.html
Dow Jones Business News
BERLIN -(Dow Jones)- Infineon Technologies AG said Wednesday it will book a double-digit million euro gain from the sale of its stake in Taiwanese chip maker ProMOS Technologies Inc. .
Europe's second-largest semiconductor manufacturer Monday said it had sold all its shares in ProMOS, which it formed with Mosel Vitelic Inc. in 1996. Infineon started selling ProMOS stock on the market this year after falling out with Mosel.
Infineon reaped EUR250 million from the sale of the 30% stake compared with a book value of EUR196 million, weekly magazine WirtschaftsWoche reported in the prerelease of an article to appear Thursday.
An Infineon spokesman would only confirm that the sale would mean a significant double-digit million euro gain for Infineon, which had a net loss of EUR116 million in the fiscal third quarter.
The spokesman also said that fund management company Fidelity has reduced its stake in Infineon to 4.96% from slightly more than 5%. In Germany, investors are required to inform the public when a stake crosses the 5% threshold
Fidelity has reduced its holding after a solid performance from Infineon so far this year. The shares are the best performers in Germany's benchmark DAX Index since January, gaining 89%. By 1016 GMT, the stock was down 0.4% at EUR13.19.
Company Web site: http://www.infineon.com
-By Taska Manzaroli, Dow Jones Newswires; 49 30 2888 410; taska.manzaroli@dowjones.com
IFX Samples World`s Smallest 1-Gbit DDR SDRAMs -110-nm Technology and Dual-Die-Stack Allow Highest Density on Smallest Space
2003-08-26
From the news on IFX home web page........
http://www.infineon.com/cgi/ecrm.dll/jsp/showfrontend.do?lang=EN&news_nav_oid=-9979&content_...
Munich, Germany - August 26, 2003 - Infineon Technologies AG (FSE/NYSE: IFX) today announced that it has shipped first samples of its 1-Gbit Double Data Rate (DDR) Synchronous DRAM (SDRAM) to selected key customers. The devices are fabricated using the company's advanced 110nm CMOS process. At only 160mm² chip size they are the industry's smallest 1-Gbit DDR SDRAMs to date.
The new 1-Gbit DRAM is packaged in a standard 400-mil, 66-pin Thin Small Outline Package (TSOP) or a 68-ball Fine-pitch Ball Grid Array (FBGA) for space-constrained applications. Supported organizations are x4, x8 and x16. The 1-Gbit Double Data Rate SDRAM covers the whole range of popular DDR data rates from DDR266 through DDR400 operating at 133 MHz through 200 MHz clock speeds, respectively.
"Infineon is proud to again have the smallest die size of an upcoming new DRAM generation," said Dr. Harald Eggers, CEO of Infineon's Memory Products Group. "This once again impressively underlines the value of our advanced trench-cell DRAM technology in the industry. It enables the most economic production of the new DRAM generations, which will further push out the memory density barrier in high-end servers and workstations and thereby help to improve speed, performance and user-friendliness of today's computers."
To achieve the highest memory density per module, Infineon will use a stacked version of the FBGA package to produce the 4-Gbyte registered modules. The technology, called "Dual Die Stack", provides a second silicon chip on top of the first, encapsulating the resulting die stack in a regular, albeit higher, fine-pitch ball grid array package. This innovative form of stacking allows Infineon to achieve unprecedented memory density per board area, but also offers superior electrical and thermal properties of the resulting memory component. Alternatively, the 4-Gbyte registered DIMM will also be available based on stacked TSOP packages.
The 1-Gbit DDR SDRAM will be used primarily to offer high-density registered and unbuffered modules for the high-end server and workstation market. Target products are registered Dual-Inline Memory Modules (DIMMs) of 4-Gbyte and 2-Gbyte density as well as unbuffered DIMMs of 2-Gbyte density. Small-Outline DIMMs (SO-DIMMs) for notebook computers will be offered in 2-Gbyte and 1-Gbyte densities using the new generation memories. All modules will start sampling in the fourth quarter of 2003 and enter into volume production early 2004.
Initially manufactured in Infineon's Dresden facility, an integral part of the company's fab cluster of semiconductor fabs on three continents, the new 1-Gbit DDR SDRAM will generally become available in the 4th quarter of 2003.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 2002 (ending September), the company achieved sales of Euro 5.21 billion with about 30,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.
Information Number: INFMP200308.112
IFX and UEC Establish JV Fiber Optics Component
Joint News Release by Infineon and UEC
Wednesday August 13, 3:43 am ET
Infineon and Taiwanese UEC to Establish a Joint Venture for Fiber Optics Component
MUNICH, Germany & HSINCHU, Taiwan--(BUSINESS WIRE)--Aug. 13, 2003-- Infineon Technologies AG (NYSE:IFX - News; FWB: IFX), the world's six-largest semiconductor manufacturer, today announced that it has signed an agreement with United Epitaxy Company (UEC), Taiwan, to set up a joint venture for the manufacturing and development of fiber optics components. The joint venture will be based within the existing facility of UEC at Hsinchu Science-based Industrial Park in Taiwan and will be established in October 2003.
Subject to approval by the German anti-trust authority, Infineon will hold 56 percent of the shares of the joint venture and UEC the remainder 44 percent. The total investment over the next five years including business start-up, manufacturing site, equipment, and other infrastructures, amounts to approximately US$ 12 million and will be made according to the shareholding ratio of the parent companies. When operating at full capacity of up to 100 wafer starts per week the joint venture will employ around 120 people.
The new company will integrate fiber optics technology of the two parent companies to achieve manufacturing and development synergies. Under the terms of the agreement, both companies will license their respective technology to the joint venture. In return, the new company will manufacture in particular optochips for Infineon and UEC. Both partners will assemble the optochips into high-end micro systems and components for the market of high-speed data transmission products based on fiber optic technology. These products are used in telecommunication and data communication networks.
"Taiwan is always an engine of the global IT industry. This JV between Infineon and UEC is our further recognition of Taiwan's role in global IT industry," said Mr. Loh Kin Wah, President of Infineon Technologies Asia Pacific Pte Ltd. "This joint venture will ensure sufficient supply and develop the most competitive fiber optics products for Infineon and UEC."
"The JV between Infineon and UEC, supports the Taiwan government's policies for industry upgrading, bringing in the world's cutting-edge optical communications technology," said Kuo-Hsin Huang, Chairman, United Epitaxy Co. "The cooperation with Infineon is also expected to enhance R&D and manufacturing capability at the new company because of Infineon's global leadership in the fiber optics communications field and UEC's prowess of manufacturing."
The joint venture is scheduled to be established in October 2003; clean room and major equipment installation is expected to be completed within the fourth quarter of 2003 with trial production slated for the first quarter of 2004 and mass production for the fourth quarter of 2004.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2002 (ending September), the company achieved sales of Euro 5.21 billion with about 30,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at http://www.infineon.com.
About United Epitaxy Company
Founded in 1993, United Epitaxy Company, Ltd. (UEC) is based in Taiwan's Hsinchu Science-based Industrial Park, where the company has two manufacturing sites. It has another two sites respectively in the Tainan Science-based Industrial Park and Chung-ho, Taipei County as well as a wholly-owned subsidiary in Wuxi, Jiangsu Province of China. The UEC is listed on the Taiwan Stock Exchange (Stock) and Luxembourg Stock Exchange (ECB). It's the first company in Taiwan to usher in the Metal Organic Vapor Phase Epitaxy (MOVPE) technology, and it now has the world's largest MOVPE manufacturing operation, with conventional LED and ultra bright AlGaInP and InGaN LED, laser diodes, high speed infrared LED and red LED, Si detectors, and HBT wafers as major products. UEC's products are distributed around the world. The company keeps abreast of the world's latest optoelectronic semiconductor technology development and has obtained, as well as been applying for, more 150 patents around the world. The UEC website URL is http://www.uec.com.tw.
EU Imposes 34.8% Import Tariff on Hynix
http://biz.yahoo.com/ap/030812/eu_skorea_chips_2.html
Associated Press
EU Imposes Tariffs on Computer Chips
Tuesday August 12, 11:09 am ET
European Union Imposes Import Tariffs on Computer Chips in
Trade Dispute With South Korea
BRUSSELS, Belgium (AP) -- European Union governments Tuesday said they have imposed a 34.8 percent tariff on imports from Hynix Semiconductor Inc. after ruling that the South Korean government had unfairly subsidized the chipmaker.
The executive European Commission had imposed provisional tariffs in April for four months. The new decision extends them to up to five years, handing a major victory to Hynix's rivals, Micron Technology Inc. of the United States and Germany's Infineon Technologies AG.
The EU did not impose any duties on Samsung Electronics Co., despite complaints that it received the same advantages in manufacturing dynamic random access memory chips, or DRAMS, which are used in personal computers.
European governments are retaliating against restructuring loans and debt-for-equity swaps made by South Korea's state-controlled banks to Hynix. The tariffs affect millions of dollars worth of chip exports and deal another heavy blow to the world's third-largest memory chip maker already suffering from consecutive years of losses and heavy debt.
The action follows a U.S. ruling to slap a 44.71 percent tariff on Hynix chips. South Korea has said it plans to file lawsuits against Washington and Brussels at the World Trade Organization
Worldwide DRAM Market Shows Signs Of Recovery - Gartner
Tuesday August 19, 5:25 am ET
http://biz.yahoo.com/djus/030819/0525000638_2.html
BERLIN -(Dow Jones)- The global memory chip market is on the verge of recovery, research firm Gartner Inc. (IT) said Tuesday, after more than two years of recession swelled losses at the likes of Infineon Technologies AG ..............
UMC-Infineon Multiple Success in Adv.Semi.Mfg.Partnership
http://biz.yahoo.com/bw/030806/65266_1.html
UMC and Infineon Announce Success and Optimization of their Technology and Manufacturing Partnership
Wednesday August 6, 6:01 am ET
HSINCHU, Taiwan and MUNICH, Germany--(BUSINESS WIRE)-
-Aug. 6, 2003-- Partners achieve 90nm silicon success
and high-yield production for SOC ICs leveraging 130nm
process technology on 300-mm wafers
UMC (NYSE:UMC - News) and Infineon Technologies AG (Infineon) (NYSE:IFX - News), today announced success in their 90nm development program with the delivery of functional complex circuitry utilizing the industry's most advanced production technology. This milestone confirms that this technology is ready to move to production later this year. The companies also announced the success of their 300-mm joint engineering efforts with the achievement of high-yield pilot production for a 130nm SoC IC targeted at mobile applications and incorporating sensitive analog/mixed mode circuitry. Despite the challenges of 300-mm production, these chips are currently being produced at UMC fabs at yield levels that equal or surpass those attained by similar products on mainstream 200-mm wafers.
Dr. Andreas von Zitzewitz, chief operating officer (COO) at Infineon, said "While Infineon was one of the very first companies to demonstrate the economical advantages of high-volume manufacturing of DRAMS on 300-mm wafers, we have now managed to attain a similar milestone for complex SoC ICs with analog and mixed-mode functionality, in close cooperation with our technology and manufacturing partner UMC. We are very pleased with this joint success. It clearly demonstrates the power of real partnerships to enhance progress in leading-edge silicon technology production."
Dr. Jackson Hu, CEO of UMC, explained, "We are very excited about the progress that we have made working with Infineon to achieve working 90nm silicon and to reach high-yielding production for 0.13um SOCs on state-of-the-art 300-mm wafers. This validates the success of UMC's partnership approach, and our ability to work closely with key customers to develop processes that enable them to meet their time-to-silicon and time-to-volume requirements. We intend to continue our partnership programs based on technology developed by UMC and optimized to achieve the goals of our many customers."
Having achieved the primary objectives of their joint development program, UMC and Infineon plan to continue their cooperation on process development through joint engineering efforts in specific advanced technologies needed for IFX product success.
In this context and to better meet Infineon's requirements as a foundry partner, the companies also agreed that UMC would buy back Infineon's equity share in UMCi Pte Ltd. UMCi is the Singapore manufacturing venture formed in April 2001 by Infineon, UMC, and Singapore's Economic Development Board investment arm (EDBI). EDBI will retain its equity position in UMCi.
This move will allow Infineon and UMC to concentrate on their broader manufacturing partnership, and give Infineon a more flexible manufacturing approach that includes access to all of UMC's wafer fabs. The parties anticipate large volume production to ramp up initially at UMC's Taiwan facilities, and later at UMCi, as its production capacity comes on line. UMCi is currently on track with its equipment installation as announced earlier this year.
About UMC
UMC (NYSE:UMC, TSE:2303) is a leading global semiconductor foundry that manufactures advanced process ICs for applications spanning every major sector of the semiconductor industry. UMC delivers cutting-edge foundry technologies that enable sophisticated system-on-chip (SOC) designs, including 90nm, 0.13um copper, embedded DRAM, and mixed signal/RFCMOS. UMC is also a leader in 300mm manufacturing; Fab 12A in Taiwan is currently in volume production for a variety of customer products, while the Singapore-based UMCi joint venture will begin pilot production later this year. UMC employs over 8,500 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.
About Infineon
Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2002 (ending September), the company achieved sales of Euro 5.21 billion with about 30,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.
Contact:
For UMC (In the USA)
KJ Communications
Eileen Elam, 650/917-1488
Eileen@kjcompr.com
or
UMC (In Taiwan)
Alex Hinnawi, (886) 2-2700-6999 ext. 6958
alex_hinnawi@umc.com
or
For Infineon
Guenter Gaugler, (49) 89 234 28481
Guenter.gaugler@infineon.com
Source UMC
IFX-IBM-CHRT Joint development on 65mn Process Accelerates...
http://biz.yahoo.com/bw/030806/65581_1.html
Chartered, IBM and Infineon Collaborate
on 65nm Development Program
Wednesday August 6, 4:01 pm ET
SINGAPORE, EAST FISHKILL, N.Y. & MUNICH, Germany--(BUSINESS WIRE)--Aug. 6, 2003--Chartered Semiconductor Manufacturing, IBM and Infineon Technologies AG today announced a joint development agreement to accelerate the move to 65 nanometer (nm) semiconductor manufacturing process technology.
The multi-year engagement closely aligns Infineon's low-power silicon expertise with IBM's leading process technology and Chartered's efforts to drive a common foundry process platform that scales from 90nm through next-generation 65nm technology and provides a path to 45nm. Financial details of the new agreement were not disclosed.
The work will be conducted in IBM's newly-opened East Fishkill, N.Y., 300mm development lab. IBM and Chartered technologies are among the first on 65nm circuits developed and produced in the new facility, called the Advanced Semiconductor Technology Center, or ASTC 300, which began operations last month.
Nearly 200 engineers from the three companies will work together to define industry-leading process technologies for next-generation semiconductors.
"Developing advanced semiconductor technology in the 'nano era' is becoming increasingly challenging for the entire industry," said Dr. John E. Kelly III, senior vice president and group executive, IBM Technology Group. "Working together, IBM, Infineon and Chartered can accelerate the development of these technologies yielding 'first time right' chip designs, which will improve time-to-market and cost for our customers."
Chartered, IBM, and Infineon plan to jointly develop a common advanced foundry process at 65nm, as well as variants tuned for high performance and low power. The companies are also exploring extensions to 45nm technology. To assist foundry customers in designing with these technologies, the companies have also agreed to work together with third-party providers to provide a robust ecosystem of optimized design tools.
Each company will have the ability to implement the jointly developed processes in its own manufacturing facilities. Both IBM and Chartered plan to have the jointly developed 65nm process installed in their respective 300mm fabs, and to be in a position to support Infineon's outsourced demand for 65nm products.
"We believe that the new alliance between IBM, Chartered and Infineon will be very powerful and will rapidly gain momentum to create the leading-edge preferred platform for advanced logic manufacturing technologies," said Dr. Andreas von Zitzewitz, COO of Infineon. "We already have more than 12 years experience in successful R&D cooperation with IBM and are pleased to continue that and look forward to the opportunity to also work with Chartered. This agreement is a further step in Infineon's strategy to expand our alliance network with leading companies and a major step to successfully reduce cost and risk and to provide leading-edge IC process technologies in a timely manner for the benefits of our customers."
"At a time when chip companies are pressured to deliver sophisticated systems in silicon faster than ever before and get it right the first time, the initial IBM-Chartered technology platform is emerging as a compelling process platform," said Chia Song Hwee, president and CEO of Chartered. "The joint development model is critical to keeping fabless and fab-lite companies at the leading-edge of process technologies. And, combined with our cost-effective foundry services, it provides an attractive low-risk outsourcing option for world-class IDMs like Infineon."
Infineon & Saifun Flash Technologies
You can buy it here on their web site.
http://www.ingentix.de/WhereToBuy_eng.html
About it, from their web site..
http://www.ingentix.de/WhereToBuy_eng.html
MultiMediaCard™ is the new innovative small form factor memory card. The MultiMediaCard combines the smallest format with an enormous memory capacity (Flash), a simple high speed serial bus, a robust low cost packaging and the possibility to stack up to 30 cards on a single bus. The MultiMediaCard is in short the most intelligent choice for your mobile applications.
Company Info http://www.ingentix.de/CompanyInfo_eng.html
Taken from the Press Release issued on 20th February 2003 :
Infineon and Saifun Forge Ahead with Activities for Flash Memories
Joint Venture will Extend its Activities to the Code Flash Market
Dresden, 20 February 2003 - Infineon Technologies and Saifun Semiconductors to-day announced the founding of Infineon Technologies Flash GmbH & Co. KG, mark-ing a significant expansion of their flash memory business. With this move, Infineon is continuing to develop in line with its strategy agenda 5-to-1 in the direction of be-coming a solution provider.
Infineon is currently the third largest provider of memory chips for personal comput-ers, PDAs, servers, and graphics cards ('DRAMs'). The formation of Infineon Tech-nologies Flash GmbH & Co. KG, paves the way for Infineon and Saifun to also ad-dress the burgeoning market for flash memory. In future, the joint venture activity will enable Infineon to integrate DRAM and flash expertise in new and innovative product generations. Infineon Flash stems from the Ingentix joint venture set up in 2001 by Infineon and the Israeli company Saifun. Infineon now holds 70 percent of the joint venture with headquarters in Dresden.
"Thanks to our well-proven 200-mm process technology, we are ideally equipped for the production of flash memory in Dresden. Infineon Flash intends to exploit In-fineon's outstanding manufacturing cost position in order to establish itself in the market for flash memory products", said Dr. Harald Eggers, responsible for the mem-ory business at Infineon, on the occasion of announcing Infineon Flash. "The DRAM products of Infineon and the flash products of the joint venture will be produced with the same equipment. We are now starting to set up a development centre for further products. It is planned to create around 40 new jobs in the near future in Dresden".
"The extension of our joint activity with Infineon is another course of making Saifun NROMä technology the technology of choice in the market for non-volatile memory", said Dr. Boaz Eitan, Saifun's President and CEO. "The synergy of Infineon produc-tion and marketing abilities with Saifun technology and R&D abilities is putting In-fineon Flash in a great position to become a leader in the flash market."
Flash memory products are also known as non-volatile memories, which reliably save the information they have stored even after the operating voltage has been turned off. Data flash memories are used as flexible data storage devices in mobile tele-phones, personal digital assistants (PDAs), digital cameras, MP3 players and nu-merous other products from the fields of entertainment electronics and industrial electronics. Program flash memories (or Code Flash) are used as memories for software in personal computers, mobile telephones and other electronic devices. Embedded flash memories are used to equip chipcards, which are increasingly utilised as cashcards and ID cards. Infineon has been market leader with its chipcard ICs in this field for many years.
Infineon Flash is managed jointly by Dr. Peter Kücher (CEO), who previously was responsible for Infineon's world leading 300-mm development and production, and by Ramy Langer (CMO) from Saifun who, prior to this engagement, held a position as Vice President Marketing and Sales at Tower Semiconductors.
"In the past, our agreements with Saifun focused on data flash memories. Now we can also develop, produce and market program flash products. Extending our flash activities in this way will allow us to win a major share of a growth market and signifi-cantly expand our portfolio in memory solutions", said Dr. Kücher.
"By setting up the company Ingentix in 2001, international customer relationships were already established, and will be utilised by Infineon Flash. The first customers are currently being supplied with product samples of 64 MB flash memories", said Ramy Langer.
Market researchers are predicting the worldwide market for flash memory of just un-der Euro 8 billion in 2002 will grow by an annual rate of 10 percent up to 2006.
The key driving forces for the growth of flash memories are increased use in mobile telephones and the rising demand in portable computers and digital cameras for transportable and integrated memories, which also retain their contents without volt-age.
Volume production of the first data flash memories is scheduled to start in the second half of 2003 in Dresden. The first program flash memories will subsequently follow in early 2004. Infineon Flash not only produces the chips for the flash memory itself, but also the necessary controller chips, which are designed and tested by Infineon Flash Ltd., located at Netanya in Israel.
The extension of the flash activities is another example of Infineon's commitment to Saifun's NROM technology. This technology stores two information units (bits) inside one cell and, as such, permits the construction of particularly small chips, which only use minimal electrical power. Compared to other flash memory technologies only NROM can be used for both data and program flash memories. Another advantage of NROM is the lower process complexity and NROM by this builds a profound basis for a sustained market entry in the flash memory market.
Infineon Expands in China: New Joint Venture with Chinese CSVC for the Assembly and Testing of IC Products
Monday July 28, 2:35 am ET
http://biz.yahoo.com/bw/030728/275018_1.html
MUNICH, Germany & SUZHOU, China--(BUSINESS WIRE)--July 28, 2003--Infineon Technologies AG (FSE/NYSE: IFX) and the China-Singapore Suzhou Industrial Park Venture Co. (CSVC), Ltd, Suzhou, China, are setting up a joint venture for the assembly and testing of memory ICs (backend). The agreement provides for the construction of a joint facility in the Suzhou Industrial Park (SIP), 80 km to the west of Shanghai. Once completed, the facility will have a maximum capacity of up to one billion chips a year. The new company will operate under the name Infineon Technologies Suzhou Co., Ltd. Infineon holds 72.5 percent of the shares of the joint venture and CSVC the remainder 27.5 percent.
The new facility will be developed in a number of stages as dictated by growth and trends in the global semiconductor market. Total planned investment in the project over the next ten years amounts to around US$ 1 billion with the registered capital being US$ 333 million. Infineon will contribute US$ 241,4 million over the next five years as equity. CSVC will contribute US$ 91,6 million. The initial tranches are sufficient to ensure completion of the first stages of development including construction of the building, facilities, infrastructure and the first cost-intensive equipment. Any further investment would be mostly required for additional equipment. It is expected that the joint venture will finance this externally. When operating at full capacity Infineon Suzhou will employ over 1,000 people.
"With this partnership we are systematically expanding our presence in the future market of China, we will gain access to new customers, and aim to capture a 40 percent share of the market for memory products in China," said Infineon President and CEO Dr. Ulrich Schumacher. "Overall, we intend to secure in China a place among the top four in the microelectronics business with a market share of more than 10 percent within the next five years. By then we will have about 3,300 employees in China."
The formation of the joint venture expands Infineon's portfolio of high volume sites for memory product backends, chiefly Porto/Portugal and Malacca/Malaysia. The continuous growth in frontend capacities (introduction of 300 mm technology, cooperation ventures with Winbond, SMIC and Nanya) necessarily entails an expansion of capacity for backend production.
Work on constructing the new facility is scheduled to begin in October 2003 and the site should be ready for the equipment installation by mid-2004. Volume production is slated to commence in early 2005. The joint venture company will start by producing 256 Mbit devices in BGA packages. The wafers for further processing will come primarily from the collaborative projects with SMIC (Shanghai, China), Winbond and Nanya (both in Taiwan), but shipments from Dresden, Germany, and Richmond, USA, are also planned.
About the IC Chips Manufacturing
Chip manufacture involves two main processes. The chips are first created on silicon wafers in the frontend by a series of complex processes. The silicon wafers containing the finished chips are then diced in the backend process and the resulting chips assembled into packages and tested. The components thus produced enable straightforward assembly of the chips on printed circuit boards.
About Infineon in China
Infineon is represented at six locations in China: Wuxi (manufacturing), Xi'an (R&D), Beijing, Shanghai, Shenzhen and Hong Kong (all for sales and marketing). Infineon's initial business operations were established in Beijing in 1995. At present, about 800 employees are working for Infineon in China. The company's China headquarters is in Shanghai. In March 2003, Infineon has expanded its successful production cooperation for standard memory chips (DRAMs) with SMIC, Shanghai. Infineon transfers now its advanced production technology as well as its 300mm process. In return, SMIC will manufacture products in these technologies exclusively for Infineon.
The analyst described the outlook as "unusually optimistic..
Dow Jones Business News
Infineon Posts 3Q Loss, Gives Upbeat Outlook
Tuesday July 22, 3:51 am ET
By Taska Manzaroli
http://biz.yahoo.com/djus/030722/0351000560_1.html
BERLIN -- Infineon Technologies AG Tuesday posted a narrower-than- expected third-quarter loss and gave an unexpectedly upbeat outlook after its memory-chip business returned to profit.
Europe's second-largest semiconductor maker said its net loss in the three months through June was 116 million euros ($131.6 million), compared with a deficit of 76 million euros a year earlier and analysts' expectations of 185 million euros.
Sales rose 11% to 1.47 billion euros from 1.32 billion euros, exceeding estimates of 1.42 billion euros.
"We have seen first signs of a positive market trend in the last quarter and thus look forward with optimism for a stronger improvement of demand ... in the second half of calendar year 2003," Chief Executive Ulrich Schumacher said in a statement.
Like rivals, Infineon has been hurt by the prolonged slump in prices for dynamic random-access memory, or DRAM, chips. Memory chips contribute almost 40% of the Munich-based firm's sales, making it particularly susceptible to price swings.
The memory products division managed to generate earnings before interest and taxes of two million euros in the third quarter, confounding analysts' expectations for a loss. Sales rose 4% from a year earlier to 569 million euros.
Infineon attributed the improvement to a faster-than-expected productivity gain from 300mm production as well as it not having to make writedowns on inventory.
"We achieved profitability in our memory products group despite slightly declining average selling prices for DRAMs," Mr. Schumacher said. The company has reached 6,400 wafer starts per week with its 300mm volume production in Dresden, he added.
The company said memory chip demand has grown and prices have risen steadily since the start of June. It expects demand to develop positively, driven by increasing corporate replacement investments and the back-to-school season.
"The figures are actually pretty good, and the outlook is okay," said Heinz Stork, an analyst at Frankfurt-based brokerage Nols.
Another analyst at a Munich-based bank agreed, saying that the results were " significantly better than expected by the market," particularly in the memory division.
The analyst described the outlook as "unusually optimistic - they've been very cautious in the previous quarters." He's keeping his outperform rating and will raise his estimates.
In the non-memory chip activities, which make up 60% of sales, Infineon expects an improvement in both revenues and Earnings before interest and taxes, or Ebit, in the fourth quarter.
The secure mobile solutions division, which manufactures parts for mobile phones, posted a loss before interest and taxes of 17 million euros in the third quarter on sales of 387 million euros.
The wireline business had a loss of 99 million euros and revenues of 119 million euros. Most of the loss stemmed from a 68 million euro impairment charge related to the acquisition of Catamaran Communications.
The automotive and industrial unit continued in the black, posting Ebit of 49 million euros. The company said it expects weaker demand going forward, though this should be a seasonal effect. The Munich-based analyst said the outlook for this profitable division was one negative point in the results.
-By Taska Manzaroli, Dow Jones Newswires; 49 30 2888 410; taska.manzaroli@dowjones.com
Worldwide Chip Sales IFX goes UP to #7
...up 30% over a year ago.....
http://www.siliconstrategies.com/article/showArticle.jhtml?articleID=12802915
Meanwhile, Intel Corp. maintained its number one position among the worldwide top 10 semiconductor suppliers, with $12.21 billion in sales for the first half of 2003, up 3 percent over the like period a year ago.
Korea's Samsung Electronics Co. Ltd. remained in the second spot, with $4.13 billion in sales in the first half, up 6 percent from a year ago.
Japan's Renesas Technology Corp. made the top 10 rankings for the first time. Renesas--the joint chip venture between Hitachi Ltd. and Mitsubishi Electric Corp.--was the world's third largest IC maker in terms of sales in the first half of 2003, according to IC Insights. Renesas had sales of $4.09 billion in the first half, up 14 percent in the like period a year go.
Texas Instruments Inc. remained fourth with $3.794 billion in sales for the first half, up 16 percent over 2002. Japan's Toshiba Corp. retained the fifth spot with $3.66 billion in sales, up 27 percent.
STMicroelectronics Inc. remained in sixth with $3.321 billion in sales, up 15 percent, while Infineon Technologies AG and NEC Corp. switched places in the rankings.
Germany's Infineon jumped from 8th to 7th , with $3.261 billion in sales for the first half of 2003, up 30 percent from a year go.
But Japan's NEC fell from 7th to 8th , with $3.039 billion in sales, up 18 percent.
Philips Semiconductors re-entered the top 10 rankings, from the 11th spot to 9th with $2.572 billion in sales in the first half, up 5 percent. And Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), the foundry giant, remained in 10th place with $2.566 billion in sales, up 11 percent.
The real surprise was Motorola. The company's semiconductor sales declined 5 percent to $2.266 billion in the first half of 2003 over the first half of 2002. Its sales were $300 million less than TSMC. In fact, Motorola was the only top-11 semiconductor company to register a 1H '03/1H '02 sales decline.
IFX gains in global market share 6 mo. of 2003 according to
SEMICO Research...........
http://www.siliconstrategies.com/article/showArticle.jhtml?articleID=12800691
Not in the article is IFX's much lowered cost of production
and the traction of the 50-50 JV between IFX & #5 Nanya on Tiawan ....................
<Germany's Infineon Technologies AG is closing the gap on Micron Technologies Inc. for the second spot, according to a report from Semico Research Corp. here today (July 16).>
<Samsung had 29.1 percent share in the first half, Micron had 21.2 percent, and Infineon garnered 18.5 percent, according to the report. For all of 2002, Samsung had 31.7 percent share, Micron had 18.5 percent, and Infineon had 12.9 percent, according to the report.
Rounding out the top DRAM rankings for the first half of 2003 were Hynix (15.3 percent), Nanya (4.9 percent), Elpida (3.5 percent), Winbond (2.6 percent), ProMos (2.2 percent), and Powerchip (2.1 percent).
Infineon appears to be the winner in the first half of 2003, said Semico's DRAM analyst, Matthew Godfrey. "Infineon has solidified its market position through aggressive management of its 12-inch production costs and a focus on high-end DDR333/400 memory," Godfrey said.
"The company has clearly broken away and is comfortably in the third position. We expect that a strong 2H03 could move Infineon even closer to Micron in market share," he said.>
MRAM & IFX/IBM Joint Venture 50% owned by each.
Evidently MRAM may well replace both DRAM and FLASH memory.
Interesting stuff. Is production just around the corner ?
http://www.altissemiconductor.com/prog/fr_altis_en.html
http://www.siliconstrategies.com/story/OEG20030527S0008
Article on WAVX that includes IFX
and others... Mention of IFX with a
older agreement copied from the wawx thread today
as the stock is hot today..
WAVX,INTC,MSFT,HP,NSM, IBM Highlighted in this article!
Reuters
UPDATE - Security underdog Wave Systems wins Intel pact
Thursday July 31, 6:22 pm ET
By Elinor Mills Abreu
(Recasts lead; adds details, background, byline; previous dateline NEW YORK)
SAN FRANCISCO, July 31 (Reuters) - Wave Systems Corp. on Thursday said Intel Corp. will use its software in future products, endorsing the company's novel way of securing digital content against theft and unauthorized copying.
ADVERTISEMENT
Wave (NasdaqNM:WAVX - News) shares rocketed 167 percent, or $1.41, to close at $2.25 on the news.
Under the agreement, Santa Clara, California-based Intel (NasdaqNM:INTC - News) will embed Wave's software in a future Intel motherboard -- the internal chassis that holds the chips and other circuitry used to run personal computers.
Financial terms were not disclosed.
Intel will introduce the new motherboard, designed for use in desktop business PCs, in the fourth quarter, said Intel spokeswoman Laura Anderson.
Wave will receive royalties on each motherboard sold, company spokesman John Callahan said.
Computers containing the embedded security chip and software will provide added levels of security. Windows software users will be able to encrypt their data, store it in a secure "vault" area of the hard drive and digitally "sign" electronic communications to confirm the authorship and origin, Callahan said.
SECURE, OR "TRUSTED," COMPUTING
The deal promises to accelerate the market for so-called "trusted computing," an industry-backed concept for protecting PCs from attackers or prying eyes. The technique relies on embedding security features into the chips that are at the core of data processing.
The concept was launched in 1999 by Trusted Computing Platform Alliance -- now known as the Trusted Computing Group -- consisting of Intel, Microsoft Corp. (NasdaqNM:MSFT - News), International Business Machines Corp. (NYSE:IBM - News) and Hewlett-Packard Co. (NYSE:HPQ - News). Scores of other tech companies have since joined the group.
The effort was met with resistance by cyber privacy and free speech advocates who complained that the system would be used not only to keep malicious hackers out, but to monitor, and eventually charge for, music, movies and even software consumers use.
Both Intel and Wave said their agreement has nothing to do with so-called "digital rights management," although Callahan said the Lee, Massachusetts-based Wave does sell products for that purpose.
Wave said it also has deals with National Semiconductor Corp. (NYSE:NSM - News) and Infineon Technologies AG (XETRA:IFXGn.DE - News) of Germany to bundle Wave's security software into a specialized chip.
The deals are a huge win for Wave, which has been "plugging away" on security products for the past five years or so after trying to sell wireless handheld devices before that market was fully ready, said Callahan.
Wave has illustrious backers. It was founded in 1988 by Peter Sprague, a former chairman at National Semiconductor whose son, Steven, is Wave's president and chief executive.
Wave's board of directors includes such luminaries as high-tech futurist George Gilder and Silicon pioneer Nolan Bushnell, who founded gamemaker Atari.
Shares of Intel rose 40 cents, or 1.6 percent, to close at $24.89 on Nasdaq.
(With additional reporting by Eric Auchard in New York.)
Ok...SPIN..
There are a few listings that turn up
which wouldn't suprise me as diverse
of a company as IFX is ...
here ya go ....
http://www.infineon.com/cgi/ecrm.dll/ecrm/scripts/search/advanced_search.jsp
Does Infineon have a relationship with Wave Systems?
MANY wavx shareholders have been claiming an extensive relationship with Infineon. A Wave exec (Brian Berger did actually speak at a recent Infineon event in Germany, fwiw).
The "wavoids" suggest that such a speaking engagement, inter alia, indicates a close relationship between the two in the area of Trusted Computing.
It's worth noting that Wave over its 14 year existence (in which, incredible as it might seem, has burned through around $250Mil & has generated about $250K in revs -- you read that right... $1000 dollars in accumulated losses per every dollar of revenue over the course of 14 years).
Wave might someday succed (they do say they have some things on the cusp of deployment, but then again, mgmt has a less than glowing history in this area & has made MANY claims to have the next-best-thing & somehow, none of them has ever been delivered).
& they definitely might not succeed (totally running out of money, did a death spiral-type preferred convert financing 04/03, have a 14A for their SHM under lengthy SEC scrutiny haven't yet re-scheduled a SHM (when it was originally scheduled for 8/4).
This is all in addition to a rather sketchy corporate governance history b/c despite being a public company, is run mouch more like a family business (which in essence, it is) Father & son & other less qualified son have been taking disproportionately large salaries, bonuses, options, founders shares, etc. In fact, Father stepped down from the company & @ same time the co. took a 100% reserve against a $1Mil "loan" it had granted him which he couldn't pay, supposedly b/c he has IRS liens against him... but somehow, he also allegedly was able (around the same time) to buy a company in his wife's name out from a bankruptcy estate). It goes on & on & on.
Some of the pessimists as to the existence of a relationship w/Infineon on the wavx RB bored were able to DD proof that the deployment of TPM products was solely from Inf & HP w/zero involvement from Wave. MANY "wavoids" would reply that there has to be an NDA there & mgmt isn't allowed to talk about it...
Any info that either supports or refutes this possible relationship b/tw Wave & Infineon would really be appreciated.
I think Inf's relationship w/HP is going to be profitable & that they have a first-mover advantage in the Trusted Computing market.
The "wavoids" say they still have some imaginary "first-mover" advantage in critical TPM areas such as attestation, but haven't announced the shipment of product unit one.
I think Infineon probably has a better chance of succeeding in this new field & especially with the first-to-deploy advantage w/HP.
This is NOT spamming another stock (be-lieve me, i'm not trying to promote WAVX in the least - I own it at a loss). it's been making lower lows & lower highs for years & is in danger of de-listing & i want to sell it, but not by those means.
I'm interested in other Trusted Computing players & that definitely includes Infineon & it is very relevant IMO if they are involved with Wave Systems.
TIA,
SPIN
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