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Speaking of DD, Here is an amazing find showing 2013 Updates which shows CTKH is maintaining smart business & possibly giving us a hint that something big is coming...

http://patentsobserver.com/public/applicant/show.action?toShow=CETEK+CO+LTD&company=Cetek+Technologies+Inc



Cetek Technologies IncCETEK CO LTD

We have found 4 items

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Filter results:

Filling date range:

1987-01-01

2014-02-01

Status change range:

1987-01-01

2014-02-01

Applicants:CETEK CO LTD

IPC Classification:

H01L

H05K

Applicants

CETEK CO LTD

JOO YONG HUN

Authors

LIM EUN JAE

Kinds

A

B1

Countries

KR

CETEK CO LTD top competitors:

Cetek Technologies Inc

19 Commerce Street Poughkeepsie, NY 12603 United States

http://www.cetektechnologies.com

Cetek Technologies, Inc. manufactures ceramic components and electronic pack- aging. The products are sold to electronic equipment manufacturers through direct sales throughout the world.


More Statistics

Other -IPC

B1

KR 101246690

 

APPARATUS FOR MEASURING THERMAL WARPAGE

PURPOSE: An apparatus for measuring the thermal deformation of a semiconductor packaging product is provided to improve the precision of inspection by using a multi lens array module. CONSTITUTION: A heating apparatus changes the thermal property of a semiconductor packaging product. An elevating device moves the semiconductor packaging product. A multi lens array module(40) changes the light emitted from an illuminating device(30) into a multi-point beam. The multi lens array module irradiates the multi-point beam to the semiconductor packaging product. A camera(50) produces an image by using the multi-point beam.


IPC: H01L21/66 
Applicants: CETEK CO LTD,   
Authors: LIM EUN JAE, 

Last status change:2013-03-25/ Fill date:2012-11-02


PORTABLE WIRE BONDING TESTER


IPC: G01N3/08 H05K13/08 G01M99/00 G01N3/06 
Applicants: CETEK CO LTD,   
Authors: LIM EUN JAE, 

Last status change:2012-03-27/ Fill date:2010-04-02

DUST REMOVING APPARATUS ATTACHABLE TO WIRE BONDING EQUIPMENT
PURPOSE: A dust eliminating device which can be attached/detached to/from a wire bonding device is provided to effectively change an air spray location, thereby efficiently eliminating dust fro a chip pad which is loaded in a wire bonding device. CONSTITUTION: A mounting unit(20) can be attached/detached to/from a wire bonding device. A first guide member(30) is expanded from the mounting unit. A first mobile member(40) can slide on the first guide member. A second guide member(50) can slide on the first mobile member. A second mobile member(60) can slide on the second guide member.

IPC: H01L21/60
Applicants: JOO YONG HUN, CETEK CO LTD,
Authors: LIM EUN JAE, JOO YONG HUN,
Last status change:2011-07-29/ Fill date:2011-07-12

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Patents observer

Cetek Technologies Inc CETEK CO LTD
We have found 4 items
Clear filter
Filter results:
Filling date range:
From:...
To:...
1987-01-01
2014-02-01
Status change range:
From:...
To:...
1987-01-01
2014-02-01
Applicants:
CETEK CO LTD
IPC Classification:

H01L
H05K
Applicants

CETEK CO LTD
JOO YONG HUN
Authors

LIM EUN JAE
Kinds

A
B1
Countries

KR
CETEK CO LTD top competitors:

Cetek Technologies Inc logo
Cetek Technologies Inc
19 Commerce Street Poughkeepsie, NY 12603 United States
http://www.cetektechnologies.com
Cetek Technologies, Inc. manufactures ceramic components and electronic pack- aging. The products are sold to electronic equipment manufacturers through direct sales throughout the world.



More Statistics
Other -
IPC
B1
KR 101246690

APPARATUS FOR MEASURING THERMAL WARPAGE
PURPOSE: An apparatus for measuring the thermal deformation of a semiconductor packaging product is provided to improve the precision of inspection by using a multi lens array module. CONSTITUTION: A heating apparatus changes the thermal property of a semiconductor packaging product. An elevating device moves the semiconductor packaging product. A multi lens array module(40) changes the light emitted from an illuminating device(30) into a multi-point beam. The multi lens array module irradiates the multi-point beam to the semiconductor packaging product. A camera(50) produces an image by using the multi-point beam.

IPC: H01L21/66
Applicants: CETEK CO LTD,
Authors: LIM EUN JAE,
Last status change:2013-03-25/ Fill date:2012-11-02
Links:
link to EPO
B1
KR 20110111071

PORTABLE WIRE BONDING TESTER

IPC: G01N3/08 H05K13/08 G01M99/00 G01N3/06
Applicants: CETEK CO LTD,
Authors: LIM EUN JAE,
Last status change:2012-03-27/ Fill date:2010-04-02
Links:
link to EPO
A
KR 20110086679

DUST REMOVING APPARATUS ATTACHABLE TO WIRE BONDING EQUIPMENT
PURPOSE: A dust eliminating device which can be attached/detached to/from a wire bonding device is provided to effectively change an air spray location, thereby efficiently eliminating dust fro a chip pad which is loaded in a wire bonding device. CONSTITUTION: A mounting unit(20) can be attached/detached to/from a wire bonding device. A first guide member(30) is expanded from the mounting unit. A first mobile member(40) can slide on the first guide member. A second guide member(50) can slide on the first mobile member. A second mobile member(60) can slide on the second guide member.

IPC: H01L21/60
Applicants: JOO YONG HUN, CETEK CO LTD,
Authors: LIM EUN JAE, JOO YONG HUN,
Last status change:2011-07-29/ Fill date:2011-07-12
Links:
link to EPO
A
KR 20110024540

DISPENSER APPARATUS ENHANCING OUTLET PRECISION OF SILICON LIQUID
PURPOSE: A dispenser device improving the discharge precision of silicon liquid is provided to control the discharge amount with an error range below 1% of a target by improving the structure of a valve which opens and closes a silicon discharge nozzle. CONSTITUTION: A screw housing(34) receives silicon which is pressurized with a constant pressure from a storage tank. A screw(36) is rotatably installed in a screw housing. A motor is connected to the upper side of the screw and rotates the screw. A nozzle(38) is connected to the lower side of the screw housing. A planar blade type valve member(70) controls the flow of the silicon liquid which passes through the nozzle.

IPC: H01L21/00
Applicants: CETEK CO LTD,
Authors: LIM EUN JAE,
Last status change:2011-03-09/ Fill date:2009-09-02