BE Semiconductor Industries N.V. (Besi) is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries. The Company develops leading edge assembly processes and equipment for leadframe, array connect and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, RFID, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.

Our Customers

Our customers are primarily leading multinational chip manufacturers, assembly subcontractors and electronics and industrial companies and include Amkor, ASE, Gemalto, Greatek, Infineon, Skyworks, STATS ChipPAC, STMicroelectronics, Unisem and UTAC. Customers are principally independent device manufacturers ("IDMs") who purchase our equipment for internal use at their assembly facilities and subcontractors who purchase our equipment to produce packages for third parties on a contract basis. Our equipment performs critical functions in our customers' assembly operations and in many cases represents a significant percentage of their installed base of assembly equipment.

Our Global Presence

We are a global company with headquarters in Duiven, the Netherlands. We operate seven facilities comprising 490,000 square feet of space for production and development activities as well as nine sales and service offices across Europe, Asia and North America. We employ a total staff of approximately 1,400 people currently, of whom approximately 54% are based in Europe and North America and 46% are based in Asia.

Our Listings

Besi was incorporated under the laws of the Netherlands in May 1995 and had an initial public offering in December 1995. Besi's ordinary shares are listed on Euronext Amsterdam by NYSE Euronext (symbol: BESI) and also trade on the NASDAQ OTC pink sheets (symbol: BESIY).

Products & Services

Besi supplies leading edge systems offering increased productivity, improved yields of defect-free devices and a low cost of ownership. We offer customers a broad portfolio of systems which addresses substantially all the assembly process steps involved in leadframe, array connect and wafer level packaging. Our principal product offerings include: Die attach equipment: from which we produce single, multi-chip and flip chip die bonding systems and die sorting systems. Packaging equipment: from which we produce molding, trim and form and singulation systems. Plating equipment: from which we produce tin, copper and precious metal plating systems. Wire bonding equipment: from which we produce systems utilizing gold and copper wire. Services: for which we provide tooling, conversion kits and spare parts to our customers.

Datacon develops and produces high-precision assembly equipment for the semiconductor industry. http://www.datacon.at Esec supplies epoxy die bonders, soft solder die bonders and flip chip bonders, as well as wire bonding equipment. http://www.esec.com Fico develops and manufactures high-precision equipment for the semiconductor industry. http://www.fico.nl Meco Equipment manufactures and supplies plating systems to the semiconductor industry. http://www.meco.nl

 BE Semiconductor Ind AEX:BESI, NL0000339760