Liquidmetal Technologies Inc (LQMT)

[Anax]

First time they use this slide in an investor presentation



http://ir.liquidmetal.com/phoenix.zhtml?c=130649&p=irol-presentations

Small Scale Casting (Micro Injection Molding) -> Micro-gear
Holograms, Nanoscale fabrication, Hot-forming (Stamping, Replication) -> Fuel cells, Heat sinks
Sheet, Extrusion, Wire Drawing (Twin-Roll-Casting)
3D Printing (Electron Beam Melting) -> Individual implants
Foam -> Micrometeoroid and orbital debris shielding (Sattelites, Spacecrafts)
Blow Molding
...

Just to name a few, but the list of applications is endless. If they master to commercialize injection molding, they will have a intellectual proprietary platform to build upon a nice diverse multi-billion $ business.

High Power dissipation (Micro- and nano- channel) Heat Sinks:

http://www.freepatentsonline.com/WO2013058754A1.html

[00089] "The embodiments herein further relate to a nano-replication of bulk-solidifying amorphous alloys with a mold like a stamping device that not like a die casting mold but more like a regular rubber stamp. So basically, one could have a stamp with the micro feature on the stamp, heat the stamp, press the stamp on a bulk-solidifying amorphous alloy and replicate the micro feature by embossing it directly on the surface of the bulk-solidifying amorphous alloy." (see Figure 4)

"Thus, by creating a tremendous amount of surface area one could create fine features with extremely high surface area one would be able to improve substantially the ability to dissipate heat."

"The major advantage of micro channel heat sinks is the high heat transfer coefficients would be up to 60 times higher than conventional heat exchangers"

[00070] Another heat sink material that can be used is diamond or diamond-like coating (also referred to as diamond-like carbon (DLC)). With a value of 2000 W/mK, the thermal conductivity of diamond exceeds that of copper by a factor of five. [...] The hardest, strongest, and slickest is such a mixture, known as tetrahedral amorphous carbon, or ta-C. For example, a coating of only 2 µ?? thickness of ta-C increases the resistance of common (i.e. type 304) stainless steel against abrasive wear; changing its lifetime in such service from one week to 85 years. (See Figure 3)

"For one of the experiments, micro-replications were formed on a zirconium based bulk- solidifying amorphous alloy in air, and as long as there was no oxide formation on the surface of the zirconium based bulk- solidifying amorphous alloy, there was no need to perform the process under vacuum or in the atmosphere because the process was so fast and the temperature was not that high to cause any degradation of the zirconium based bulk- solidifying alloy."

"One novel feature of the embodiments is that one can get rid of wet processing or laser processing as conventionally required for forming micro-replications on a metal surface. Right now in order for a manufacturer to create a micro-replication on a metal surface one needs to do it with either laser or etch the surface using the photo lithography process, which is a wet process. It is very difficult to laser a micro-replication on a metal surface because the surface needs to be smooth to reflect the light. Also, as the feature of the micro-replication has a depth, the laser has to etch up to the depth to create a micro-replication."

"The heat sink could have micro-channels to run a fluid such as water through it, and the combination of the cooling fan or thermoelectric cooling device with an amorphous coating or layer, the amorphous alloy heat dissipating fin set, the amorphous alloy heat sink, the amorphous alloy cover layer (if used), and the electronic device having an amorphous coating or layer could all be thermally bonded together by superplastic forming to form a unitary device shown in Figure 8 having both the electronic device and the heat sink. Such a heat sink would be cooled by both conduction running a liquid through the micro-channels and by convention by the cooling fan or thermoelectric cooling device mounted on the fin set."



Just imagine how much Heat will have to be dissipated in the future of microelectronics!!!